HW and SW Co-verification for Xilinx Zynq SoC FPGAs

HW and SW Co-verification for Xilinx Zynq SoC FPGAs
by Daniel Payne on 07-03-2017 at 12:00 pm

It constantly amazes me at how much FGPA companies like Xilinx have done to bring ARM-based CPUs into a programmable SoC along with FPGA glue logic. Xilinx offers the Zynq 7000 and Zynq UltraScale+ SoCs to systems designers as a way to quickly get their ideas into the marketplace. A side effect of all this programability and flexibility… Read More


ARM, Infineon, Synopsys, SK Hynix talk AMS Simulation

ARM, Infineon, Synopsys, SK Hynix talk AMS Simulation
by Daniel Payne on 06-28-2017 at 12:00 pm

Every SoC that connects to an analog sensor or device requires AMS (Analog Mixed-Signal) circuit simulation for design and verification, so this year at #54DAC the organizers at Synopsys hosted another informative AMS panel session over lunch time on Monday. What makes this kind of panel so refreshing is that the invited speakers… Read More


DAC 2017: How Oracle does Reliability Simulation when designing SPARC

DAC 2017: How Oracle does Reliability Simulation when designing SPARC
by Daniel Payne on 06-27-2017 at 12:00 pm

Last week at #54DAC there was a talk by Michael Yu from the CAD group of Oracle who discussed how they designed their latest generation of SPARC chips, with an emphasis on the reliability simulations. The three features of the latest SPARC family of chips are:

  • Security in silicon
  • SQL in silicon
  • World’s fastest microprocessor
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An Approach to TFT and FPD Design

An Approach to TFT and FPD Design
by Daniel Payne on 06-12-2017 at 4:00 pm

Webinars are a powerful way for engineers to get updated on EDA and IC design approaches, so I’m sharing what I viewed last month at a Silvaco webinar on TFT and FPD design. You probably are using a TFT LCD display in your TV, monitor, mobile phone, video game system, GPS device or projector. The custom IC design flow offered by… Read More


AI Being Used from Probing to Simulation

AI Being Used from Probing to Simulation
by Daniel Payne on 06-06-2017 at 12:00 pm

The 54th annual DAC event is fast approaching, so I hope to see many of you in Austin on June 18-21. The phrases Machine Learning and AI are growing in all areas of software, so I’m glad to see it appearing in more EDA tool offerings over the past year or so. One company that I plan to visit at DAC is Platform Design Automation because… Read More


Webinar -New Concepts in Semiconductor IP Lifecycle Management

Webinar -New Concepts in Semiconductor IP Lifecycle Management
by Daniel Payne on 05-26-2017 at 7:00 am

The semiconductor IP market continues growing at a healthy rate, and IP reuse is a staple of all modern SoC designs. Along with the acceptance of IP reuse comes a host of growing challenges, like:

  • Increase in design files
  • Increase in meta-data
  • More links between design members worldwide
  • More links between data in multiple engineering
Read More

Time is Money, Especially when Testing ICs

Time is Money, Especially when Testing ICs
by Daniel Payne on 05-24-2017 at 12:00 pm

Semiconductor companies are looking for ways to keep their business profitable by managing expenses on both the design and test side of electronic products, which is quite the challenge as the trends show increases in test pattern count and therefore test costs. Scan compression is a well-known technique first created over 15… Read More


Understanding ISO 26262 Compliance for Automotive Suppliers

Understanding ISO 26262 Compliance for Automotive Suppliers
by Daniel Payne on 05-18-2017 at 12:00 pm

The semiconductor, IP, Software and EDA industries are all focusing on the growing automotive market because of its electronic content, size and growth. There are long-time suppliers to the automotive industry, and also first-time vendors that are launching something new every week for electronics in automotive. So where … Read More


Electrothermal Analysis of an IC for Automotive Use

Electrothermal Analysis of an IC for Automotive Use
by Daniel Payne on 05-16-2017 at 12:00 pm

Automotive ICs have to operate in a very demanding environment in terms of both temperature and voltage ranges, along with the ability to withstand g-forces and be sealed from the elements. Not an easy design challenge. For many consumer ICs we see output drive currents on the IO pins measured in mA, however in automotive if you want… Read More