In college I took courses in physics, calculus, chemistry and electronics on my way to earn a BSEE degree, then did an 8 year stint as a circuit designer, working at the transistor level and interacting with fab and test engineers. My next adventure was working at EDA companies in a variety of roles. As a circuit designer I knew that … Read More
Author: Daniel Payne
1st Annual International Conference, Semiconductors ISO 26262
When we talk about the promise of ADAS and autonomous cars then along the way we also hear about this functional safety standard called ISO 26262 which semiconductor companies all pay close attention to. I recently learned about a new conference called Semiconductors ISO 26262, scheduled for December 5-7 in Munich, Germany. The… Read More
Silicon Creations talks about 7nm IP Verification for AMS Circuits
Designing at 7nm is a big deal because of the costs to make masks and then produce silicon that yields at an acceptable level, and Silicon Creations is one company that has the experience in designing AMS IP like: PLL, Serializer-Deserializer, IOs, Oscillators. Why design at 7nm? Lots of reasons – lower power, higher speeds,… Read More
Rethinking IP Lifecycle Management
We recently saw both Apple and Samsung introduce new smart phones, and realize that the annual race to introduce sophisticated devices that are attractive and differentiated is highly competitive. If either of these companies misses a market window then fortunes can quickly change. SoCs with billions of transistors like smart… Read More
Webinar on Electrochemistry and how it affects Semiconductor devices
My educational background is Electrical Engineering and I’ve learned a lot since starting in the industry back in 1978 while working on bipolar, NMOS and CMOS technology, designing DRAM, data controller and GPU devices. I continue to learn about the semiconductor industry through daily reading and attending trade shows… Read More
What’s New with the I3C Standard
This month we’ve seen both Apple and Samsung announce their newest, flagship smart phones, and they each have an incredible number of sensors and components included like: … Read More
Portable Stimulus Standard, What’s New from Cadence
I’ve been hearing about the Portable Stimulus Standard (PSS) since DAC 2016, so it’s helpful to get an update from EDA vendors on what their involvement level is with this emerging standard and how they see it helping design and verification engineers. Earlier in September I scheduled a conference call with Cadence… Read More
Improved Memory Design, Characterization and Verification
My IC design career started out with DRAM design, characterization and verification back in the 1970’s, so I vividly recall how much SPICE circuit simulation was involved, and how little automation we had back in the day, so we tended to cobble together our own scripts to help automate the process a bit. With each new process… Read More
Semiconductor Device Physics, Lab in a Box
One of my favorite classes in college was the lab exercise, mostly because we actually got to use real electronics and then measure something, finally writing it up in our lab notebooks. The issue today is that a college student taking Electrical Engineering probably doesn’t have much access to 10nm FinFET silicon for use… Read More
Webinar: Mobile Device Companies Get New Sensor Interconnect Standard
I’ve been a mobile device user since the 1980’s when the Motorola brick phone was introduced, so I’ve seen an increasing amount of sensors added to each new generation of mobile phones over the years. One big challenge to both sensor companies and fabless semiconductor companies designing SoCs for mobile devices… Read More






CES 2026 and all things Cycling