Almost anyone that is active in IC design will be “in touch” with Electrostatic Discharge (ESD) at some time (pun intended). Preventing ESD related IC failures remains something like black magic—at least it’s easy to get that feeling when you are trying to debug ESD failures. I/O and ESD layouts that resulted in excellent robustness… Read More
By Jeff Wilson, Mentor Graphics
We’ve talked about the new requirements for Fill in IC design for advanced nodes in previous blogs on this site. This time I’d like describe the fill solution that Mentor and TSMC have jointly developed to meet the requirements of fill for TSMC’s 20nm (N20) manufacturing process.
The traditional… Read More
The growing amount of electronics within today’s automobiles is driving very high quality and reliability requirements to a widening range of semiconductor devices. At the same time, traditional fault models are becoming less effective at achieving desired silicon quality levels. Improvements in test solutions are needed… Read More
April 25, 2013, San Jose, CA
Click here to register.
Come hear Mentor Graphics CEO, Wally Rhines, 2013 Kaufman Award Winner,Chenming Hu, and Xilinx Senior VP,Victor Peng, at the User2User Conference in San Jose.
Organizing by Design
9:00am – 9:50am
Walden C. Rhines | CEO & Chairman | Mentor Graphics
Winning products… Read More
TSMC will host their annual technology symposium at several locations in the U.S. on April 9th in San Jose, April 16th in Austin, and April 23rd in Boston. TSMC will discuss the market outlook, design enablement, and technology for high-speed computing, mobile communications, connectivity and storage, CIS, embedded flash, … Read More
This year’s Mentor Graphics user group meeting, User2User, will be held at the DoubleTree by Hilton in San Jose, California on April 25, 2013. The featured keynote presenters include…
- Dr. Walden C. Rhines, CEO and Chairman of Mentor Graphics, talking about “Organizing by Design”
- Victor Peng, Senior VP, Xilinx presenting on “The
The fabless revolution in the digital semiconductor industry is no more, with just a few integrated device manufacturers (IDMs) remaining on the playing field, it is now the normal way to do business. However, the learning curve for each new process node continues as it always has, with a host of new technical challenges for the … Read More
While the SPIE Advanced Lithography conference is best known for IC manufacturing, computational lithography, mask preparation and other back-end topics, there is also a significant amount of interest in Design for Manufacturing (DFM) at the conference because some litho issues are best (or only) addressed by modifying the… Read More
At TSMC’s Open Innovation Platform (OIP) Ecosystem Forum, Mentor made technical presentations on four different topics, two of them co-presented with TSMC and LSI Corporation. Those presentations are described below with links to downloadable pdf presentation files.
Finding and Fixing Double Patterning Errors in… Read More
Since the beginning of the semiconductor industry, improving the rate of yield learning has been a critical factor in the success silicon manufacturing. Each fab has dedicated yield teams that look at the yield of wafers manufactured the previous day and attempt to find the root cause of any unexpected “excursions.” In earlier… Read More