In the competitive vertical of mobile System-on-Chip development, SRAM plays a pivotal role, occupying nearly 40% of chip area and directly impacting yield and performance. The presentation “Accelerating SRAM Design Cycles With Additive AI Technology,” co-delivered by Mohamed Atoua of Siemens EDA and Deepesh… Read More
The big semiconductor news this week is the legal action TSMC is taking against former Senior Vice President Wei-Jen Lo. This looks to be a serious game of 3D chess between CC Wei and Lip-Bu Tan so it is worth a look. I got this notice in my inbox early Tuesday morning:
Immediately following, there was an interesting discussion on SemiWiki… Read More
In the lush landscapes of Kumamoto Prefecture, on Japan’s Kyushu Island, TSMC is etching a new chapter in global chip production. The TSMC Kumamoto facility, operationalized through its wholly-owned subsidiary Japan Advanced Semiconductor Manufacturing (JASM), represents the Taiwanese giant’s bold foray… Read More
Make a difference and take this short survey. It asks about your experience with embedded non-volatile memory technologies. The survey is anonymous, and the results will be shared in aggregate to help the industry better understand trends: 2025 Embedded Non-Volatile Memory Survey.
We are now in the AI era where data is the lifeblood… Read More
The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More
In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More
