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2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!

2015 3D ASIP conference: Thar’s Gold in Them Thar Hills!
by Bill Martin on 12-27-2015 at 4:00 pm

Last week I presented at the 3D ASIP EDA Tutorial and attended the Conference. In previous years, leading edge papers were presented from large companies pushing a solution to meet their needs. These companies had the resources and clout to achieve some astounding successes, but the lingering question was: “what other product development companies could achieve this unless the ecosystem would enable with lower risk as well as costs?”

This year’s conference was different. Rather than just large product development companies pushing their latest accomplishments, 4 aspects hit me:

[LIST=1]

  • Slight language changes used at conference.

    Last year, it was one solution ‘fits all’ (ie Through Silicon Vias “TSVs”) even though several presentations clearly showed that TSVs are costly and may not be suitable for all applications. This year, it was clear that most memory applications were TSV based but others were “TSVless”. Rather than one size fits all, all presenters stated that viable, cheaper alternatives are developed or being developed (application specific packaging).

    Take away: Ecosystem is maturing and companies recognize that one size might be too expensive/complex for many to use. Better to offer different solutions for different end markets.

    [LIST=1]

  • In previous years, only Foundries presented denser system solutions using silicon interposers.

    When a single solution exists, I often question if the end market exists or if it is large enough to support a growing ecosystem. When other competitive solutions enter the market, these new entries validate the market and product space. Similar to the mid 1980’s to mid 1990’ (ASIC ‘hey day’), after VLSI Technology and LSI Logic showed the Cost of Ownership (COO) and improved performance/area from using ASIC designs, any company that produced silicon quickly started offering ASIC solutions using standard cell and/or gate array solutions. At this year’s 3D ASIP conference, BOTH Foundries and OSATs presented solutions that addressed high density packaging. TSMC’s FOWLP as well as Amkor’s SLIM/SLIT offer different capabilities and business models addressing denser, complex packaging.

    Take away: The large ecosystem suppliers are recognizing that complex packaging is a ‘must’ and that to participate in this market, they must establish a presence. This is good news for product developers where competition will produce better and cheaper products for all. The downside, product developers will need to increase their planning analysis before committing expensive resources.

    [LIST=1]

  • DARPA’s DAHI program is not focused solely with commercially available CMOS process nodes (130nm down to 10nm).

    DAHI is mixing various III-V substrate materials into complex 2.5D systems. The IP integrated in their system design are fabricated in the III-V process nodes that did not compromise the IPs’ performances or functionalities. DAHI is choosing the best of each and then integrating into a heterogeneous 2.5D structure.

    Take away: for the leading/bleeding edge; homogeneous CMOS integration was ineffective and ‘boring’.

    [LIST=1]

  • Although not huge, this year’s (pre) registered attendance was equivalent to last year’s registered plus last minute walk in registrations. I do not have the totals but I assume attendance grew.Several attendees mentioned during their introductions that this was their first time attending and they were there to understand available capabilities.

    Take away: Many companies are starting their discovery process and many will use homogeneous 2.5D products/services in the 2016-17 time frames. By 2018, many will start using heterogeneous 2.5D capabilities demonstrated by DARPA’s DAHI program.

    The end consumers will be the benefit from all of these packaging advancements with more powerful, less power hungry, lighter and cheaper products. The future looks bright, LED bright.

    Notes:
    https://en.wikipedia.org/wiki/M._F._Stephenson


  • Networking through Dark Silicon Power Islands

    Networking through Dark Silicon Power Islands
    by Don Dingee on 12-27-2015 at 7:00 am

    For decades, tracing back to the days of Deming, the way to tackle complex engineering problems has been the pareto chart. Charting conditions and their contribution to the problem leads to mitigation priorities.

    In the case of SoC power management, the old school pareto chart said the processor core was the biggest power hog and needed to be managed first. The industry developed lower power cores, dynamic voltage and frequency scaling (DVFS), power and clock gating, big.LITTLE clusters, and lower leakage transistors and processes. Power got lower.

    But, did it get better? In the world of dark silicon, where there are bazillions of transistors and uncertainty over exactly who is doing exactly what to whom at any given time, it can be very hard to say. (Batterygate, the story of the difference between Apple A9 as fabbed at Samsung and TSMC, is a great example.) Techniques to manage power become increasingly difficult. More importantly, if we look at a typical SoC, the processor core may have several challengers on the new school power consumption pareto chart.

    When the CPU cluster no longer dominates power usage, CPU-centric approaches to power management run into limits quickly.

    Managing IP hardware blocks as power/clock domains illustrates the problem. Setting up boundaries at bus interfaces and creating power islands is tempting, but inefficient using only a conventional interconnect. If an IP block were independent, fine grain and automatic coarse grain clock gating would be enough to slow or shut down an idle block.

    In complex designs, IP blocks are highly interdependent, especially if a network-on-chip is used. Fabric must remain powered if any attached block is still powered, meaning the fabric is “always-on” or needs partitioning with many wires at the domain crossing. If there are many transactions between blocks, idling a target may actually be counterproductive, causing system-level congestion and power thrashing as blocks are constantly turned on and off.

    A better approach is to group the IP into affinity domains that are on or off together, and partition the domains across a minimally wired hardware interface with a software power management protocol. The catch is there is no industry standard scheme for this. ARM has defined several channels in AMBA, including C-, P-, and Q-channel, with each serving incompatible needs and not compatible with other stuff. Using these hardware channels does little for the software side. If a design team controlled all the IP blocks and could integrate these channels into each block accordingly, it might be possible to use them, but it would take a sizable design team working on just power issues – something most SoC design efforts cannot afford.

    Using a NoC is something most SoC design efforts can afford, and the SonicsGN architecture strongly comprehends power management. Redrawing the partitioning into power islands including the network components captures three huge benefits.

    First, the wires in the hardware interface are greatly reduced – in the SonicsGN case, to a 4-wire power management interface. There is a power down request and acknowledge, and an auto wake request and enable, setting up a wake-on-demand function (similar to Ethernet wake-on-packet capability).

    Second, the NoC knows what its traffic looks like and can manage it safely. Software can look at in-flight transactions across the network and make sure they reach their target before it is idled, rather than abruptly shutting down a block unexpectedly. This amounts to a power flush operation, where initiators vote and paths to a target are cleared prior to idling. Initiators can then handle a request to turn a target block back on. If the network is fast enough, the target block can come back on before the driver receives an error – virtually appearing on.

    Third, all this management capability happens in the NoC and software without extensive modifications to hardware IP blocks to implement the protocols. Designers can choose their power management style, using gating techniques in combination with the channel-based approaches and the SonicsGN capability.

    Using the Sonics power islands approach, designers have fewer limits and more capability in power management, without massive investments tied up in creating proprietary schemes. Sonics teams remain abreast of power management developments, and continue advancing their SonicsGN architecture to enable the latest ideas. By staying in the NoC and out of each IP block (some of which may be very, very dark in power management terms), IP block obsolescence or reengineering is avoided should power management tactics change.

    Related Blog


    Self-driving Connected Taxis Insights from Patents

    Self-driving Connected Taxis Insights from Patents
    by Alex G. Lee on 12-26-2015 at 4:00 pm

    Japanese company Robot Taxi Inc. announced that it will start trials with self-driving taxi service beginning in 2016. US20150339928 illustrates the system for operating the autonomous vehicles taxi service. A user can request a taxi service using an application that is running on the user’s mobile device. The taxi service request can include the number of passengers to ride in the autonomous vehicle and a requested vehicle type etc. The taxi service control system receives the taxi service request from the user’s mobile device. The taxi service control system selects an autonomous vehicle from the operating autonomous vehicles to perform the taxi service for the user.

    The taxi service provides the picking up the user at a pickup location at a selected pickup time and dropping off the user at a drop-off location. The pickup location can be a current location associated with the mobile device or a specific location defined in the taxi service request. The taxi service control system selects an autonomous vehicle that is currently available to perform the taxi service from the list of autonomous vehicles based on the autonomous vehicle’s current proximity or distance to the pickup location. The selected pickup time for the taxi service can be an upcoming time. The taxi service control system identifies an autonomous vehicle that is available at the selected pickup time from the list of autonomous vehicles.

    After the autonomous vehicle is selected, the taxi service control system schedules the autonomous vehicle to perform the taxi service for the user at the selected pickup time. The taxi service control system sends a confirmation to the user that requested the taxi service, via the application on the user’s mobile device. The taxi service control system notifies the user when the autonomous vehicle is near the pickup location.

    When the autonomous vehicle arrives at the pickup location, the user can be granted access to the autonomous vehicle upon providing a form of authentication. The autonomous vehicle selects the best route to drive the user from the pickup location to the drop-off location. The route can be optimized to reduce a distance traveled or an amount of time to perform the taxi service. The user can request for the route to be altered when the autonomous vehicle is traveling to the drop-off location. The taxi service control system calculates the cost associated with the taxi service. The taxi service control system, using bank account information associated with the user, charges the user for the taxi service.

    US2015015849 illustrates the central monitoring system to control the autonomous taxi vehicles. The monitoring system receives inputs from the vehicle traveling on a road in real-time. The inputs include information regarding the environment surrounding the vehicle and other surrounding vehicles. Based on to the inputs, the central monitoring system determines if the monitored vehicle is approaching a hazardous condition. When it is determined that the monitored vehicle is approaching a potentially hazardous condition, the central monitoring system actuates the vehicle controls system (such as a brake system or steering system or collision avoidance system of the vehicle) to avoid or minimize the risk of the hazardous situation. The vehicles communicate with the central monitoring systems and other vehicles via the vehicle communication system.

    More articles from Alex…


    Micron Misses (MU) – No surprise – Needs focus on NAND/XPoint not diving DRAM

    Micron Misses (MU) – No surprise – Needs focus on NAND/XPoint not diving DRAM
    by Robert Maire on 12-26-2015 at 12:00 pm

    We are surprised that everyone is surprised at DRAM, DRAM oversupply/weak demand is systemic so Micron needs to focus on NAND/XPoint.We find it somewhat amusing that many “analysts” were caught off guard about the weakness in Microns results and poor guidance. Why would you think DRAM would be OK???…Have you paid attention to prices?

    Micron had a more or less in line quarter but guided sharply lower for fiscal Q2 ending February, sending the stock down 5%- based on DRAM issues

    Anybody who has been watching Semis for more than a few years should know that calendar Q1 is always the weakest quarter for memory pricing. We are in the postpartum depression after the big ramp for the holidays coupled with several weeks lost business due to Chinese New Years. DRAM has historically under performed in calendar Q1 and this season has been weak to start off with, so why would analysts or investors think that some miracle would happen? Look at past pricing…history repeats itself…and seasonality is stronger than ever given the clockwork-like release of Apple’s iPhone every fall.

    Demand/pricing is still weak…
    DRAM is and has always been the ultimate commodity in the semiconductor space. While true that there are many variants of DRAM these days the reality is that it acts like a commodity because it is one.
    It is a simple, standard stupid balance of supply and demand that governs pricing and right now demand is not all that great while supply is. How you could conclude that this would lead to good results for a DRAM maker is beyond me.

    PCs and Windows 10 didn’t help and smartphones/tablets aren’t either…

    In the bad old days every new version of Windows significantly increased the amount of DRAM needed as the “bloatware” increased. This is certainly not the case with Windows 10. Nor did we see an uptick in sales for PCs that could have driven DRAM so the only other significant place would come from mobile devices increasing DRAM needs and it doesn’t appear to be the case either. So where is the demand to suck up the extra capacity that has come on line over the last year or so???

    Will Saudi Arabia increase oil production to combat low prices???
    We don’t think so….So the odds of Micron dumping more CAPEX into DRAM capacity is also foolish. Maybe I would put money into reducing production costs to try to prop up margins but increasing capacity is throwing fuel on the fire sale. Sure, moving to the next technology node will help costs but without a significant change in demand its going to be tough sledding going forward.

    NAND and XPoint are where its at…
    NAND seems to be the ultimate price elastic commodity, the cheaper it gets, the more we buy. For SSDs, smartphones, tablets etc; I keep buying bigger thumb drives and SD cards. In the NAND market at least Micron has a chance to see more progress and if it can ramp the 3D NAND product, should have a market to sell into to, which while constantly falling does have increasing demand to limit the downward trajectory.

    XPoint is the real differentiated product…
    If we were Micron management, we would be focusing our attention and spending on XPoint which holds the promise of differentiation and enhanced technology versus the commodity DRAM and NAND markets.XPoint is a potential winner and needs to be ramped ASAP. It could command better pricing and margins with less or no competition. It is a long term solution to being stuck in the cyclical roller coaster of commodity product price swings.

    Waiting on NAND and XPoint but with a floor in the stock

    We would be hard pressed to put money to work in shares of Micron near term. We likely will have some time before we see positive results from NAND or XPoint, as the company indicated the second half. We do think there is a floor under the shares as if they get too cheap they get a bulls eye painted on their back and become an M&A target. Perhaps if the shares went down too much Intel could notice after Altera is done. We don’t expect China to come back in any time soon….



    Connections to Internet Drives Semiconductors

    Connections to Internet Drives Semiconductors
    by Pawan Fangaria on 12-26-2015 at 7:00 am

    We are going to see a big reversal in what connects to the internet in next five years. At the start of this century there were about 488 million internet connections; 85% of those were connected to people for web browsing, e-mails, on-line services etc. and only 15% were used for embedded systems, remote sensing and control, and M2M communication.

    Can you imagine what would be the composition of internet connections in 2020? It will be a complete reversal of what we have seen in 2000; 85% of total connections will be through web-enabled devices in various segments including automotive, home, consumer, industrial etc. and only 15% will be to human individuals. And that would sum up to a total of 30 billion internet connections.

    The new connections to IoT (Internet of Things) are increasing in double digits almost every year.


    I like Texas Instruments CEO, Rich Templeton’s vision around this and forming his company’s strategy according to this. A few years ago, he revealed about his company’s strategy in a briefing in one of the investors forums. This was articulated as – the world is changing from number of persons per device to number of devices per person, so it makes sense to catch those devices’ market.

    According to IC Insight’s report, the systems revenue for applications connecting to the IoT will nearly double, reaching about $124 billion by the end of 2019. And the pure IoT applications market will see a CAGR of 19.2% reaching more than 31 billion by the end of 2019.


    The IC sales in IoT market will grow at a CAGR of 15.9% whereas the OSD (Optoelectronics, Sensors and Discrete) semiconductors are expected to grow at a higher CAGR of 26%, compounding the overall semiconductor growth rate in IoT applications to a CAGR of 19.2%. Among the IC sales, the top drivers will be microcontrollers and SoC microprocessors followed by memories. It’s understandable from an IoT standpoint.

    There is no doubt internet infused a significant growth trajectory for semiconductors. Over last few decades we have seen a phenomenal growth in semiconductor business due to cellphones and then smartphones which connect to internet primarily for human users.


    Smartphone remains the largest driver for semiconductor IC market; however the smartphone market is now maturing and is expected to stay more or less stagnant. Then what will fuel further growth in semiconductors?

    It’s the number of connections to internet through devices other than smartphones. We are already seeing wearable segment of IoT having large growth at a CAGR of ~59% to reach $15.2 billion by the end of 2019. Apple watch has to be given thumbs up on this. Connected automotive is expected to show a CAGR of 31.5%. Then there are other segments of IoT such as medical, home, industrial, business, and others that will connect to internet and surprise us.

    The semiconductor industry is at an edge of another transformation. We have seen large scale M&A activities this year which is expected to continue next year. And we will see a different direction in transformation now. Stay tuned for my article on future semiconductor landscape.

    The IC Insights reports referred in this article can be found hereand here.

    Pawan Kumar Fangaria
    Founder & President at www.fangarias.com


    DSP gives Project Tango a power dip

    DSP gives Project Tango a power dip
    by Don Dingee on 12-24-2015 at 12:00 pm

    Google’s Project Tango is a prime example of a sophisticated application pushing the boundaries of what is possible within the power envelope of a mobile device. Its objective is to combine 3D motion tracking with depth sensing to understand how a device is moving and gauge its surroundings precisely. Continue reading “DSP gives Project Tango a power dip”


    The "Great Acceleration"

    The "Great Acceleration"
    by Arthur Hanson on 12-24-2015 at 7:00 am

    The “Great Acceleration” is upon us. On all fronts technology in everything is advancing at an ever accelerating rate due to improvements in education/training, increased power and functionality of hardware, software, access to information(Google, technical publications, etc.) prototyping techniques (3D Printing, sophisticated design and test software for literally everything from software, to semis, to physical objects and devices), more people working on literally everything from every angle with the net providing collaboration and off loading of just about any task. All this coupled with an ever increasing ways of raising capital and assembling talent and you get to where we are now, Rapid acceleration of any task we can even imagine, including the very problems acceleration creates.

    All this is leading to the ability to have everything in abundance if we so choose. The problem is that most individuals, social structures and government can’t keep up and this fundamental change to abundance, leading to increased instability and dislocation. The semi and software sectors are leading the way and are advancing so much faster than everything else we have dislocations that while creating great things also create great instability and damage. Organizations, companies, investors and individuals that master this will do well, while many will suffer from the dislocations and instability.

    To take full advantage of the opportunities before us will not only require changes in us, but all the organizations we deal with. A Gallup poll done in September found 75% of all adults consider corruption pervasive throughout our government and justly so. Sadly much of this is just a failure of not wanting to adapt to the accelerating changes. It is not just government that has problems, but our very social structure for government is just a reflection of the society on which is still based on the slower moving progress of the past.

    Since the semi sector is among the leaders in accelerating change, we can no longer work in a vacuum indifferent to the world around us. With knowledge and power go responsibility and to forget this will have dire consequences for everyone. When we at the forefront of change if we forget the consequences and applications of what we do, we can literally sink the ship. It is at this point we must remember “When the ship sinks, first class goes down too”.

    Technology can bring one quality that will help everyone, transparency, which is the key to honesty and integrity. Transparency also has the awesome power to solve problems by making them apparent. It is critical that transparency is maintained so we can solve problems before they become dangerous. Already it is easy to see where new forms of finance have put many people and governments in dangerous straights. Many things can now become obsolete well before the financing to pay for them is completed. There is nothing we can’t solve and the semi sector can/will play a key part in the solutions, many are already well under development. Bellow is a brief partial list of examples of solutions under way.

    Energy: solar in many forms, wind, underwater turbines, nuclear, stripping hydrogen from hydrocarbons, nuclear, advanced fracking for not only oil/gas but geothermal

    Food: advanced forms of algae and microbial that already produce 40 times what current agriculture land produces with the potential of 700 times. We might not eat this, but most food is grown for animal feed. This would solve food, land and water problems.

    Water: advanced desalinization, recycling of waste water to drinking quality

    Transportation: ultra efficient cars, ships, planes and trains

    Medical:vastly lowered costs and increased productive life span currently being literally attacked from almost every vector

    Robotics/AI: will open up the oceans with vast resources of all types, improve and lower education costs, free us up for far more productive and pleasurable pursuits and greatly leverage our labor (creating more dislocation and challenges)

    Efficiency: new glass, numerous new engines, hybrid systems, new insulating materials, new reflective surfacing coatings, etc. etc., but most of all in all processes from creation to production to distribution to use and disposal.

    Transparency and flexibility will be key if we are going to deal with these changes without massive social conflict and with semiconductors being at the heart of much of this, this is the place to start and should be taken into account from the inception of any new technology which is just another form of power and should be treated and respected as such for technology without wisdom can be very dangerous. The semi/mems sector is the leader in acceleration, so it is up to us to ask these critical questions and develop solutions.


    A Synergistic Chip-Package-System Analysis Methodology

    A Synergistic Chip-Package-System Analysis Methodology
    by Tom Dillinger on 12-23-2015 at 4:00 pm

    Looking back, 2015 was a significant year for mergers and acquisitions in the EDA industry. The Semiwiki team maintains a chronology of major transactions here.

    As I was reviewing this compendium, one of the entries that stands out is the acquisition of Apache Design Solutions by Ansys, Inc. a couple of years ago.

    At that time, there was some uncertainty expressed as to the synergy between the two firms, one being rather system-centric and the other focused on the analysis challenges of deep submicron chip designs. Many assumed that Apache would be an acquisition target of the purple, red, or green EDA company, rather than Ansys.

    Ansys is a premier supplier of package, board, and system-level tools for electromagnetic and mechanical analysis. The HFSS finite-element analysis and SiWave simulation tools are the gold standards for extraction and simulation of complex time- and frequency-domain characteristics of package/board traces, for signal integrity and power integrity (SI/PI) loss assessment. As SerDes channel data rates continue to be pushed aggressively by system designers, the required accuracy of the SI models necessitates the precise models available from HFSS. The Ansys Multiphysics tool suite provides several (coupled) analysis capabilities:

    • mechanical analysis of materials stress and deformation to evaluate attach and assembly reliability
    • electromagnetic propagation analysis for EMI compliance, and
    • thermal modeling to ensure reliable system cooling

    As a startup in the early 2000’s, Apache developed the leading RedHawk toolset for chip-level IR voltage drop and electromigration analysis. The on-chip power domain management techniques that were rapidly being adopted demanded a more sophisticated IR and EM analysis methodology. The dynamic nature of power domain cycling to different cores and IP on-chip necessitated more focus on RLC extraction and local switching activity measures, including power-gating related current transients. Yet, the separation of chip and package/board analysis resulted in the use of simplistic “budgets” for higher-level losses for chip signoff.

    Since the acquisition, the synergy of the Ansys-Apache combination has become very evident, as the merged resources have continued to refine a comprehensive chip-package-system (CPS) modeling and analysis methodology, including:

    • power distribution network (PDN) analysis
    • simultaneous I/O switching activity analysis
    • EMI analysis
    • chip I/O electrostatic discharge analysis
    • thermal analysis

    The key to this approach is the generation of various chip abstract models, which are promoted and integrated into the package/system analysis framework. The following two figures illustrate the CPS analysis strategy.

    This figure depicts the chip analysis activity, and the derived abstract models.

    This figure illustrates how the abstracts are incorporated into package/board analysis.

    As an example, the power integrity analysis methodology focuses on traditional chip power grid sign-off, including identification of any local switching hotspot issues. A sophisticated RLC model of the chip and package power distribution network is then incorporated into the Chip Package Model (CPM) abstract. The CPM includes pad-level switching currents and capacitances, as well. The “chip-aware” board power distribution analysis incorporates the CPM. Using SiWave, the system designer can now optimize pin assignment, board power plane definition, decoupling capacitor selection and placement, and integration of the voltage regulator module(s).

    For signal integrity (and simultaneous switching) analysis, the Chip Signal Model (CSM) abstract is used. The CSM methodology extends the traditional IBIS model approach to include I/O pad ring parasitics, and significantly, the I/O power noise impact on circuit behavior.

    For electrostatic discharge reliability analysis, the wafer foundry’s design enablement team will provide ESD design guidelines and related rule checks to IP developers focused on SerDes, memory interface, and general purpose I/O circuits. However, customers may have unique robustness requirements for HBM, MM, and CDM discharge events, outside the characterization range used by the foundry. The Ansys methodology includes generation of the Chip ESD Compact Model (CECM) abstract. Designers can now evaluate ESD protection in a complete system environment model for their application, through the board and package pins.

    An analysis methodology that is emerging as crucial to circuit, signal, and system reliability is the thermal profile of the chip-package-system implementation. The importance of accurate thermal modeling is magnified by the increasing use of multiple die-in-package offerings – e.g., 2.5D and 3D designs with various interposer and multi-plane signal redistribution layers. The Chip Thermal Model (CTM) abstract is integrated into the larger Ansys thermal analysis toolset, as illustrated below.


    Ansys has continued to expand their CPS methodology, incorporating accurate and detailed chip abstract models into their industry-leading package/board-level tool suites. The synergy between the chip and system tools offers a comprehensive modeling environment, which is absolutely critical for SI, PI, EMI, ESD, and thermal reliability analysis.

    There is no longer any doubt that the Apache acquisition belongs in the “win-win” column. For more details on the Ansys/Apache CPS methodology, links to technical papers are available here.

    -chipguy


    Leveraging HLS/HLV Flow for ASIC Design Productivity

    Leveraging HLS/HLV Flow for ASIC Design Productivity
    by Pawan Fangaria on 12-23-2015 at 12:00 pm

    Imagine how semiconductor design sizes leapt higher with automation in digital design, which started from standard hardware languages like Verilog and VHDL; analog design automation is still catching up. However, it was not without a significant effort put in moving designers from entering schematics to writing RTL, which could be automatically verified and synthesized to gate level netlist.

    Today, the designs have grown bigger and more complex with a complete system appearing on a chip. It’s a tedious task writing RTL for a complete chip and verifying it with a single verification approach. Design and verification productivity is at stake, which needs urgent improvement through change in design methodologies.

    Higher levels of abstractions are possible where the system can be described in higher level languages like ‘C’ or SystemC, which can be simulated several hundred times faster than RTL. This provides a great opportunity for a quick architectural exploration at the top level for best PPA (Power, Performance, and Area) with the least investment of resources and time. This novel approach is taking longer than expected in its proliferation across the semiconductor design industry. However, there are promising tools and methodologies, which are being adopted by leading SoC and IP design companies and are being deployed in their standard design flows. Let’s review how this is being done and what more needs to be done to bring this approach in the main stream of SoC design and verification.

    Qualcomm, the largest fabless semiconductor company has established a standardized high-level synthesis (HLS) and high-level verification (HLV) based design flow throughout the company. The flow has been successfully used in several image processing, video processing and other IP of different complexities; and chips taped out using those IP. This is an outcome of Qualcomm’s multi-year work with Calypto (now Mentor Graphics). Qualcomm also presented about their HLS/HLV based methodology in the 52[SUP]nd[/SUP] DAC.


    Mentor’s Catapult[SUP]®[/SUP] 8synthesizes C++/ SystemC into an optimized RTL. Testing the synthesizable C++/SystemC catches bugs more quickly, because the code simulates hundreds of times faster and is typically 1/5[SUP]th[/SUP] the number of lines of comparable RTL. Much less debugging is then needed on the generated RTL, which accelerates verification downstream and reduces the total verification time by half. The RTL is also power optimized through Mentor’s PowerPro[SUP]®[/SUP] optimization and analysis technology under the hood in Catapult 8. The verification starts very early in the design cycle. The reference model in C/C++ is refined and then cleaned through SLEC[SUP]®[/SUP] CPC, the C property checking tool, which detects all static errors in the code and also checks the assertions and cover points set by the user. The HLS model thus produced is easily synthesized into an optimized and correct RTL that can easily go through the downstream design flow. Also SLEC (Sequential Equivalence Logic Checker) can formally verify the generated RTL against the source C/C++.

    A homogeneous system in C/C++ provides quick and extensive architectural exploration and verification closure through HLS/HLV methodology. The test infrastructure used during HLV can be reused during RTL verification, thus improving the productivity of downstream verification flow as well.


    Starting with an algorithm, the architecture can be appropriately divided between hardware and software. The hardware can be modelled further into synthesizable and non-synthesizable ‘C’. The algorithmic hardware model thus created is synthesized using Catapult HLS tool and verified in ‘C’. The ‘C’ regression thus created can be complemented with RTL regression during RTL verification.

    By making small changes in the code of algorithmic model or in the constraints on the synthesis tool, one can quickly generate new design architecture and compare it with the older ones. This provides an opportunity to quickly iterate over several architectures and determine the best architecture for a design. Also the designs with different power profiles can be reviewed with this approach, which is not possible with traditional RTL flow because power data becomes available very late in the design cycle.


    Complete verification coverage can be attained in 3 stages; 100% functional/structural coverage during C/SystemC verification, 100% functional coverage during RTL functional verification, and complete structural coverage during RTL structural verification. Any uncovered hole must be determined to be unreachable.

    Qualcomm has used an established C codebase for certain designs by simply changing the target library for technologies ranging from 65nm to 14nm. The enhancements and new features can be easily added onto that codebase. It’s clear that the ECO flow is quite fast and efficient. So, the changes can be done quite late in a design cycle.

    Well, HLS/HLV methodology works very efficiently at a higher level (C/C++/SystemC) and complements very well with the downstream RTL flow. However, design signoff still takes place at RTL and gate level due to limitations in current HLS toolset and methodology, which works mostly with algorithmic models at IP level.

    While talking with Bryan Bowyer, Director of Engineering at Calypto Systems Division of Mentor Graphics, I learnt that they are working with partners to make SLEC more generic to check equivalence between ‘C’ and RTL. Also, Mentor is driving an effort going on in Accellera SystemC Synthesis Working Group to standardize HLS flow through a common synthesizable subset of SystemC across the industry.

    The way design signoff has moved up from gate to RTL level today, we hope the signoff moves further up to ‘C’ or SystemC level in future.

    For more details on Qualcomm’s HLS/HLV methodology, a whitepaper at Calypto’s website can be referred HERE.

    Pawan Kumar Fangaria
    Founder & President at www.fangarias.com


    HDCP 2.2, Root of Trust, Industry’s First SHA-3 Security IP from Synopsys

    HDCP 2.2, Root of Trust, Industry’s First SHA-3 Security IP from Synopsys
    by Eric Esteve on 12-23-2015 at 7:00 am

    Did you know that by 2020 90% of cars will be connected to Internet? Great, but today, there are already more than 100 car models affected with security flaws (Source: theguardian.com, 2015). That 320 apps are installed on average smartphone device? It would be a complete success, but 43% of Android devices allow installation of unverified apps (Source: Slideshare.net, 2015). Let’s talk about IoT, according with HP Fortify study made in 2014, 70% of most IoT devices contain serious security vulnerabilities. These statistics sounds like security is still considered by the system designers as a luxury option, like was for example the simulation of an electronic design in the 1980’s. Just before efficient and user-friendly simulators become to be used by most of the design team and EDA become a real market. The dissemination of connected cars and devices is exploding, but we are still in the early days of security IP systematic usage.

    The demand for an always more connected world is pushing threats on the increase, the scenario are multiples. You may expect to suffer from theft & replacement of credentials, rogue devices connected to the internet, attacks to other devices connected to a network, happening at home or at your professional environment. In the industry, companies may be weakened by software and IP theft or tampering, cloning or snooping of sensitive data. To make it short, individuals and companies need to be protected when using connected systems or these systems need to integrate the most efficient security IP to protect users.

    Elliptic has been completely focused on security since the company foundation and the acquisition by Synopsys has allowed furthering extending the security IP port-folio development.

    Cryptography IP
    Supporting the latest standards like AES, SHA-2, SHA-3, PKA or TRNG, these cryptographic algorithms can be implemented in HW or SW and highly configurable for optimal size or performance. For example, pipelined AES core variants scale to 100+ Gbps performance. Integrating security IP enable the development of customized IP subsystems or building blocks for security protocols accelerators.

    Platform Security: tRoot
    Synopsys tRoot is a secure hardware Root of Trust, an embedded security module providing chipsets with their unique identity that can’t be tampered with. tRoot is made of hardware plus firmware and provides safe environment to create, store and manage secrets critical for the system, like keys, certificates and other data. You can see a typical tRoot implementation in an application processor in the above picture.

    Security Subsystems: Content Protection
    Elliptic is providing HDCP 2.2 content protection IP for Miracast, HDMI and DisplayPort. This IP, certified both for Transmit and Receive, self-contain Root of Trust, supports firmware upgrade and can be easily configured for different high resolution uncompressed content.
    HDCP 2.2 is WiFi certified Miracast solutions in production devices, protecting the link between Miracast devices. This IP solution is integrated with major Miracast/WiFi Display stacks.

    We think that the security IP segment is just starting to grow, we may expect security IP to penetrate most of the connected applications. As an end user, I really hope security IP to become ubiquitous!

    More about Synopsys security IP here

    From Eric Esteve from IPNEST

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