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New Frontiers in MEMS and Their Enablers

New Frontiers in MEMS and Their Enablers
by Pawan Fangaria on 05-11-2014 at 10:00 pm

With the 51[SUP]st[/SUP] DACapproaching quickly, I spent some time last week-end to look around about what new trends, technologies and innovations will be most talked about during DAC. Every year, I find some exciting new technologies in the semiconductor industry and the overall semiconductor ecosystem that get wider exposure… Read More


Is the Chief IoT Barrier Privacy?

Is the Chief IoT Barrier Privacy?
by Daniel Nenni on 05-11-2014 at 9:00 am

The World Affairs Council event, The Internet of Things: Global Implications of Merging the Physical and Digital Worlds, was hosted by Cadence last week. One thing I can tell you is that Cadence sure does know how to throw a party! They had me at free food and beer but the topic was also of great interest since my next project will involve… Read More


Mentor @ #51DAC Must See!

Mentor @ #51DAC Must See!
by Daniel Nenni on 05-11-2014 at 4:00 am

We’ve packed each day full of exciting activities focused on the latest in cutting-edge design. Use this site to find your favorite Mentor experts and events—whether in our suites and networking events, at our partner booths or in the conference. You won’t want to miss a thing!

Celebrating Your Design Creativity!
Rejuvenate with… Read More


Dassault #51DAC Assault!

Dassault #51DAC Assault!
by Daniel Nenni on 05-10-2014 at 9:00 pm

This is one of the most aggressive DAC appearances I have seen from Dassault, absolutely. Dassault Systèmes is branded as the: 3D EXPERIENCE Company that provides virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault … Read More


Selecting the Right Standard Cell & Memory for 28HPM DSP core: real case with CEVA XC4210

Selecting the Right Standard Cell & Memory for 28HPM DSP core: real case with CEVA XC4210
by Eric Esteve on 05-09-2014 at 11:14 am

Listening to a webinar at your desk, in front of a PC screen will never replace a live presentation, but the lesson learned to time spent ratio can be incredibly higher than when traveling to a conference to listen several presentation. If you are interested by the approach taken by a complex DSP design team to overcome the various … Read More


Analog and Full Chip Simulation at Micron

Analog and Full Chip Simulation at Micron
by Daniel Payne on 05-08-2014 at 12:50 pm

IDM companies like Micronuse SPICE circuit simulators during the design phase in order to predict timing, currents and power on their custom IC chip designs at the transistor level. A senior memory design engineer at Micron named Raed Sabbahtalked today at a webinarabout how the embedded solutions group uses the FineSimcircuit… Read More


What Executives Say About IP Licensing

What Executives Say About IP Licensing
by Pawan Fangaria on 05-08-2014 at 7:00 am

In the fabless world of semiconductor design, IP components have become indispensable partners and have enabled the development of complex billion gate SoCs. IP business in general is exhibiting a very high growth rate since couple of years and it is going to increase; the same is being reflected by a growing number of IP vendors… Read More


Intel is Still Missing Mobile!

Intel is Still Missing Mobile!
by Daniel Nenni on 05-07-2014 at 9:00 am

Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More


The Matrix, your ultimate OPC

The Matrix, your ultimate OPC
by Beth Martin on 05-06-2014 at 12:47 pm

One of the many consequences of shrinking process nodes is that traditional OPC can no longer achieve good pattern fidelity with reasonable turn-around-time. But there is a solution; we made it ourselves and call it matrix OPC.

First, let’s explore the problems with traditional optical proximity correction (OPC) when applied… Read More


IC Power Noise Reliability for FinFET Designs

IC Power Noise Reliability for FinFET Designs
by Daniel Payne on 05-06-2014 at 9:07 am

Reliability for ICs is a big deal because the last thing that you want to do is ship a new part only to find out later in the field that there are failures not being caught by testing. I’ve already had two consumer products fail this year because of probable reliability issues: My MacBook Pro with 16GB of RAM started rebooting caused… Read More