The annual ITC event was held the last week of September, and I kept reading all of the news highlights from the EDA vendors, as the time spent on the tester can be a major cost and the value to catching defective chips from reaching production is so critical. Chiplets, 2.5D and 3D IC design have caught the attention of the test world, … Read More
Author: Daniel Payne
DFT Moves up to 2.5D and 3D IC
Analyzing Clocks at 7nm and Smaller Nodes
In the good old days the clock signal looked like a square wave , and had a voltage swing of 5 volts, however with 7nm technology the clock signals can now look more like a sawtooth signal and may not actually reach the full Vdd value of 0.65V inside the core of a chip. I’ll cover some of the semiconductor market trends, and then challenges… Read More
Webinar: Post-layout Circuit Sizing Optimization
My IC design career started out with manually sizing transistors to improve performance, while minimizing layout area and power consumption. Fortunately we don’t have to do manual transistor sizing anymore, thanks to EDA tools that are quicker and more accurate than manual methods. MunEDA is an EDA vendor that has developed… Read More
New ECO Product – Synopsys PrimeClosure
New EDA product launches are always an exciting time, and I could hear the energy and optimism from the voice of Manoj Chacko at Synopsys in our Zoom call about Synopsys PrimeClosure. During the physical implementation phase for IC designs there’s a big challenge to reach timing closure, and with advanced nodes the number… Read More
3D IC – Managing the System-level Netlist
I just did a Google search for “3D IC”, and was stunned to see it return a whopping 476,000 results. This topic is trending, because more companies are using advanced IC packaging to meet their requirements, and yet the engineers doing the 3D IC design have new challenges to overcome. One of those challenges is creating… Read More
Die-to-Die Interconnects using Bunch of Wires (BoW)
Chiplets are a popular and trending topic in the semiconductor trade press, and I read about SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the next challenge is deciding on the die-to-die interconnect approach. The Open Compute Project (OCP) started 10 years ago as a way to share… Read More
Machine Learning in the Fab at #59DAC
It used to be true that a foundry or fab would create a set of DRC files, provide them to designers, and then the process yield would be acceptable, however if the foundry knows more details about the physical implementation of IC designs then they can improve the yield. Using a digital twin of the design, process and metrology steps… Read More
IC Layout Symmetry Challenges
Many types of designs, including analog designs, MEMs, and image sensors, require electrically matched configurations. This symmetry has a huge impact on the robustness of the design across process variations, and its performance. Having an electrically matched layout basically means having a symmetric layout. To check … Read More
Automating and Optimizing an ADC with Layout Generators
I first got involved with layout generators back in 1982 while at Intel, and about 10% of a GPU was automatically generated using some code that I wrote. It was an easy task for one engineer to complete, because the circuits were digital, and no optimization was required. In an IEEE paper from the 2022 18th International Conference… Read More
Fast EM/IR Analysis, a new EDA Category
I’ve watched the SPICE market segment into multiple approaches, like: Classic SPICE, Parallel SPICE, FastSPICE and Analog FastSPICE. In a similar fashion the same thing just happened to EM/IR analysis, because after years of waiting we finally have a different approach to EM/IR analysis that works at the top-level of … Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet