SILVACO 073125 Webinar 800x100

FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers. Continue reading “FinFET Standard Cells at DAC”


TSMC Theater Presentation: Apache

TSMC Theater Presentation: Apache
by Paul McLellan on 06-25-2012 at 12:13 am

At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be one of the main ways that we keep on the Moore’s law curve at the system level.

There are lots of challenges for 3D designs:

  • multi-die floorplan and place & route
  • manufacturing test
  • TSV-aware physical verification
  • TSV extraction
  • Power integrity
  • Reliability integrity
  • Signal integrtity
  • Wide I/O jitter analysis

Of course Apache is not directly involved in all of these, just the last 4. Apache have proactively been working with TSMC on these issues both for regular 20nm designs and for 3D designs.

One of the most recent changes is the addition of more complete thermal analysis. This is then fed back into the power analysis (because high temperature affects performance which affects power which affects temperature…, not to mention it accelerates metal migration and other reliability issues). RedHawk is used to generate the Chip Thermal Model (CTM) which is fed into Sentinel-TI also with input from IcePick system thermal tools (to analyze heat flow out of the package etc). This combination makes very accurate thermal analysis, and thus the way that this effects performance ane reliability.

Apache/ANSYS have been working closely with TSMC for 3D designs that combine power analysis from Apache with TSMC’s DFM Data-Kit (DDK) modeling to arrive at a complete analysis of a stack of die on an interposer in a package with heatsinks, in-package slugs etc.

One specific problem in the short term is analyzing Wide I/O since JEDEC has standardized wide I/O for memories meaning that there are lots of signal integrity issues, especially using Wide I/O on silicon interposer (where there is lots of routing involved too). The same problems arise with any wide bus, and wide-buses are common on 3D and interposer designs since the ability to have almost as many “pins” as you want is one of the advantages of 3D/2.5D.


Finding RTL Bugs Live Using Formal Techniques

Finding RTL Bugs Live Using Formal Techniques
by Daniel Payne on 06-24-2012 at 8:10 pm

Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days without any assistance from Nvidia. Continue reading “Finding RTL Bugs Live Using Formal Techniques”


DesignSync update from Dassault Systems at DAC

DesignSync update from Dassault Systems at DAC
by Daniel Payne on 06-24-2012 at 8:10 pm

At DAC on Wednesday Rick Stanton of Dassault Systems gave me an update on what’s new with DesignSync, a design data management tool offered since 1998. Rick and I both worked at Viewlogic in the 90’s along with Dennis Harmon who then founded Synchronicity, later acquired by Dassault Systems.
Continue reading “DesignSync update from Dassault Systems at DAC”


Webinar: how to reduce mobile device cost and board space with LLI

Webinar: how to reduce mobile device cost and board space with LLI
by Eric Esteve on 06-24-2012 at 2:46 am

LLI Specification has been officially released by the MIPI Alliance, at the occasion of the Mobile World Congress in Barcelona, this year. As indicated by the name, the round-trip latency of the LLI inter-chip connection is fast enough for a mobile phone modem to share an application processor’s memory while maintaining enough read throughput and low latency for cache refills. Sharing the same DRAM device means the wireless handset integrator can save real estate printed circuit board (PCB) space and create a thinner smartphone, or implement additional device, more features to the smartphone, like NFC chip for example. It also means that the OEM will save, on every manufactured smartphone, the cost of one DRAM ($1 to 2$). If you manufacture dozen of million smartphone like some of the leaders, you can see how quickly you will get the return on the initial investment done by the chip makers to acquire the IP!

MIPI Alliance is strongly supportive of LLI, as we can see from this quote: “As active MIPI contributors, Synopsys and Arteris are aiding in the adoption of the MIPI M-PHY and MIPI Low Latency Interface,” said Joel Huloux, chairman of the board of MIPI Alliance. “The early integration and availability of the Arteris and Synopsys solution helps speed time to market for MIPI LLI adopters.” LLI support from Arteris and Synopsys illustrate how important is to build a strong partnership when selling a complementary solution, as the joint solution consists of Arteris’ Flex LLI™ MIPI LLI digital controller IP and Synopsys’ DesignWare® MIPI M-PHY IP. A team of Arteris and Synopsys engineers, formed to facilitate verification and testing of the joint solution, validated its functionality and interoperability. And for those who love to get insights, you should know that LLI was initially developed by an Application Processor chip maker, who understood that the function, to be successful on the market, has to be marketed and sold by an IP vendor, Arteris was selected as they were already marketing C2C or “Chip To Chip Link” IP, offering exactly the same functionality (sharing a DRAM between Modem and Application Processor), by the means of a parallel Interface, we will come back soon about this IP.

You will certainly get more information by registering and attend this webinar, just go here

Overview of this webinar:
When designing mobile devices, it is critical to implement technologies that will future-proof your design, minimize BOM costs and board space, and maintain or improve performance. The MIPI Alliance Low Latency Interface (LLI) and M-PHY are two technologies that can help future-proof your design while giving it competitive advantages in terms of cost, board space, performance, and time-to-market.

The webinar will present a case study describing how LLI can be used to minimize DRAM footprint on a mobile phone system board. Particular attention will be paid to real-world implementation issues, such as clock domain, power and voltage management as well as integration with SoC interconnect fabrics.

This webinar will teach you:

  • What the LLI and M-PHY technologies are, and best practices for implementation
  • How LLI is different than other chip-to-chip interface standards, such as USB and PCIe
  • How the LLI point-to-point interconnect can benefit multi-chip systems
  • How the LLI controller and M-PHY IP can reduce the silicon footprint on your board
  • How LLI can reduce individual BOM and multi-product platform costs

Who should attend:
This webinar is targeted at system architects, mobile device and consumer electronics product managers and designers, design engineers, SoC architects, and project managers.

Presenters:



Hezi Saar, Staff Product Marketing Manager, Synopsys
Hezi Saar serves as a staff product marketing manager at Synopsys and is responsible for its DesignWare MIPI controller and PHY IP product line. He brings more than 17 years of experience in the semiconductor and electronics industries in embedded systems. Prior to joining Synopsys, from 2004 to 2009, Saar served as senior product marketing manager leading Actel’s Flash field-programmable-gate-array (FPGA) product lines. Previously, he served as a product marketing manager at ISD/Winbond and as a senior design engineer at RAD Data Communications. Saar holds a bachelor of science degree from Tel Aviv University in computer science and economics and an MBA from Columbia Southern University.

Kurt Shuler, VP of Marketing, Arteris
Kurt Shuler is the VP of marketing at Arteris. He has held senior roles at Intel, Texas Instruments, ARC International and two startups, Virtio and Tenison. Before working in high technology, Kurt flew as an air commando in the U.S. Air Force Special Operations Forces. Kurt earned a B.S. in Aeronautical Engineering from the U.S. Air Force Academy and an MBA from the MIT Sloan School of Management.

Philippe Martin, Vice President, Corporate Applications and Senior Fellow, Arteris
Philippe Martin is Vice President, Corporate Applications and Senior Fellow at Arteris. He has been involved in the development of the MIPI Alliance Low Latency Interface (LLI) specification since the creation of the MIPI Alliance LLI Investigation Group in 2009. Philippe is a renowned expert on LLI and has contributed to the technology through the MIPI Alliance LLI Working Group. Philippe has also participated in the first two commercial implementations by semiconductor companies of the LLI standard.

By Eric EstevefromIPNEST


Designing a Wafer-Scale Image Sensor for use in X-Rays

Designing a Wafer-Scale Image Sensor for use in X-Rays
by Daniel Payne on 06-22-2012 at 1:32 pm

At Intel we mused about designing wafer-scale integration (WSI) back in the 70’s however I just learned about how Dr.Renato Turchetta at the Science and Technology Facilities Council (STFC) designed a wafer-scale imaging sensor chip for X-Ray applications. I was also able to interview Dr. Turchetta to learn more about the challenges that they faced in creating this chip.

Continue reading “Designing a Wafer-Scale Image Sensor for use in X-Rays”


Will Microsoft Go Thermonuclear?

Will Microsoft Go Thermonuclear?
by Ed McKernan on 06-21-2012 at 8:20 pm

Microsoft is in trouble. Many of you already know that. Steve Ballmer has one last opportunity to set the company on a growth path or they will retreat into IBM legacy mode… ala the post 1990s Lou Gerstner era. And so they introduce a large tablet-convertible in direct competition with their PC partners Dell and HP. The End Game is coming sooner than anyone expected. Where is this headed?

A few weeks ago I considered writing a blog following the disastrous Dell quarterly earnings report where they admitted Apple’s iPAD was starting to inflict damage on their PC business. I was sure that this was going to be a forcing function on the Wintel Empire and tried to look at it from the Intel side. Would Intel get into the PC business as Dell and HP scaled back? I couldn’t complete the logic because an Intel entry is at conflict with Apple’s strong consumer push with their PCs.

No, the more logical conclusion is that Intel forges ahead with owning the high performance driven datacenter market (at some ever shrinking expense to HP and Dell) while Microsoft scrambles to replace HP and Dell in the client space where form factors are shrinking dramatically. DVD and HDDs are now being replaced by tiny, energy sipping NAND flash chips while application delivery over the cloud becomes a must.

Then there are the economics to consider but first a little history on tablets:

Microsoft has been dabbling in tablets for more than 20 years. Does anyone remember the flaming startup called Go? The stylus and hand writing recognition were considered the key to tablets taking off and Microsoft thought that they were closing in on a solution year after year. As an engineering friend of mine liked to say on a daily basis about his constantly delayed chip tapeout: “never been closer.”

The aim of hand writing recognition was to enhance Microsoft’s bread and butter Office Application environment with users casually writing in documents on a screen. It was a hard object (stylus) on a hard SURFACE (had to throw that in). It was clunky and unnatural. As is typical to all massively planned grand events, history chooses to take a detour and we ended up with smartphones and tablets controlled by the soft touch of a thumb and index finger.

Now to the Economics:

Apple’s operating margins are now greater than Microsoft (39% vs. 36.8%). Did you know that? If Microsoft stays on the Wintel course in the tablet and PC market working with traditional customers like Dell and HP they will face either shrinking margins or reduced volume to stay relevant. The alternative is to take the hardware into their own hands and deliver a complete solution to corporations and consumers while eliminating costs by going vertical. This is what the tablet announcement signifies and in a way it is leading down the IBM’s mainframe bundled solutions path. Eliminating Dell and HP off the top reduces the end prices of PC equipment by 15-25% depending on the configuration. It’s a good start towards being competitive but without a doubt a burning the ships moment.

Microsoft will need to go a step further and take ownership for some of the silicon that goes into the tablet and ultrabooks. Specifically they will need to acquire the likes of nVidia and AMD in order to develop low cost ARM and x86 processors and thereby effectively moving margins into Microsoft’s pocket. The new vertically integrated Microsoft then can replicate the Apple supply chain enabling them to hit low end market price points and to undercut Intel in the >$700 mobiles that use Ivy Bridge. Now this is a true Thermonuclear War. In the end, the 30 year old Wintel stasis can not coexist with Apple’s hyper growth.

Steve Ballmer has maybe two years (more likely one year) to put Microsoft in a leadership position that remains within spitting distance of Apple. If he is not successful, would it be even possible for Bill Gates to come out of retirement to forge a winning plan?

FULL DISCLOSURE: I am Long AAPL, INTC, QCOM, ALTR



EDA Tools to Optimize Memory Design

EDA Tools to Optimize Memory Design
by Daniel Payne on 06-21-2012 at 8:15 pm

I met with Amit Gupta, President and CEO of Solido at DAC on Tuesday to get an update on their EDA tools used in the design of memory, standard cells and low-power. In 2012 they’ve expanded to add three new software packages: Memory, Standard Cell, Low Power. They must be doing something right because at DAC this year I see more competitors jumping into the Fast Monte Carlo space. Continue reading “EDA Tools to Optimize Memory Design”