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Power Management Policies for Android Devices

Power Management Policies for Android Devices
by Daniel Payne on 10-20-2014 at 10:00 pm

I’ll never forget the shock when I upgraded from a Feature Phone to my first Android-powered SmartPhone, because all of a sudden my battery life went from 6 days down to only 1 day between charges. As a consumer, I really want my battery to last much longer than one day, so the race is on for mobile phone companies to design their devices with the maximum possible battery life. The combination of operating system, power management policies and hardware are what determine the battery life in a modern, Android-based device. On the EDA side there are companies like DOCEA Power that focus on modeling power at the Electronic System Level (ESL), before RTL coding has even started.

ESL power modeling and simulation addresses the key factors in the evaluation of power management policies, as you can develop, update and maintain power models from the IP block level to the complete system inclusive of the process technology-dependent factors.

With the DOCEA Power approach, you can build power models bottom up and model power states and power events from the application and software from the top down. You can automate the power model generation, clock and voltage connections and parametrize the models to also include PVT and implementation level details necessary for accurate power analysis. Models can be refined with characterization data as the design matures to track the power and performance targets.

Power models which contain system power, thermal and performance states for computational elements (PU’s or processing elements), interconnect, both active and idle power states with dynamic power calculations to account for task load, task consumption and idle power including temperature dependent leakage as well as clock and power gated idle power reduction techniques.

DOCEA power provides the ability to model power as a function of power state residency, system activity, and power state event transitions from realistic workloads and applications.

Power Management Policies
Let’s take an overview of power management policies typically found on Android devices.

Performance Governor
This locks the phone’s CPU at maximum frequency, producing impressive benchmark results and providing a faster race-to-idle. Race-to-idle is the process by which a phone completes a given task, such as syncing email, and returns the CPU to the extremely efficient low-power state.

Related – ESL Tool Update from #51DAC

Conservative Governor
This controls the phone to prefer the lowest possible clock speed as often as possible. The conservative governor can introduce choppy performance, however it can be good for battery life.

OnDemand Governor
This governor has a hair trigger for boosting clock speed to the maximum speed set by the user. If the CPU load placed by the user slows, the OnDemand governor will slowly step back down through the kernel’s frequency steppings until it settles at the lowest possible frequency, or the user executes another task to demand a ramp.

Userspace Governor
This governor allows any program executed by the user to set the CPU’s operating frequency, something more common for servers or desktop PCs where an application (like a power profile app) needs privileges to set the CPU clock speed.

Powersave Governor
The opposite of the Performance governor is the Powersave governor, and it locks the CPU frequency at the lowest frequency set by the user.

Related – Power Modeling and Simulation of System Memory Subsystem

Interactive Governor
Similar to the OnDemand governor, the Interactive governor dynamically scales CPU clock speed in response to the workload placed on the CPU by a user. Interactive is significantly more responsive than OnDemand, because it’s faster at scaling to maximum frequency. Interactive is the default governor of choice for today’s smartphone and tablet manufacturers.


​Android battery life using Interactive Governor

InteractiveX Governor
Created by kernel developer “Imoseyon,” the InteractiveX governor is based heavily on the Interactive governor, enhanced with tuned timer parameters to better balance battery vs. performance. The InteractiveX governor’s defining feature, however, is that it locks the CPU frequency to the user’s lowest defined speed when the screen is off.

Hotplug Governor
The Hotplug governor performs very similarly to the OnDemand governor, with the added benefit of being more precise about how it steps down through the kernel’s frequency table as the governor measures the user’s CPU load. However, the Hotplug governor’s defining feature is its ability to turn unused CPU cores off during periods of low CPU utilization. This is known as “hotplugging.”

Related – Power and Thermal Analysis of Data Center and Server ICs

All of these power management policies can be quite complex and the policies which might provide added battery life may have significant tradeoffs in terms of design and validation complexity as well as functionality and performance. Evaluation of power management policies and algorithms should take into account the hardware interaction with the application and software behavior:

Traditional power management which improves battery life benchmarks may assume that the system is idle 70-90% of the time so a “race to halt” and optimizations for idle power reduction are key. Applications which require high quality of service such as media playback, communications and isochronous support require policies that use low latency and sustained performance.

Summary
Android devices may use many different power management policies, and we only covered a handful of possible policies in this blog. My follow-on blog will describe the methodology proposed by DOCEA Power to model, simulate and optimize power prior to RTL coding.


i.am, I said

i.am, I said
by Don Dingee on 10-20-2014 at 4:00 pm

The tie between rock artists and technology isn’t new. One of the first prominent rockers-turned-entrepreneurs is Tom Scholz of Boston, an engineer who has a couple MIT degrees and several patents to his name. Neil Young is currently out with Pono, attempting to make a higher-resolution audio format based on FLAC encoding to get past the overly compressed and clipped fare standard with MP3s.

When Intel announced Will.i.am as director of creative innovation at CES 2011, a few heads turned. Continue reading “i.am, I said”


A Complete Scalable Solution for IP Signoff

A Complete Scalable Solution for IP Signoff
by Pawan Fangaria on 10-20-2014 at 7:00 am

In an SoC world driven by IP, where an SoC can have hundreds of IP (sourced not only from 3[SUP]rd[/SUP] party but also from internal business units which can have a lot of legacy) integrated together, it has become essential to have a comprehensive and standard method to verify and signoff the IP. Additionally, these checks must be performed objectively and quickly without requiring experts for each type of testing such as power, timing, CDC, DFT, physical congestion etc. The key challenge for SoC designers and integrators has been verifying the IP and ensuring their worthiness of being integrated into SoC. As the IP can vary in size and complexity by large extent and there is a large spectrum of IP suppliers which is continuously growing, the solution must be flexible and adaptable to accommodate specific needs of particular IP and must be scalable to cover the whole spectrum as well as address emerging needs in future.

Although, I knew about Atrenta’sIP Kit being used at TSMCfor soft IP qualification, I didn’t know about the versatility of this comprehensive solution until I attended the webinarpresented by Robert Beanland, Sr. Director, Corporate Marketing at Atrenta.

The IP Kit performs extensive verification provided by SpyGlass platform on an IP (including RTL, library files, constraints in terms of SDC, UPF/CPF etc. and waivers), cleans up SDC, CDC, UPF/CPF etc., applies the supplied waivers on rules and provides a clean IP with dedicated reports of power dissipation (including power domains), fault coverage, SDC coverage, clocks & timing etc. along with handoff (datasheet and dashboard reports) and standard reports including signoff. It provides a complete package of all reports, constraints, waivers, RTL, libraries and SpyGlass Abstract Models. The SpyGlass Abstract Models are smart models which are unique creations by Atrenta; I will talk about this a little later.The quality of an IP can be easily ascertained through these reports.

The use-model is quite simple (although rigorous work is done under the hood) for anyone to be able to do the IP signoff easily. It just needs you to run three commands: 1) ‘aipk_read’ that reads the design and supporting files and does the design setup & check for goals; 2) ‘aipk_run’ that does the design analysis; and 3) ‘aipk_pack’ that packages the design once all the goals have been met successfully. The process can also be tuned to any specific customer’s needs.

An extensive dashboard allows you to define rules for IP quality report such as pass/fail criteria, customized tests, and power and CDC checks etc. as per company requirements. Additionally, IP specs can be defined for how a rule should look, for example stuck-at conditions, false path propagation etc. Details about any particular test in the report or its rule can be navigated as shown above. Similarly the trend lines for any particular failing or passing rules can be seen automatically.

TSMC has put the Atrenta IP Kit through extensive use in qualifying all Soft IP; it has constituted an on-line portal which can be used for any IP to pass through the IP Kit and generate healthy quality matrix for the IP at hand. Any validated IP can be re-validated again against any new configuration for re-use. In several of the IP qualifications at TSMC, various kinds of problems such as index out of range, unconstrained I/O ports, unsynchronized CDC paths, and many more have been observed which were not known to the IP providers or SoC integrators. This helps tremendously by pin pointing the exact problems, thus helping faster resolution of problems and eliminating longer loops later during SoC integration.

Now is the time to talk about the SpyGlass Abstract Models! The IP Kit can also be used to provide an Abstract Model with high capacity and performance for its effective and fast integration into an SoC. The model is enhanced such that issues internal to the IP are minimized and the model is focussed on connectivity and configuration information with respect to SoC integration. At the SoC level, the IP connected together are signed-off producing the dashboard for SoC Signoff.

The hierarchical SoC abstraction flow enables billion+ gate SoC results to be available in a few hours instead of weeks. Specifically, these models offer substantial reduction in memory (5-10x), massive performance improvement (15-50x) and noise reduction to the extent of 10-100x (i.e. number of violations) compared to flat design analysis. The SoC design houses can build a repository of qualified IP by passing all 3[SUP]rd[/SUP] party as well as internal IP through the IP Signoff process provided by the IP Kit. The Smart Abstract Models can be built out of these qualified IP through IP Acceptance (i.e. validating IP assumptions in the SoC context) and used in SoCs.

By the use of fewer and shorter iterations, the design convergence becomes faster which can reduce the design schedule up to 60%. The IP Signoff with standardized rule sets and other processes, seamless integration into SoC flow, and extensibility to adopt new technologies and 3[SUP]rd[/SUP] party tool reports is extremely beneficial for IP suppliers as well as SoC integrators for internal as well as external usage.

What’s more? Atrenta is further strengthening the IP Kit by adding a new verification capability to automatically incorporate large number of assertions in an IP which can be used at SoC level to ascertain whether an issue relates to configuration, connectivity, or the IP itself. This will provide an additional high productivity boost to SoC integration and signoff. Stay tuned to get this new capability!

Atrenta provides a complete RTL platform for IP as well as SoC Signoff, flexible use-model, high impact and low noise methodology along with high quality management reports. You can learn more about this complete offering in detail by attending the recorded on-line webinar here.

This reminds me about my discussion with Piyush Sancheti, VP, Product Marketing at Atrentaearly in this year where we saw an acute need of standardized sign-off process, both at IP as well as SoC level.
Read more on that – RTL Sign-off – At an Edge to become a Standard.

More Articles by Pawan Fangaria…..


GlobalFoundries and IBM

GlobalFoundries and IBM
by Paul McLellan on 10-19-2014 at 9:12 pm

So it’s true. IBM is selling its semiconductor division to GlobalFoundries. Actually, selling is a sort of euphemism for paying them $1.5B to take it off their hands. At least according to Bloomberg. There have been rumors for weeks that IBM wanted to pay $1B to get rid of the division, but GF wanted $2B. Looks like they split the difference.

Dan wrote about this recently. But he was wrong. But only in the small print. He predicted early October (it is now late) and $2B (it is only $1.5B). But pretty close. Read his earlier post here GlobalFoundries Acquire IBM Semiconductor Unit

Is it all true? Probably:IBM will also receive $200 million worth of assets, making the net value of the deal $1.3 billion, said the people who asked not to be identified because the agreement is private. The companies plan to announce the deal tomorrow morning, the people said. IBM put out a statement today saying it planned to make a “major business announcement” tomorrow.

So we need to wait until tomorrow to know for sure. But the background is true. IBM has been trying to find a buyer for their semiconductor business which has been losing a lot of money. GlobalFoundries would like some more research power in technology development (process). But I predict there will be problems because IBM employees are paid at a very high rate, much higher than GF probably pays people in the same position.

So what is the deal likely to be:In a 10-year partnership, Globalfoundries will supply IBM with Power processors in exchange for access to IBM’s intellectual property, the people said. That would allow Globalfoundries to access key chipmaking technology and guarantee supply of chips that IBM needs for its systems, like mainframe computers and its Watson data-analytics technology.

It will remain in the future to tell if this is a good deal. GlobalFoundries currently gets its process from Samsung so all those IBM researchers are duplicate. But that is only at 14nm. I don’t know if the Samsung deal goes to 10nm, or if IBM have any secret sauce for future processes that would make GF competitive. For the time being (meaning 28nm) they are an also-ran to TSMC. But at 14/16nm with Samsung’s help that could change. And at 10nm, with the IBM expertise, maybe they could pull ahead.

UPDATE: here is the first paragraph of the press release, which, apart from financial terms, is the heart of the agreement:GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM’s global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews. GLOBALFOUNDRIES will also become IBM’s exclusive server processor semiconductor technology provider for 22 nanometer (nm), 14nm and 10nm semiconductors for the next 10 years.


Semiconductor Startups on Kickstarter!

Semiconductor Startups on Kickstarter!
by Daniel Nenni on 10-19-2014 at 4:00 pm

One of the challenges for the fabless semiconductor ecosystem is raising funds for new ventures. Of the things I do as a consultant, working with entrepreneurs on business and funding plans is by far the most interesting. Raising money is a big challenge since venture capitalists have largely ignored our industry of late. Kickstarter however offers a new source of funding and you do NOT have to give up 60% of your company!

According to Wikipedia:
Kickstarter is a globalcrowdfundingplatform based in the United States. The company’s stated mission is to help bring creative projects to life. Kickstarter has reportedly received over $1 billion in pledges from 5.7 million donors to fund 135,000 projects, which include films, music, stage shows, comics, journalism, video games, and food-related projects. People who back Kickstarter projects are offered tangible rewards and special experiences in exchange for their pledges. This model traces its roots to subscription model of arts patronage, where artists would go directly to their audiences to fund their work.

The most notable Kickstarter campaign is the Coolest Cooler, which raised more than $13M from 62,462 backers in 52 days. The initial goal was only $50k! In the semiconductor realm the most recent Kickstarter project is ProfileMyRun: Run the Right Way, Run the Natural Way by Palo Alto Scientific:

“As an avid runner, I love to run. But I don’t enjoy the pain associated during the run. I started to ask myself, “There must be a better way to achieve a more natural and enjoyable run, less prone to pain and injury.” I looked around at the available solutions of how to improve runner’s performance, but found these programs to be either too expensive and accessible only to professional runners ($100K)…or too basic, providing only information about your steps and calories ($99), which really doesn’t help the runner attain an optimal run. That’s what inspired me to develop ProfileMyRun…The patented system that takes full advantage of the latest technology in running science, and brings it to everyday people, like you.” – CK Lam, Creator of ProfileMyRun


Full disclusoure: SemiWiki is an ardent supporter of this project. As I have mentioned many times before, IoT and the wearable market is the source of many new design starts, the lifeblood of the fabless semiconductor ecosystem, so I am pleased to do anything I can to help.

This specific project is near and dear to my feet. During my triathlete years running was always my weakest event. My one and only marathon time is 4:20 which barely beat Oprah Winfrey’s time of 4:29. There was no way I was going to lose to Oprah. Like many Baby Boomers I decided to “Just Do It!” without any professional training whatsoever and paid the price with a serious case of shin splints. In fact, just today I ran three miles and now I sit in not so silent pain and suffering. During my six mile Iron Horse Trail walk this morning I discovered my wallet had fallen out of my pocket so I literally sprinted three miles to retrieve it. I leave for Taiwan tonight so losing my wallet was not an option!

Please show your support for ProFileMyRun and the fabless semiconductor ecosystem. We have changed the world and will continue to do so with creative funding sources like Kickstarter, absolutely.

More Articles by Daniel Nenni…..


Xilinx: Revenue on Target, Profit Above

Xilinx: Revenue on Target, Profit Above
by Paul McLellan on 10-19-2014 at 7:00 am

Xilinx announced their quarterly results a couple of days ago. Technically it is their Q2 2015. Sales were $604M and profitability was significantly higher than expected at $0.62/share. But that is not the most interesting thing about these calls. There is the Xilinx vs Altera story. And then there are tealeaves to be read about TSMC (Xilinx exclusively manufactures at TSMC).

To me, one of the most amazing numbers, having myself worked within a semiconductor company for years, is that gross margins were 71.9%. A record for the company. As a comparison point, that is way above Intel, never mind other semiconductor companies. That means that for a part that Xilinx sells for $10 they give less than $3 to TSMC. Of course they have other costs but out of $604M of sales they had operating income of $200M.

Jon Olson the CFO summarized the business:28-nanometer sales were flat and 40-nanometer sales declined as anticipated, reflecting an overall decline in our new products category. Our base category, which is comprised of our oldest products, increased significantly during the quarter, driven primarily by the timing of programs in the aerospace and defense end-market that we discussed with you last quarter. On a year-on-year basis, new products were up 21%, mainstream down 8%, and base products down 14%.

It is clear that the results could have been even better since there are limitations on the rollout of LTE in China due to supply chain issues (i.e. shortage of components that are not Xilinx FPGAs). Since China has about 500,000 base stations this has the potential to be a big deal. In the Q&A Jon said that 3G was a steep ramp, then flat, and a fast falloff. LTE is more patchy due to these issues, plus the Chinese economy is not as strong as it was in the 3G rollout period. In the Q&A:We’ve had large wireless OEM customers say we would be taking more FPGAs if we had more power amplifiers…We don’t produce those, so therefore I can’t give you a good reading on when that is going to be alleviated.

Then it was Moshe Gavrielov, the CEO’s turn:28-nanometer product generation is without doubt the most successful node in our history, will serve as the growth driver for the company for several years going forward. Our 28-nanometer sales target in fiscal year 2015 is $600 million, an increase of approximately 60% from the previous fiscal year.

It is clear from Xilinx and everyone else that 28nm is going to be a very long-lived node. It seems to hit some sort of sweet spot on ease of design (although that is less important with an FPGA), cost of manufacture and available capacity. And in the Q&A they were very explicit:our product offering in 20 is very broad. It has the midrange and it has a high-end and super-high-end component to it. So we’re very bullish on what it will provide. But clearly it won’t be as good as 28, which for a variety of reasons actually is broader and will have a longer life due to some cost-related elements.

Moshe commented on the Xilinx vs Altera story too. Although, of course, he never said the word Altera:At the 20-nanometer node, independent customer feedback indicates that we have approximately a one-year lead over the competition, both in terms of our ultra-scale silicon maturity and quality of results. This significant technology leadership is delivered in the broadest and most compelling midrange product family, complemented by the industry’s only high-end family. This is manifested in the largest FPGA in the industry which delivers over 4x the capacity of competitive devices.

A one year lead over your competition is huge, of course. But the big transition is coming up at 14/16nm with the added interest of Altera switching to Intel as a foundry. I don’t believe I’ve seen any official statement about when Xilinx might start shipping 16nm, but word on the street is in Q2 of next year. After all, foundries like to use FPGAs as a process driver so they are always early in the cycle. Altera said they would tape out in Intel 14nm in Q1 of next year (this was over a year ago so things might have changed a bit). With fab cycle times and device qualification times it is hard to imagine Altera will start shipping 14nm parts until Q4 or even 2016. That would put Xilinx still being 6 months to a year ahead of Altera.

But Moshe is even more bullish. As he said in the Q&A:We expect the sum of 20nm and 16nm to approach what 28nm will be. And it’s difficult for us to make the division between the two. Fundamentally, 20nm for us will be two years ahead of 16nm and two years ahead of any competing product in an advanced node.

And a final read of the TSMC tea-leaves:With regards to defect density and maturity of the products, it’s [20nm] ahead of where we were at the same point in time at 28-nanometer. And 28-nanometer was very smooth introduction for us. But 20-nanometer, and this is the second-generation we have done with TSMC, has been extremely smooth.

More articles by Paul McLellan…


MIPI Soundwire IP Sounds Innovative

MIPI Soundwire IP Sounds Innovative
by Eric Esteve on 10-19-2014 at 3:07 am

MIPI SoundWire specification will be integrated into mobiles systems, like smartphone or media tablet. In fact some of the well-known chip makers have already decided to integrate MIPI SoundWire into their last application processor release. MIPI SoundWire is also the type of specification which could be used in many other applications even if the primary target is smartphone, features phones and media tablet. According with Cadence: “SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it attractive to many mobile design applications.” The important words are low complexity and low gate count. An application processor for mobile count billion transistors, so the gate count is not an issue, but if we consider the IC devices controlling the peripheral (earpiece, speaker, internal micro, etc.), these are probably designed in more mature technologies, up to 130nm or even more. Such chips are targeting consumer or mobile applications, implying very high production volume and the cost is a key driver. Thus, benefiting from an efficient interface protocol is attractive at the condition that the cost impact is kept as low as possible.

MIPI SoundWire Controller IP is master/slave interface protocol. The master register can be accessed internally from a 32-bit AHB client interface. All registers are mapped to host memory space. Certain timing critical registers are banked to allow synchronous switching without interruption to data streams. We understand from the system level block diagram above pictured that the master could be either integrated in the application processor (mobile system), either in a DSP based audio ASSP. Both types of chips integrate a processor, so the choice of an AMBA AHB bus to access the master is judicious. The Slave Controller IP contains only a small subset of the logic.
MIPI SoundWire is Feature-rich IP solution: it was important to offer high level of configurability. In fact, the master can be configured with the following options:

  • PDI count and width
  • PDI type
  • PDI FIFO depth
  • Command FIFO depth
  • Data lane count
  • Source input clocks

MIPI SoundWire is a layered interface protocol, and the physical layer definition is an important part of the specification. MIPI SoundWire protocol doesn’t use MIPI D-PHY or even C-PHY, but the PHY uses modified NRZI. The PHY logic drives or detects multi-lane capable SoundWire IO interface. The master controller contains a clock generator that drives the clock signal to all slaves. The clock frequency is derived using a configurable gear box and a reference clock input. Clock stop handshake protocol is supported by the PHY layer. Clock can be stopped and resumed with precise synchronization to SSP interval. Once clock is stopped, the master controller enables asynchronous slave or self wakeup detection.

“With a complete solution targeted specifically for MIPI SoundWire, including verification IP released in March, we are fully enabling designers to integrate the latest technologies into their SoC designs for the mobile and consumer market” said Martin Lund, senior vice president of the IP Group at Cadence. Providing the related verification IP should facilitate early adoption of the new SoundWire spec. In fact, Cadence is a longtime supporter of MIPI specifications, as in the early days of the MIPI Alliance, the company was offering Verification IP for the various MIPI specification like DSI or CSI-2. The release of MIPI SoundWire Verification IP well in advance (March 2014) and Design IP now is a clear sign that Cadence send to the competition: Cadence has invested a lot to develop IP supporting MIPI specifications and the company will be present on this front.

Eric Esteve from IPNEST


Linux and the ARC of the Coherent

Linux and the ARC of the Coherent
by Don Dingee on 10-18-2014 at 7:00 am

Remember that thing called “real-time Linux”? Yeah, nobody else does either. As builds became configurable and clock speeds increased, embedded Linux manifested itself as fast enough for many applications – if a few other SoC details are addressed.

Most obvious for SoCs to run Linux is the need for a fully integrated MMU implementation. Continue reading “Linux and the ARC of the Coherent”


Recap of the Apple iPad Announcement

Recap of the Apple iPad Announcement
by Daniel Payne on 10-17-2014 at 2:00 pm

I watched the live stream product announcements yesterday from Apple and will give you a quick recap of what I gleaned. First off, Apple live stream requires that you use the Safari browser, so that meant that I couldn’t use Google Chrome, so much for adopting web standards.


Apple Products Talked about

iPhone 6 and 6 Plus
This was the biggest and fastest product launch in the history of Apple, which is quite the feat. We’ve been blogging that the A8 SoC used in these products is manufactured byTSMC, using some 2 billion transistors at the 20nm node. The 5.5″ display iPhone 6 Plus now sells about 24% of total iPhone sales, the 4.7″ display iPhone 6 at 62%, and remaining iPhones at 11% (Source: Consumer Intelligence Research Partners). The iPhone 6 starts selling in China today, which is expected to be another growing and emerging market for Apple.

Related – What Apple Talked about on 9/9/2014

ApplePay
The ApplePay allows for easier purchasing by using the NFC (Near Field Communication) feature in iPhones, and will start in retail stores on Monday. I use NFC and Google Wallet on my Galaxy Note 2, but find that most stores aren’t setup yet for NFC support, so I expect this will be a gradual ramp for ApplyPay as well. Oddly enough my local Best Buy store has NFC-ready checkout, but their software isn’t installed yet so cannot be used. ApplePay will start appearing on web sites as well, competing with the likes of PayPal and Google Pay.

Apple Watch
It’s coming, but you have to wait until early 2015 to buy one. Independent software developers will get an Apple Watch SDK in November, so that will start the race to build new apps that are watch centric.

Related – The Apple Samsung TSMC Intel 14 nm Mashup!

iOS8, OS X Yosemite
Apple has two operating systems – one for touch devices called iOS8 and the other for mouse-based devices called OS X Yosemite. The latest release of iOS8.1 fixes bugs, adds new features like ApplePay support and is ready on Monday. OS X Yosemite is mostly a cosmetic facelift along with hundreds of incremental improvements, is free, and the 5.1 GB downloads started yesterday. I’ve started using OS X Yosemite on my MacBook Pro and was surprised that during the upgrade the default was set to turn on file encryption, aka FileVault, although I kept it turned off. Mac Mail now also has an annoying bug in it where the From field will occasionally show up with the wrong name in it.

Customer adoption of iOS8 quickly reached 48% of the installed base on iPad and iPhone devices, way ahead of what Android users experience. My iPad 3 and iPad Air are upgraded and working well with iOS8, so far so good.

iPad Air 2, iPad Mini 3
It’s a thinner iPad, slimmed down to just 6.1mm, the world’s thinnest. The display is less reflective, which is a step in the right direction for users that don’t want to look at themselves all day. To me the big news was that this device uses an A8X chip, reported to have 3 billion transistors. We could assume that the manufacturing is TSMC again, because they fabricated the A8 chip, too bad for Samsung this round.

The smaller screen product iPad Mini 3 has the touch ID feature, comes in three colors and is priced from $399 to $599. The Apple marketing folks continue the tradition of offering previous generation iPads at reduced prices, giving consumers multiple price points to choose from.

iMac Retina 5K
Bigger is better when it comes to desktop computing, and the new iMac has a 27″ display with 5K, which is 5,120 x 2,880 pixels. Priced lower than a 4K TV set, this iMac starts at $2,499 and uses the 3.5 GHz quad-core Intel Core i5 chip. We’re still waiting for the day that Apple uses the A-series chips for all of the devices, breaking ties with Intel completely.

Mac Mini
This diminutive Mac Mini box finally got updated with latest Intel processor, faster Thunderbolt 2 ports (20 Gbps speeds) – enabling video streaming to one 4K monitor or dual QHD displays.

Continuity
As you can imagine Apple wants you to own all of their devices, however with two different operating systems how do you share files or apps? They talked a lot about continuity in the latest iOS8 and Mac OS X Yosemite, that now allow you to work between devices on the same app like Keynote. In the demo they started a Keynote presentation on an iPad, then moved over to iMac to continue editing right where they left off, and finally controlled the presentation using Apple Watch and streaming to Apple TV.

Full Disclosure – I own AAPL stock, have Apple products, and use the Samsung Galaxy Note 2.


Atmel’s New Microcontrollers and IoT, Wearables

Atmel’s New Microcontrollers and IoT, Wearables
by Paul McLellan on 10-17-2014 at 7:00 am

More and more companies, regardless of their vertical, are trying to get closer to their customers and see various aspects of the internet of things (IoT) as the way to do so. For a good example, here is Salesforce Wear Developer Pack which, as they say:..is a collection of open-source starter apps that let you quickly design and build wearable apps that connect to the Salesforce1 Platform. Millions of wearable devices connected to the cloud will create amazing new application opportunities.

Since salesforce.com cuts across all industries this has potential impact in many different market segments.

And the wearable devices that they list are Google Glass, Android Wear, Samsung Gear Watch, Myo Armband, Nymi Bionym, Pebble Watch, Jawbone UP, Epson Moverio, Vuzix Smart Glasses, Oculus Rift, Meta Glasses.

This combination brings home that the internet of things isn’t just about the things, it is about connecting the things back to the cloud so that the data generated can be aggregated where it has much greater value.

I am sure that people will design SoCs for various aspects of IoT, but even if they do I think it will be in old processes, not even 28nm, so they can integrate sensors and analog and wireless on the same chip. But more likely a lot of these will be small boards with microcontrollers, wireless and sensors on different chips. For example, take a look at the iFixit teardown of the Fitbit, which in its current incarnation is about one inch by quarter of an inch.

An important aspect of doing this sort of design is having enough microcontrollers with the right combination of features. You can’t afford to have twice as much flash as you need or too many unused functions. The Atmel microcontroller product finder shows that at present they have 506 different ones to choose from.

The most recent two are SAMA5D4, and SAMD21 which are specifically targeted towards wearables and IoT projects. These are the latest two products in the Atmel SAM D family.

One area of especial concern in this market is security since it is too dangerous to simply try and do everything in software on the microcontroller. Keys can be stolen. Software can be compromised if it is in external RAM. An area of particular security concern is to make sure that any JTAG debug port is secure or it can be used to compromise almost anything on the chip.

So what are these chips?


The SAMA5D4 is an ARM Cortex-A5 device with a 720p hardware video decoder. It has high security with on-the-fly capability to run encrypted code straight out of external memory, tamper detection, secret key storage in hardware, hardware private and public key cryptography and ARM TrustZone. It supports both 16 and 32 bit memory interfaces for maximum flexibility. It is targeted at applications that require displays, such as home and industrial automation, vending machines, elevator displays with ads, or surveillance camera playback.

The SAMD21 is the latest Atmel microcontroller based on the ARM Cortex-M0+ but in addition to the features on earlier cores it also has

  • Full Speed USB Device and Embedded Host
  • DMA
  • Enhanced Timer/counters for high end PWM in Lighting and motor control – I2S
  • Increased I2C speed to 3.4Mbit/S
  • Fractional PLL for audio streaming

As you can deduce from the feature set it is target at medium end industrial and consumer applications, possibly involving audio and high power management .

And to show that this sort of market is starting to become real, at the salesforce Dreamforce event earlier in the week a keynote was given by Will.i.am of the Black Eyed Peas (and a founder of Beats that Apple recently acquired). In a chat with Marc Benoiff, CEO of salesforce.com, he has already leaked that he will introduce a wearable wrist computer that doesn’t require a phone to piggy-back on (unlike the Apple Watch).

Or watch the chat:

More information on the SAMA5D4 is here.


More articles by Paul McLellan…