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MediaTek is on the Move with TSMC!

MediaTek is on the Move with TSMC!
by Daniel Nenni on 08-23-2016 at 4:00 pm

MediaTek (MTK) recently made the news for announcing their first leading edge SoC (Helio X30), a 32% increase in quarter over quarter sales, and an expected 30% increase for the year. Both of which deserve a closer look as we move into the second half of 2016 which should be very strong for MTK TSMC, and the fabless semiconductor ecosystem.… Read More


What is Inside the iPhone 7?

What is Inside the iPhone 7?
by Daniel Nenni on 08-20-2016 at 7:00 am

TSMC is the bellwether for not only the foundry business, since they are the dominant player, but also the semiconductor industry as a whole. You could also argue that TSMC is a sneak peek into the world economy since they build capacity based on their customer’s forecasts and the world now revolves around semiconductors.

The other… Read More


TSMC and Pokemon Go!

TSMC and Pokemon Go!
by Daniel Nenni on 08-09-2016 at 4:00 pm

As Pokemon Go invades the world, let me give you a firsthand player’s description of the game and why the next generation of augmented reality apps will energize the fabless semiconductor ecosystem and greatly benefit TSMC.

While I am not a “gamer” per say, I am a technologist and am always looking for new semiconductor market drivers.… Read More


Circuit Simulation Panel Discussion at #53DAC

Circuit Simulation Panel Discussion at #53DAC
by Daniel Payne on 06-29-2016 at 12:00 pm

Four panelists from big-name semiconductor design companies spoke about their circuit simulation experiences at #53DAC in Austin this year, so I attended to learn more about SPICE and Fast SPICE circuit simulation. I heard from the following four companies:… Read More


Xilinx is Killing Altera!

Xilinx is Killing Altera!
by Daniel Nenni on 06-28-2016 at 4:00 pm

At a recent outing with FPGA friends from days gone by, the long running Xilinx vs Altera debate has come to an end. The bottom line is that Xilinx has used the FUD (fear, uncertainty, and doubt) of the Intel acquisition quite effectively against Altera and is racking up 20nm and 16nm design wins at an alarming rate. It will be a while … Read More


NVIDIA GeForce GTX 1080 Poised To Claim The Gaming And VR Performance Crown

NVIDIA GeForce GTX 1080 Poised To Claim The Gaming And VR Performance Crown
by Patrick Moorhead on 06-08-2016 at 12:00 pm

NVIDIA has been teasing the promise of Pascal for years, but this year Pascal’s performance became much more real. With the announcement of the Tesla P100 based on Pascal, NVIDIA was able to show the neural-network world what Pascal was really capable of. However, that chip is very different from the gaming-focused Pascal chip … Read More


TSMC Update at #53DAC!

TSMC Update at #53DAC!
by Daniel Nenni on 05-31-2016 at 4:00 pm

TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More


How TSMC Tackles Variation at Advanced Nodes

How TSMC Tackles Variation at Advanced Nodes
by Pawan Fangaria on 05-27-2016 at 12:00 pm

The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More


ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More