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SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm production at Samsung and TSMC, and Intel plans to introduce EUV with their 7nm process next year. Although EUV is ramping for 7nm there is still a lot of room for improvement in the technology and going forward 5nm and 3nm will introduce additional challenges.
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TSMC Q1 2019 Earnings Call Discussion!

TSMC Q1 2019 Earnings Call Discussion!
by Daniel Nenni on 04-19-2019 at 7:00 am

It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.

TSMC CEO C.C. Wei again led the call with a prepared statement. This time I will paste the entire statement (minus the packaging stuff) with my embedded comments.

  • Thank you, Lora. Good afternoon, ladies and gentlemen. Let me start with our near-term demand and inventory. We concluded our first quarter with revenue of TWD 280.7 billion or USD 7.1 billion, in line with our revised guidance. Our business in the first quarter was impacted by three factors: first, the overall global economic condition, which dampened the end market demand; second, customers are ongoing inventory adjustment; and third, the high-end mobile product seasonality. Meanwhile, the net effect from the photoresist defect material incident also impact our first quarter revenue by about 3.5%.

My question here is: Who is liable for this defect? Is the supplier being held accountable? Accounts of this incident from South Korea painted TSMC as negligent which I have found to be fake news.

  • Moving into second quarter this year. While the economical factor and mobile product seasonality still linger, we believe we may have passed the pattern of the cycle of our business as we are seeing customers’ demand stabilizing. Based upon customer indications for their business and wafer loading in second quarter, we also expect our customers’ overall inventory to be substantially reduced and approach the seasonal level around the middle of this year.

Personally, I feel the second quarter will be stronger than expected based on 2018 year end CEO comments. It is better to under predict than over predict and I believe that is what is happening here. Let’s not forget the Q1 2019 semiconductor guidance we previously published:

  • In the second half of this year, TSMC’s business will be supported by this year’s inventory base as well as strong demand from our industry-leading 7-nanometer technology, which support high-end smartphone new product launches, initial 5G deployment and HPC-related applications. For the whole year of 2019, we forecast the overall semiconductor market is good in memory as well as foundry growth to both be flattish. For TSMC, we reiterate that we expect to grow slightly in 2019.

To me this is low single digits but closer to 5% than 1%. Here are the previously published analyst forecasts for 2019:

  • Now let me update the photoresist material incident. On February 15, in order to ensure quality of wafer delivery, TSMC announced it will scrap a large number of wafers as a result of a batch of bad photoresist material from a chemical supplier. This batch of photoresist contain a foreign polymer that created a desirable – undesirable effect and resulted in yield deviation on 12-and 16-nanometer wafers at Fab 14B.
  • We have since taken corrective action to enhance our defenses and minimize future risk. Our actions including the following: improved TSMC’s own in-house incoming material, conforming test and controls; upgrade control and methodology with all suppliers for incoming material quality certification; establish robust in-line and off-line monitoring process to prevent defect escape.

TSMC does not point fingers but again I would like to know more about this event.

  • Now I will talk about our N5 status. Our N5 technology development is well on track. N5 has entered risk production in first quarter, and we expect customer tape-outs starting this quarter and volume production ramp in first half of 2020. With 1.8 times logic density and 15% speed gain and an ARM A72 core compared with 7-nanometer, we believe our N5 technology is the most competitive in the industry. With the best density performance, power and the best transistor technology, we expect most of our customers who are using 7-nanometer today will adopt 5-nanometer. With N5, we are expanding our customer product portfolio and increasing our addressable market. Thus, we are confident that 5-nanometer will also be a large and long-lasting node for TSMC.

To be clear TSMC 5nm chips will be in Apple products next year. I have read reports that TSMC released 6nm because 5nm was late which is fake news. I know many companies that are taping-out at 5nm and it is on track and meeting expectations. More details will be available on SemiWiki after the symposium so stay tuned.

  • Now I’ll talk about the ramp up of N7 and N7+ and introduction of N6. We are seeing strong tape-out activity at N7, which include HPC, IoT and automotive. Meanwhile, our N7+, which adopts EUV for few critical areas, has already started volume production now. The yield rate is comparable to N7. We’ll reaffirm N7 and N7+ will contribute more than 25% of our wafer revenue in year 2019.

If you look at TSMC’s Q4 2018 revenue split, 50% is FinFET processes and 50% is mature CMOS nodes. In Q4 2017 FinFET processes were 45% and in Q4 2016 it was 33%. In Q1 2019 FinFET revenue dropped to 42%, not a good sign, let’s blame cryptocurrency.

  • As we continue to improve our 7-nanometer technology and by leveraging the EUV landing form, N7+, we now introduce N6 process. N6 has three major advantage. First, N6 have 100% compatible design rules with N7, which allows customer to directly migrate from N7-based design, which substantially shorten the time-to-market. Second, N6 can deliver 18% higher logical density as compared to N7 and provide customer with a highly competitive performance-to-cost advantage. Third, N6 will offer shortened cycle time and better defect density. Risk production of N6 is scheduled to begin in first quarter year 2020 with volume production starting before the end of 2020.

N6 is a little bit confusing thus far. Hopefully we can get it cleared up at the TSMC Symposium. From what I understand N7 and N7+ are not design rule compatible since N7+ has EUV. N6 is N7+ with an additional layer of EUV which helps with density. Saying N6 and N7+ are design rule compatible makes sense but is N6 really design rule compatible with N7?

  • Finally, I will talk about the HPC as our most important growth driver in the next five years. CPU, AI accelerator and networking will be the main growth area for our HPC platform. With the successful ramp of N7, N7+ and the upcoming N6 and N5, we are able to expand our customer product portfolio and increase our addressable market to support applications, such as data center, PC and tablets. Meanwhile, we also see networking querying thanks to 5G infrastructure deployment over the next few years. We are truly excited about our growth opportunities in HPC. Thank you for your attention.

AI is a trending term on SemiWiki and readership is all over the map. I seriously doubt it will be a quick bubble like cryptocurrency or even a 10 year bubble like mobile. In my opinion AI will be with us for a very long time and it will consume leading edge wafers like a zombie apocalypse, absolutely.

From what I have heard EUV throughput is still ramping up so my fingers are crossed for 5nm. Hopefully EUV is covered in more detail next week at the TSMC Symposium. I will also get a refresh from our resident EUV expert Scott Jones. In fact, he has just posted an EUV blog from SPIE:

SPIE Advanced Lithography Conference – Imec and Veeco on EUV

Bottom line: The second half of 2019 will be good for TSMC and 2020 will be even better. My prediction today for TSMC in 2020 is back to double digit growth. Remember, now that Intel is out of 5G modems TSMC will get the modem business back from Apple next year via the 7nm QCOM modem plus other 5G modem business. 2020 will be the beginning of a beautiful 5G friendship.


Flex Logix InferX X1 Optimizes Edge Inference at Linley Processor Conference

Flex Logix InferX X1 Optimizes Edge Inference at Linley Processor Conference
by Camille Kokozaki on 04-18-2019 at 12:00 pm

Dr. Cheng Wang, Co-Founder and SVP Engineering at Flex Logix, presented the second talk in the ‘AI at the Edge’ session, at the just concluded Linley Spring Processor Conference, highlighting the InferX X1 Inference Co-Processor’s high throughout, low cost, and low power. He opened by pointing out that existing inference solutions are not optimized for edge requirements though high-end server solutions exist. Processing images one at a time, with fixed power budgets, using larger images, larger models, with higher prediction accuracy is needed. High end solutions are not optimized for edge inference. Since cameras see one image at a time, at the edge, batching is not practical. Even high-end devices perform less well at low batch sizes.

Flex Logix started off having embedded FPGA and interconnect programmable technology and is now using it as a foundation for their technology stack. The nnMax technology utilizes embedded FPGA that is integrated into SoCs and with density and performance like leading FPGAs, with XFLX [SUP]TM[/SUP], ArrayLINX [SUP]TM[/SUP], RAMLINX [SUP]TM
[/SUP]
Flex Logix Technology Stack consists of:

  • Hardware

    • InferX [SUP]TM[/SUP] PCIe Cards
    • InferX Edge Inference co-processor ICs
    • nnMAX [SUP]TM[/SUP] Inference IP
    • eFPGA/ Interconnect Technology
  • Software

    • TensorFlow Lite, ONNX
    • Software driver
    • InferX/nnMAX Inference Compiler
    • eFPGA place and route back-end

Inferencing customers needed large EFLX DSP MACs so a 1K nnMax tile was developed. A detailed look at the 1K configurable MAC Inference Tile shows the following architecture and features.


Winograd acceleration [SUP]1[/SUP] for INT8 provides 2.25x performance gain for applicable layers and is invoked automatically by nnMax compiler. The Tile is also programmed by TensorFlow Lite/ONNX with multiple models running simultaneously. The 1K tiles can be configured in any array size with configurable L2 SRAMs supporting 1-4 MB per tile and with a variable DRAM bandwidth through reconfigurable I/Os typically connecting x32 or x64 LPDDR4. The key advantage here is the ability to reconfigure ports and controls for the data path for each layer, and once configured, can run with ASIC-like performance, with routing to the memory and to interconnect, and with localized data access and compute.

Winograd acceleration speeds up 3×3 convolution with a stride of 1 by a factor of x2.25. Though the resulting architecture creates 2x larger weights and a more complex data path, nnMax performs the transformations on the fly, removing the weight penalties. Winograd is essentially free to the user from the performance perspective because they do not get any penalty in DRAM power or precision, but not free in hardware with only some additional bits in the multiplier.


Some layers have large intermediate frame sizes that may not fit in on-chip SRAM (e.g. YOLOv3 layer 0 outputs 64MB), resulting in DRAM writes and re-reads, putting a strain on DRAM bandwidth and potentially causing pipeline stalls when those layers are processed. To address this, multiple layers are run in parallel. In the YOLOv3 situation, Layer 0 and 1 are run simultaneously, avoiding the 64MB need to store with Layer 0 streaming directly into nnMax clusters processing Layer 1.

InferX X1 applications include edge devices such as surveillance cameras, robots, set-top boxes, edge servers like edge gateways and low-end edge servers.

The InferX X1 Edge Inference co-processor which runs at 1.067GHz on TSMC16FFC is scheduled for Q3 2019 tape-out with 8.5 TOPs, with 4K MACs, 8MB SRAM, x32 LPDDR4 DRAM, x4 PCIe Gen 3/4 lanes. Total dynamic worse-case power for YOLOv3, the most demanding, on PCIe Card, and including DRAM and regulators is 9.6W. InferX X1 silicon and PCIe cards will sample by the end of 2019. The typical power is 2.2 Watts on ResNet-50, and varies by model.

InferX X1 throughput is 3 to 11 times existing edge inference ICs and can be chained for higher inference throughput. Performance gain is greater on large models such as YOLOv2, v3. Furthermore, its throughput/Watt is 4 to 26 times better allowing edge devices to stay within their power budget.
The nnMAX compiler front-end flow performs the Neural Network model to soft-logic translation. The back-end flow performs place-and-route, retiming, pipelining and binary generation. The compiler first estimates performance, then accepts the X1 floorplan and TensorFlow Lite (soon ONNX) and automatically partitions the model across multi-layer configurations and computes performance, latency, MAC utilization, DRAM bandwidth per layer and per model.

During the panel discussion Dr. Wang was asked about complexity perception, he stressed that the architecture is simple, and the verification is not any more difficult than verifying an FPGA design. When asked about the memory requirements, he stated that since there is no way to store all parameters into SRAM in edge devices, you can try to train the model to be sparse or partition it over multiple devices. Certain aspects can also be serialized across multiple devices. When asked about the time it takes to reconfigure the fabric, the answer was about 1 microsecond per layer, allowing for a video processing 30 frames per second, with a model having 100 configurations, cycling through 3,000 configurations, 300 microseconds per layer and thus the user will not experience a drop in performance with, as designed, an acceptable hardware impact and complexity. When asked how one addresses models other than CNN, he said that embedded FPGA runs a lookup table from anything to anything. Most functions are not throughput intensive enough and FPGAs handle these beautifully. The activation function is all in the lookup table. Most functions have matrix multiplication or data movement and FPGAs are optimized for that. How you deliver enough bandwidth at the edge, when GDDR or HBM are not in the cards, was the reason why the architecture was designed the way it was so that not much DRAM is required.

Edge application is all about efficiency, and how much throughput one can get for a certain amount of power and certain amount of cost. The goal is to extract as much performance as possible and their solution is as close to a data center in performance while still in edge space. FPGAs typically have a problem with capacity because they try to map everything at once. Flex Logix has multiple configurations addressing the capacity issue where a certain amount of resources is required to map a model, with the compiler making decisions on how to multiplex data and what degree of parallelism to use based on how much resources are available and how much the model requires.

Geoffrey Tate, Flex Logix CEO, emphasized the ability of the reuse of their FPGA technology to deliver very high throughput inference capability for the more challenging models that the customers want to run at low power and low cost. The chip customer programs ONNX or TensorFlow Lite models and Flex Logix software takes care of the FPGA internals. The interconnect technology can reconfigurably program the non-blocking paths from memory on-chip through the hardware units like the MACs and back to memory giving much more efficient computation than other processor architectures.
___
1 Distinct from the conventional convolution algorithm, Winograd algorithm uses less computing resources but puts more pressure on the memory bandwidth. Flex Logix architecture mitigates that.


ML and Memories: A Complex Relationship

ML and Memories: A Complex Relationship
by Bernard Murphy on 04-18-2019 at 7:00 am

No, I’m not going to talk about in-memory-compute architectures. There’s interesting work being done there but here I’m going to talk here about mainstream architectures for memory support in Machine Learning (ML) designs. These are still based on conventional memory components/IP such as cache, register files, SRAM and various flavors of off-chip memory, including not yet “conventional” high-bandwidth memory (HBM). However, the way these memories are organized, connected and located can vary quite significantly between ML applications.

At the simplest level, think of an accelerator in a general-purpose ML chip designed to power whatever edge applications a creative system designer might dream up (Movidius provides one example). The accelerator itself may be an off-the-shelf IP, perhaps FPGA or DSP-based. Power may or may not be an important consideration, latency typically is not so important. The accelerator is embedded in a larger SoC controlled by maybe an MCU or MCU cluster along with other functions, perhaps the usual peripheral interfaces and certainly a communications IP. To reduce off-chip memory accesses (for power and performance), the design provides on-chip cache. Accesses to that cache can come from both the MCU/MCU cluster and from the accelerator, so these must be coherently managed.

Now crank this up a notch, to ADAS applications, where Mobileye is well-known. This is still an edge application, but performance is much more demanding from latency, bandwidth and power consumption standpoints. Complexity is also higher; you need to support multiple accelerator types to support different types of sensor and sensor fusion for example. For scalability in product design, you cluster accelerators in groups, very likely with local scratchpad memory and/or cache; this enables you to release a range of products with varying numbers of these groups. As you increase the numbers and types of accelerators, it makes sense to cluster them together using multiple proxy cache connections to the system interconnect, one for each accelerator group. In support of your product strategy, it should then be easy to scale this number by device variant.

Arteris IP supports both of these use-cases through their Ncore cache-coherent NoC interconnect. Since this must maintain coherence across the NoC, it comes with its own directory/snoop filters. The product also provides proxy caches to interface between the coherent domain and non-coherent domains, and you can have multiple such caches to create customized clusters of IP blocks that use non-coherent protocols like AXI, but can now communicate as a cluster of equals in the cache coherent domain. Arteris IP also provides multiple types of last-level cache including the Ncore Coherent Memory Cache, which is also tied into coherency management to provide a final level of caching before needing to go to main memory. For non-coherent communications, Arteris IP also provides a standalone last-level cache integrating through an AXI interface (CodaCache).

These ML edge solutions are already proven in the field: Movidius and Mobileye are two pretty compelling examples (the company will happily share a longer list).

Moving now to datacenter accelerators, memory architectures look quite different based on what’s happening in China. I’ve talked before about Baidu and their leading-edge work in this area, so here I’ll introduce a new company: Enflame (Suiyuan) Technology, building high-performance but low-cost chips for major machine-learning frameworks. Enflame is a Tencent-backed startup based in Shanghai with $50M in pre-series A funding, so they’re a serious player in this fast-moving space. And they’re going after the same objective as Cambricon, and Baidu with their Kunlun chip – the ultimate in ML performance in the datacenter.

I’ve also talked before about how design teams are architecting for this objective – generally a mesh of accelerators to achieve massive parallelism in 2-D image processing. The mesh may be folded over into a ring or folded twice into a torus to implement RNNs, to support processing temporal sequences. The implementation is often tiled, with say 4 processors per tile and local memory and tiles are abutted to build up larger systems, simplifying some aspects of place and route in the back-end.

Designs like this quickly get very big and they need immediate access to a lot of off-chip working memory, without the latency that can come with mediation through cache coherency management. There are a couple of options here: HBM2 at high-bandwidth but at high cost, versus GDDR6 at lower cost but also lower bandwidth (off-chip memory on the edge is generally LPDDR). Kurt Shuler (VP Marketing at Arteris IP) tells me that GDDR6 is popular in China for cost reasons.

Another wrinkle in these mesh/tiled-mesh designs is that memory controllers are placed around the periphery of the mesh to minimize latency between cores in the mesh and controllers. Traffic through those controllers must then be managed through to channels on the main memory interface, (e.g. HBM2). That calls for a lot of interleaving, reordering, traffic aggregation and data-width adjustments between the memory interface and the controllers, while preserving the benefits of high throughput from these memory standards. The Arteris IP AI-package provides the IP and necessary interfacing to manage this need. On customers, they can already boast Baidu, Cambricon and Enflame at minimum; two of these (that I know of) have already made it through to deployment.

Clearly there is more than one way to architect memory and NoC interconnect for ML applications. Kurt tells me that they have been working with ML customers for years, refining these solutions. Since they’re now clearly king of the hill in commercial NoC solutions, I’m guessing they have a bright future.


TechInsights Gives Memory Update at IEDM18 DRAM and Emerging Memories

TechInsights Gives Memory Update at IEDM18 DRAM and Emerging Memories
by BHD on 04-17-2019 at 12:00 pm

On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees.

This is the second part of the review of Jeongdong’s talk, we covered NAND flash technology in the last post. Jeongdong is a Senior Technical Fellow at TechInsights, and their subject-matter expert for memory technology. Before joining the company, he worked as a Team Lead in R&D for SK Hynix and Samsung advancing next-generation memory devices, so he knows whereof he speaks.
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Hogan Fireside Chat with Paul Cunningham at ESDA

Hogan Fireside Chat with Paul Cunningham at ESDA
by Bernard Murphy on 04-17-2019 at 7:00 am

If you’re in verification and you don’t know who Paul Cunningham is, this is a guy you need to have on your radar. Paul has risen through the Cadence ranks fast, first in synthesis and now running the verification group, responsible for about a third of Cadence revenue and a hefty percentage of verification tooling in the semiconductor industry. Since he was honored as one of the outstanding innovators under 40 at DAC 2017, you should realize he really is on the fast track and is likely to significantly influence how you will be verifying in the future. The ESD Alliance hosted an event recently at which Jim Hogan interviewed Paul, to help us learn more about this rising star and his entrepreneurial journey.

Paul is a fellow Brit/ex-Brit; there are a lot of us around (at least 5 at the ESDA meeting). He took his first degree (CS) at Cambridge, also rowed for the university, then stayed at Cambridge to get his Ph.D. in formal verification of asynchronous circuits. He was quite open about his journey of discovery in async circuits, saying he originally drank the Kool-Aid, believed this design style would conquer the world and decided he wanted to start a company to build compilers for self-timed chips.

Together with a co-founder, they started Azuro in Cambridge, raising ~$100k. Talking to prospects, they got a quick reality check between what is academically interesting and what can make serious money. They found that prospects weren’t interested in self-timed circuits but were very interested in better clock gating and useful skew. Paul/Azuro reworked their PowerPoint to reflect this reality and started doing deals with well-known companies. That woke up the big VCs; ultimately Benchmark Capital, who have a branch in London, put in $4M. Benchmark required, unsurprisingly, that Azuro move their HQ to the Bay Area (though there’s still an R&D operation in Cambridge, now driving clocks for Cadence).

Jim asked Paul what he learned from being a CEO. Pay attention here, would-be CEOs. He said that intense customer focus and agility to meet customer needs are primary. At the same time there’s a need for balance and a broad set of skills. No-one, not even a CEO has everything it takes, so it’s important build a strong team, to fill gaps in expertise and ensure priorities are balanced. One of the gaps was marketing. In the early stages some wins were self-marketing; new prospects called them. Azuro got to escape velocity but generally you can’t assume technology alone will get you there. If he was going to do it over again, he’d be a lot more vocal, even shameless, not try to over-optimize the pitch, pump up the volume and ensure that everyone knew the name. Jim added that now social media has to be a part of the strategy.

Charlie Huang, back then running strategy in Cadence, called Paul in 2010-2011. At that time, smartphones were really taking off and the ARM A9 had caught the wave. ARM were using aggressive clock gating and useful skew, giving them a 10% advantage in PPA. That’s massive in this business; Charlie (whose background was in timing) wanted it to be exclusive to Cadence. Paul had no ambitions to take Azuro public and Charlie saw the opportunity to have a powerful differentiator and grow market share. They just had to do the deal.

Again, for would-be CEOs, if you’re lucky enough to get there, this is one of the most painful stages in a startup; Paul said the due-diligence process was brutal. For several weeks they were gathering/assembling legal and financial docs (NDAs, patents, patent searches, customer contracts, audits, …), a very stressful, sleep-deprived time when the technologists are in a holding pattern while the lawyers and accountants do their thing. Even after that part is done, the transition from a small, tightly-knit startup group to being one group among many in a large enterprise, this also is traumatic. But Paul never regretted it, or the immense leverage it has enabled for the technology and for him personally.

At Cadence, Paul applied the Azuro technology to clock tree synthesis, then quickly took on a broader portfolio managing the digital back-end products. Logic synthesis, these days tightly coupled to implementation, is a solid pier in Cadence’s pretty clearly dominant implementation solution.

Not bad, but Paul wanted more. He saw one of the IBS charts at a kickoff event, the chart that shows growing investment in various phases of design. What stands out for everyone is that system and software verification dominate everything else. In his view if he wanted to make a real dent that was where he had to focus. Anirudh asked him about 15 months ago to run verification; Paul said this wasn’t a hard decision.

He believes the opportunity is boundless if Cadence can deliver new and compelling approaches. This starts with what I find to be a differentiated top-line goal – throughput. By this he means bugs found per dollar per day. He’s very single-minded about this goal; objective by objective, he asks does this move the throughput needle or not? I consider this goal to be an important new direction. When I look at verification pitches over the last 10+ years, it can be difficult to isolate a unifying metric or philosophy other than run faster! ease of use! more features! Laudable goals of course, but how do specific advances affect customer success and profitability? Implementation flows and teams don’t have this problem – they’re always optimizing for PPA. There’s no confusion about the right metric. Verification needs the same singular objective. That’s what I see in this direction.

Of course execution has to be broken down into sub-goals. For Paul this starts with the underlying bare-metal verification hardware – today x86 (Intel/AMD) and ARM based servers for simulation, then emulation and FPGA prototyping. He sees hardware platforms as a variable; they will continue to evolve. Above the bare metal, he sees a heterogenous compute layer, a hybrid mix of platforms to optimize throughput versus accuracy and bug-finding visibility. On top of that, smart analysis – isolating bugs faster and more intelligently in the always exponentially huge state-space.

Jim asked about compliance, safety and security. Paul likes Simon Segars’ (ARM) view, that all of us in the ecosystem enabling and building these transformational products have a responsibility to ensure these solutions are safe and secure. Verification has a big part to play in this, but for Paul this must be guided by the Lip-Bu/Anirudh philosophy of having the right to win. If you don’t have proven domain expertise, you need to work with people who do, which is why he’s so excited about the partnership with Green Hills, a company with proven leadership in automotive and in high-level security solutions.

For me this was a wake-up discussion, the first time in quite a while that I’ve seen someone who’s going to re-engineer the verification tooling business and move it onto a new level. I’m looking forward to hearing more.


Samsung 5nm and TSMC 6nm Update

Samsung 5nm and TSMC 6nm Update
by Daniel Nenni on 04-16-2019 at 12:00 pm

TSMC and Samsung continue to raise the competitive bar for FinFET foundry market share with dueling announcements this week. As I mentioned previously in the blog Semiconductor Foundry Landscape Update 2019, FinFETs are the market to watch with the coming onslaught of 5G and AI chips on the edge, in the cloud, and in our autonomous cars.

Yesterday Samsung announced that 5nm EUV is ready to go with PDKs, EDA Tools, IP, and MPWs. Samsung already has 14nm, 11nm, 10nm, 8nm, 7nm EUV, and 6nm EUV production ready. Samsung’s 5nm FinFET process technology provides up to a 25% increase in logic area efficiency with 20% lower power consumption or 10% higher performance over their 7nm process.

“In successful completion of our 5nm development, we’ve proven our capabilities in EUV-based nodes,” said Charlie Bae, Executive Vice President of Foundry Business at Samsung Electronics. “In response to customers’ surging demand for advanced process technologies to differentiate their next-generation products, we continue our commitment to accelerating the volume production of EUV-based technologies.”

Samsung foundry’s EUV-based process technologies are currently being manufactured at the S3-line in Hwaseong, Korea. Additionally, Samsung will expand its EUV capacity to a new EUV line in Hwaseong, which is expected to be completed within the second half of 2019 and will start production ramp-up for next year.

Mr. Bae continued, “Considering the various benefits including PPA and IP, Samsung’s EUV-based advanced nodes are expected to be in high demand for new and innovative applications such as 5G, artificial intelligence (AI), high performance computing (HPC), and automotive. Leveraging our robust technology competitiveness including our leadership in EUV lithography, Samsung will continue to deliver the most advanced technologies and solutions to customers.”

Not to be outdone, TSMC today announced 6nm EUV which fills out their FinFET offering of 16nm, 12nm, 10nm, 7nm, 7nm EUV, 6nm EUV, and 5nm EUV. TSMC 6nm offers an 18% density advantage over 7nm.

TSMC announced 5nm ecosystem completion last week which offers a 1.8X logic density and 15% speed gain versus 7nm. TSMC’s 6nm process delivers 18% higher logic density over the 7nm process. At the same time, its design rules are fully compatible with TSMC’s proven 7nm technology.

“TSMC N6 technology will further extend our leadership in delivering product benefits with higher performance and cost advantage beyond the current N7,” said Dr. Kevin Zhang, TSMC Vice President of Business Development. “Building upon the broad success of our 7nm technology, we’re confident that our customers will be able to quickly extract even higher product value from the new offering by leveraging a well-established design eco-system today.”

This is great news, we now have a legitimate two horse race for our FinFET design starts. The question is where is all of the IP going to come from for these new nodes? There are thousands of silicon proven FinFET based IPs in the ecosystem that will need to be tuned and verified to each and every node. It certainly is a good time to be a Semiconductor IP or IP management software company, absolutely.

About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with the industry’s leading process technology and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. TSMC serves its customers with annual capacity of about 12 million 12-inch equivalent wafers in 2019 from fabs in Taiwan, the United States, and China, and provides the broadest range of technologies from 0.5 micron plus all the way to foundry’s most advanced processes, which is 7-nanometer today. TSMC is the first foundry to provide 7-nanometer production capabilities, and is headquartered in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and foundry. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.


Using ML to Build Efficient Low Power Platforms for Augmented Vision

Using ML to Build Efficient Low Power Platforms for Augmented Vision
by Tom Simon on 04-16-2019 at 7:00 am

We are all pretty familiar with augmented reality, where real world images are overlaid with computer generated images, graphics and even audio. Of course, our first exposure to augmented reality might have been images of heads up displays in fighter jets or perhaps in the movie The Terminator. Augmented reality is moving rapidly towards mobile devices, handhelds and also automotive applications. Developing augmented reality systems on these new platforms requires crucial decisions about the image processing implementation.

For system level and embedded processing vision, we have several choices, which include GPUs, FPGAs, vision DSPs, or vision DSPs combined with neural networks. The considerations include cost, energy efficiency and performance.

At Embedded World 2019 Synopsys presented a paper on implementing augmented reality in low-power systems. The presenter was Gordon Cooper, product marketing manager for processor IP at Synopsys. One focus of his presentation was simultaneous localization and mapping(SLAM), which is the technique used to determine the actual 3-D location of objects relative to the camera. To do this in real-time a 3-D model of the environment must be produced and the location of the camera must be determined. Often a two-camera technique is used which relies on stereoscopic vision to determine distances. However, many new systems only have a single camera, so techniques are needed to determine distance using monocular SLAM.

Using a single camera requires more complicated algorithms. Depth cannot be directly inferred from a single image because it can be difficult to determine absolute scale. So, Synopsys asks the question as to whether neural networks can be used to improve depth maps for monocular SLAM. They found that this has been studied and can be an attractive approach, as shown in the paper titled Predicting Depth, Surface Normals and Semantic Labels with a Common Multi-Scale Convolutional Architecture, by David Eigen, Rob Fergus, 2015. This paper shows that with just a two-dimensional RGB image it was possible to output a depth map as well as determine the surface normals.

For real time processing, frame rates of above 25 frames per second are necessary. This means that just 30 to 40ms of total processing time is available to avoid significant latency. Coming back to the question of implementation, it is clear that GPUs can be useful for running neural networks, but they may consume too much power for automotive applications. CPUs may be able to perform SLAM but again there’s the question of performance, power and area. Synopsys’ solution is to combine these functions into a single embedded processor which contains a 32 bit scalar unit, a vector unit and a neural network engine.

Software is the other important element of the complete solution. The software must perform feature extraction and feature matching between frames to determine camera motion. Additionally, there must be support for a variety of different neural network types. Synopsys offers its OpenVX framework which includes C/C++, OpenCL C, OpenCV, OpenVX libraries, and CNN mapping tools. With this their customers can develop user applications that address their specific requirements.

Synopsys also supports a number of optimizations including feature map compression in hardware, which offers runtime compression and decompression, use of simplified Huffman encoding, and CNN DMA with a hardware compression mode. In addition, there is coefficient pruning, where coefficients with zero value are skipped/counted, leading to dramatic reductions in the number of required operations.

Synopsys believes that properly implemented vision processors that include neural networks can help improve SLAM accuracy in determining depth perception and scaling. At the same time these vision processors can help improve performance and lower power consumption, which will be needed in many of its applications. Although we do not necessarily see augmented reality used on a day to day basis yet, it will probably be one of those things that gathers momentum and will soon become something that we rely on for numerous daily activities, such as driving, learning new skills or appreciating the world around us. More information on Synopsys vision processing solutions for SLAM and CNN can be found on their website.


TechInsights Gives Memory Update at IEDM18 NAND Flash

TechInsights Gives Memory Update at IEDM18 NAND Flash
by BHD on 04-15-2019 at 12:00 pm

On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees. Arabinda was first up, giving a talk on the “10-year Journey of Apple’s iPhone and Innovations in Semiconductor Technology”, followed by Jeongdong discussing “Memory Process, Design and Architecture: Today and Tomorrow”.
Continue reading “TechInsights Gives Memory Update at IEDM18 NAND Flash”


From Wild West to Modern Life the Semiconductor Evolution

From Wild West to Modern Life the Semiconductor Evolution
by Daniel Nenni on 04-15-2019 at 7:00 am

What started as blogs, or vignettes as Wally calls them, posted on SemiWiki is now a free PDF eBook. The journey starts with his school days at Stanford through 20+ years at TI and 24+ years at Mentor Graphics. Wally has traveled millions of miles meeting with every customer imaginable while presenting hundreds of different keynotes on the semiconductor industry. If we ever came out with an AI smart speaker on all things semiconductor it would be called Wally.

The crowning achievement of Wally’s career (my opinion) and one of the most disruptive moves in EDA history is the acquisition of Mentor Graphics by Siemens in 2017 for $4.5B (representing a 21% stock premium). Acquisition rumors had been flying around the fabless semiconductor ecosystem but no one would have guessed it would be the largest industrial manufacturing company in Europe. At first the rumors were that Siemens would break-up and sell Mentor keeping only the groups that were part of the Siemens core business, specifically they would sell the Mentor IC Group. Those rumors were flatly denied at the following Design Automation Conference during a CEO roundtable with Wally. Now Mentor, including the IC group, is an integral part of the Siemens corporate strategy. Thank you again Dr Walden Rhines, EDA would not have been as fun without you, absolutely.


From LinkedIn:
Wally Rhines is widely recognized as an expert in business value creation and technology for the semiconductor and electronic design automation (EDA) industries. Dr. Rhines was CEO of Mentor Graphics (a “Big Three” EDA company with $1.3B+ revenue) for 24 years, has served on the boards of four public companies, managed the semiconductor business of Texas Instruments (TI), and is a spokesperson, writer and highly-sought-after speaker for the high-tech industry delivering more than twenty keynotes per year.

Dr. Rhines currently serves as CEO Emeritus of Mentor, a Siemens Business, consults for investors, corporations and the U.S. government on strategic directions, value creation and technology, serves on public and private boards, and supervises a $20M foundation. Business achievements include major turnarounds, both at Texas Instruments, through his creation and management of the digital signal processing business, and at Mentor, where he managed more than 3X growth in revenue and a 10X increase in enterprise value before acquisition by Siemens AG.

Dr. Rhines’ technical expertise includes semiconductor design, process engineering and manufacturing as well as financial modeling of trends and value creation. He has been deeply involved in global business development including projects in China and India.

As CEO and Director, he has managed businesses through difficulties including unfriendly takeover attempts, favorable outcomes for both the company and the activists, with three of the world’s leading activist investors, and volatile economic and business cycles. He continues to seek new opportunities to grow businesses, particularly through private equity, consulting and personal investing.

From the book:

From Wild West to Modern Life the Semiconductor Evolution

Foreword

In 1968, Texas Instruments, Motorola, and Fairchild dominated the emerging semiconductor business with 66% combined market share. Over the next fifty years, the industry de-consolidated – dozens of new semiconductor companies emerged, creating a more dynamic market that altered the list of the top ten largest companies.During the same period, an ecosystem of companies emerged to grow the materials, develop the manufacturing equipment, design the software, and create all the other capabilities needed to support what has become one of the most strategic industries in the world. Much of this evolution was driven by relatively young, inexperienced individuals operating in a totally unregulated,free market, worldwide business environment. I was privileged to work with many of these people and to be involved in some of the revolutionary innovations.Many people, including Daniel Nenni, have asked me to relate some of the stories of game-changing programs and people with whom I was involved,including the dynamics of growth of the Electronic Design Automation (EDA) industry. I’ve put this off for a long time, but Daniel is persistent. So I started writing some short vignettes during long airline flights. This activity required that I contact other people who were involved in this history, some of whom I hadn’t seen for decades, to verify the accuracy of my recollections. I hope this collection of essays provides some feeling for the remarkable history of the growth of an industry as well as insights into its future evolution.

Walden Rhines
March 2019