Software engineers and firmware designers can find bugs, update their code and re-distribute to the users. In the consumer electronics world this means that my smart phone apps get updated, and my Android OS gets updated on a somewhat regular basis, however on the hardware side the design and verification of an SoC must be close … Read More
Author: Daniel Payne
CTO Interview with Dr. Wim Schoenmaker of Magwel
I visited the Magwel booth at DAC in June and chatted with Dundar Dumlugol the CEO about their EDA tools that enable 3D co-simulation and extraction. Since then I’ve made contact with their CTO, Dr. Wim Schoenmaker to better understand what it’s like to start up and run an EDA company. Magwel’s history goes back… Read More
Design Rule Checking (DRC) Meets New Challenges
The traditional batch-oriented DRC process run as a final check to ensure compliance with foundry yield goals is quickly moving toward a concurrent DRC process performed early and often throughout design, especially at the 28 nm and smaller process nodes. What are the technology factors causing this change?
- Increasing number
How to Optimize for Power at RTL
Last week I was traveling in Munich attending the MunEDA User Group meetingso I missed a live webinar on the topic of optimizing for power at RTL. I finally got caught up in my email this week and had time to view this 47 minute webinar, presented by Guillaume Boilletof Atrenta. He recommended using a combination of automatic, semi-automatic… Read More
IC Place and Route for AMS Designs
High-capacity IC place and route (P&R) tools can cost $200K and more to own from the big three vendors (Cadence, Synopsys, Mentor), but what about IC designs that are primarily Big Analog and Little Digital? In the EDA world we often have multiple choices for tools, and there are affordable alternatives to place and route out… Read More
IC Design at ZMDI
As a blogger I have the privilege of meeting many IC designers from around the world, mostly through contact on LinkedIn or from connecting at trade shows. Through a contact at DACI met up with Achim Graupner, a manager of methodology and design automation from ZMDI, then asked him for an interview to understand how his group does … Read More
Transistor-Level IC Design is Alive and Thriving
There’s much talk in EDA about High Level Synthesis (HLS), Transaction Level Modeling (TLM) and the Universal Verification Methodology (UVM), however there’s a lower-level of abstraction, the transistor-level, where high-speed digital cell libraries are created, analog circuits are crafted, and AMS designers… Read More
Leakage Current TCAD Calibration in a-Si TFTs
Two weeks ago I blogged about amorphous silicon and how that material is well-suited for designing TFTs. Today I’m following up after watching the archived webinarpresented by Nam-Kyun Tak of Silvaco. After clicking on that link you’ll be brought to a brief sign-up page and then can watch the archived webinar in your… Read More
Simulation and Analysis of Power and Thermal Management Policies
Earlier this month I blogged about Power Management Policies for Android Devices, so this blog is part two in the series and delves into the details of using ESL-level tools for simulation and analysis. The motivation behind all of this is to optimize a power management system during the early design phase, instead of waiting until… Read More
Using Cadence PVS for Signoff at TowerJazz
TowerJazzis a specialty foundry that provides IC manufacturing into several markets, like: RF, high-performance analog, power, imaging, consumer, automotive, medical, industrial and aerospace/defense. In June there was a presentation from Ofer Tamir of TowerJazz at DACin the Cadence theatre, so I had a chance this week … Read More
Facing the Quantum Nature of EUV Lithography