It constantly amazes me at how much FGPA companies like Xilinx have done to bring ARM-based CPUs into a programmable SoC along with FPGA glue logic. Xilinx offers the Zynq 7000 and Zynq UltraScale+ SoCs to systems designers as a way to quickly get their ideas into the marketplace. A side effect of all this programability and flexibility… Read More
Author: Daniel Payne
ARM, Infineon, Synopsys, SK Hynix talk AMS Simulation
Every SoC that connects to an analog sensor or device requires AMS (Analog Mixed-Signal) circuit simulation for design and verification, so this year at #54DAC the organizers at Synopsys hosted another informative AMS panel session over lunch time on Monday. What makes this kind of panel so refreshing is that the invited speakers… Read More
DAC 2017: How Oracle does Reliability Simulation when designing SPARC
Last week at #54DAC there was a talk by Michael Yu from the CAD group of Oracle who discussed how they designed their latest generation of SPARC chips, with an emphasis on the reliability simulations. The three features of the latest SPARC family of chips are:
- Security in silicon
- SQL in silicon
- World’s fastest microprocessor
An Approach to TFT and FPD Design
Webinars are a powerful way for engineers to get updated on EDA and IC design approaches, so I’m sharing what I viewed last month at a Silvaco webinar on TFT and FPD design. You probably are using a TFT LCD display in your TV, monitor, mobile phone, video game system, GPS device or projector. The custom IC design flow offered by… Read More
AI Being Used from Probing to Simulation
The 54th annual DAC event is fast approaching, so I hope to see many of you in Austin on June 18-21. The phrases Machine Learning and AI are growing in all areas of software, so I’m glad to see it appearing in more EDA tool offerings over the past year or so. One company that I plan to visit at DAC is Platform Design Automation because… Read More
TCAD for TFT, LCD and OLED Displays
As I write there are multiple displays in front of me that use TFT, LCD or OLED displays:
- ViewSonic Monitors with 24″ display
- MacBook Pro with 15″ display
- iPad Air
- Samsung Galaxy Note 4
- Nexus 7 tablet
- Garmin Edge 820
Webinar -New Concepts in Semiconductor IP Lifecycle Management
The semiconductor IP market continues growing at a healthy rate, and IP reuse is a staple of all modern SoC designs. Along with the acceptance of IP reuse comes a host of growing challenges, like:
- Increase in design files
- Increase in meta-data
- More links between design members worldwide
- More links between data in multiple engineering
Time is Money, Especially when Testing ICs
Semiconductor companies are looking for ways to keep their business profitable by managing expenses on both the design and test side of electronic products, which is quite the challenge as the trends show increases in test pattern count and therefore test costs. Scan compression is a well-known technique first created over 15… Read More
Understanding ISO 26262 Compliance for Automotive Suppliers
The semiconductor, IP, Software and EDA industries are all focusing on the growing automotive market because of its electronic content, size and growth. There are long-time suppliers to the automotive industry, and also first-time vendors that are launching something new every week for electronics in automotive. So where … Read More
Electrothermal Analysis of an IC for Automotive Use
Automotive ICs have to operate in a very demanding environment in terms of both temperature and voltage ranges, along with the ability to withstand g-forces and be sealed from the elements. Not an easy design challenge. For many consumer ICs we see output drive currents on the IO pins measured in mA, however in automotive if you want… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet