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Chinese media given tour of Intel Fab 52: here are their notes

Fred Chen

Moderator
In August 2023, Fast Technology was one of only four Chinese media outlets to visit Intel's packaging and testing factory and laboratory in Malaysia , and gained an early understanding of the architectural design and technical features of the new Core Ultra (Meteor Lake) processor.

Recently, Fast Technology came to Phoenix, Arizona, USA, and visited Intel's Fab wafer factory there. It was the first time for us to get close to the advanced EUV lithography machine and 18A process line, which made up for the regret of not being able to go to the Israeli wafer factory during the epidemic.

In fact, this is also the first time that the factory has been open to the media, especially Fab 52 which has just been put into production.

Let’s first understand the background of Intel’s Arizona wafer factory.

Intel's journey in Arizona began in 1979, with operations in Chandler the following year, initially focusing on manufacturing and assembly.

Over the past 46 years, Intel has invested more than $50 billion in Arizona, making it one of the largest private companies and a significant contributor to the economy, making it a major global semiconductor manufacturing center.

Intel's Ocotillo Campus in Arizona, covering a total area of approximately 2.6 square kilometers
, is located at the southern end of the Price Road Corridor and is one of the most popular industrial development locations in the valley.

Interestingly, this was once the Bogle family farm, covering an area of 2.8 square kilometers. It was acquired by Intel in the early 1990s, and there are still large areas of farmland and communities across the road from the park.

There are multiple wafer fabs in the park, which is the largest number of Intel worldwide:

Fab 12 : It was started in the 1990s and put into production in 2006. It was one of Intel's most advanced manufacturing plants at the time and currently mainly produces 22/14/10mm.

Fab 22 : Construction started in 1996 and put into production in 2002, mainly producing 22/14/10mm.

Fab 32 : Built in the early 21st century and put into production in 2007, it further expanded its production capacity and mainly produces 22/14/10mm.

Fab 42 : Construction started in 2011, was suspended for a while, and resumed in 2017 with an investment of US$7 billion. It was put into production in 2020, mainly producing 10nm and Intel 3.

Fab 52/62 : Part of Intel's IDM 2.0 strategy and continued expansion plan, with related investment of US$32 billion.

Among them, Fab 52 started construction in 2021 and has recently been fully put into operation. It has an EUV lithography machine and is about to mass-produce the most advanced 18A; Fab 62 just started construction in 2024 and will produce 14A in the future.

Each building here is named in the format of OCxx, where xx is a number starting from 1.

You may have noticed that the factory numbers in Arizona all end with the number 2 , which is also a tradition.

Intel's early wafer fabs were named sequentially, from the original Fab 1 to Fab 12, and then Arizona retained the name ending with 2.

All the numbers in New Mexico end in 1 (Fab 11/11X), all the numbers in Ireland end in 4 (Fab 14/24/34), all the numbers in Israel end in 8 (Fab 28/38), and all the numbers in Ohio will end in 7 (Fab 27 is under construction). Oregon, because it focuses on research and development, uses three letters + numbers (D1B/D1C/D1D/D1X/RB1/RP1, etc.).

There is only one exception here, which is the NAND flash memory wafer factory in Dalian, China, named Fab 68 for good luck, and now it has been completely sold to SK Hynix.

Today, the construction of a standard processor wafer fab typically takes 3-5 years or even longer and costs at least $20-25 billion.

During the construction of Fab 52, more than 1 million cubic meters of earth and rock were excavated, enough to fill 400 Olympic-standard swimming pools, and approximately 600,000 cubic meters of concrete were poured; 75,000 tons of steel bars were used, twice the amount of the world's tallest building, the Burj Khalifa in Dubai; 35,000 tons of structural steel were erected, five times the amount of the Eiffel Tower; and 9 million meters of cables and other pipelines were laid, equivalent to 214 full marathons.

At the same time, Intel has always attached great importance to environmental protection, especially in Arizona, which is seriously short of water. It has invested a lot of money in water treatment and water recycling in the factory area, and cooperated with the local government to build a water treatment facility covering an area of 48,600 square meters.

Among them, the Ocotillo Brine Reduction Facility (OBRF) is mainly used to remove salt from water before further treatment. It can process and recycle 340,700 cubic meters of water per day , and eventually return it as a high-purity water source for factory production.

Currently, Intel has achieved "water-positive" in Arizona, and as of 2023, it has restored 41.64 million cubic meters of water resources to the local area.


(to be continued)
 
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(continued)

Unfortunately, as I'm sure everyone can understand, taking photos or videos is not allowed inside Intel's wafer factory. Here I can only share some photos and videos provided by Intel officials and briefly talk to you about your impressions.

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

This time we visited Fab 42 and Fab 52. The first impression when we walked in was that they were not very big and were much smaller than the packaging and testing factories we saw in Malaysia.

It’s actually very easy to understand.

Although the work of the Fab factory is the most core and technically demanding part of the entire process from sand to chip, which is "printing wafers", the number of steps required is not too many.

It is particularly worth mentioning that although Fab is generally called a wafer factory, it does not actually produce wafers itself. Instead, it obtains original bare wafers directly from suppliers and performs pre-processing, photolithography, etching, doping, metallization, etc. here. In other words, it is more appropriate to call it a "wafer processing plant."

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

The lithography machine that everyone is most familiar with and concerned about is only responsible for one of the steps. It is important but not all, so there is no need to go into too much detail.

Of course, standing in front of the lithography machine in person, the shock that comes over you is still indescribable. After all, it is a shining industrial pearl.

For example, Fab 52 houses one of the most advanced EUV lithography machines in Arizona . On one side are other DUV lithography machines, and on the other side are two empty spaces reserved for the installation of two new EUV lithography machines later.

Of course, as equipment such as lithography machines become more and more advanced and complex, their size and weight have also expanded rapidly. The ceiling of Fab 52 is obviously much higher than that of Fab 42. In fact, it is also much deeper, because there are several floors underground, where there are equipment support platforms, water and electricity pipelines, air handling and transportation equipment and pipelines (I believe everyone knows the strict requirements of clean rooms).

Most of the old wafer fabs in the Ocotillo Park have undergone upgrades and renovations, and many have had to be raised and deepened for this reason.

As for the latest High-NA EUV lithography machine, it is currently deployed in Oregon for research and testing, and will be stationed in Fab 62 for mass production of 14A in the future.

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

Interestingly, every lithography machine in the Intel factory has a nickname and a pattern corresponding to the nickname is printed on it.

Doing so is not only romantic, but also practical. This is because the factory is very noisy. When engineers in different positions need to perform related operations on a lithography machine, it is easy to hear unclearly and cause misoperation if only the model number is said, so they all have special names.

By the way, it is not rigorous to say that a lithography machine is of xxnm process. The two cannot be directly equated . It can only be said that a lithography machine can produce xxnm chips. For example, this NEX:3800E can produce 3/2nm processors and advanced DRAM memory chips.

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

Another impressive thing in the Fab is the tray boxes that carry and transport wafers. They are fixed on different intricate tracks on the roof of the factory, moving back and forth at a very fast speed to deliver the wafers to the right place.

All of this is managed automatically and requires no human intervention. In fact, there are very few people in the entire factory, and all the machines and equipment operate precisely on their own.

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

Interestingly, photos of the interior of various chip factories show different colors of light, such as yellow, orange, etc.

However, Intel engineers told us that historically this was done to protect equipment and chips from light-sensitive damage, but as process technology becomes more advanced, the impact of light is actually not that significant, and retaining this style is more of a tradition.


Finally, the wafers coming out of the Fab factory will be sent to packaging and testing factories around the world to continue the subsequent steps of preparation, sorting, mounting, coating, covering, assembly, screening, testing, verification, etc. until they are delivered to consumers.

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

When EUV lithography is just around the corner! Intel Arizona wafer factory travel notes

 
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Another Chinese media outfit was also invited.

 
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