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3D-ICs bring together multiple silicon dies into a single package that’s significantly larger and complex than traditional systems on a chip (SoCs). There’s no doubt these innovative designs are revolutionizing the semiconductor industry.
3D-ICs offer a variety of performance advantages over traditional SoCs. Because … Read More
Recently, in one of my regular check-ins with AMIQ EDA, I was pleased that they linked me up with an active customer. The resulting post summarized my discussion with three engineers from Kepler Communications Inc. They talked about using one of the AMIQ EDA products in the design of FPGAs for space-borne Internet connectivity.… Read More
Intel announced today that they are partnering with cloud and EDA companies to better enable their foundry business. This is a natural extension of the Accelerator ecosystem program announced earlier. More and more chip designs are being done in the cloud and from my experience cloud based designs are better. Some companies use… Read More
Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More
The TSMC Technical Symposium is today so I wanted to give you a brief summary of what was presented. Tom Dillinger will do a more technical review as he has done in the past. I don’t want to steal his thunder but here is what I think are the key takeaways. First a brief history lesson.
The history of TSMC Technology Development with 12 key… Read More
The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More
One of the recent live events I attended was the 2022 GSA Silicon Leadership Summit on May 12th at the Santa Clara Convention Center (my favorite location). This was the first GSA live event in two years so it was a must attend gathering. This event targets semiconductor ecosystem executives (200+ people attended) so there were many… Read More
The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.
Ansys has been a great supporter of the Design Automation Conference but this year they … Read More
Vaysh Kewada is cofounder and CEO at Salience Labs, a company developing an ultra high-speed multi-chip processor that packages a photonics chip together with standard electronics to enable exascale AI. Salience is funded by Oxford Sciences Enterprise, Cambridge Innovation Capital, Arm-backed Deeptech Labs, former Dialog… Read More
With the TSMC Technical Symposium coming next month there is quite a bit of excitement inside the fabless semiconductor ecosystem. Not only will TSMC give an update on N3, we should also hear details of the upcoming N2 process.
Hopefully TSMC will again share the number of tape-outs confirmed for their latest process node. Given… Read More
RISC-V and AI: The Architecture Shift Is Now