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High-Level Synthesis at the Edge

High-Level Synthesis at the Edge
by Bernard Murphy on 02-19-2020 at 6:00 am

AI Traditional Hardware Solutions

Custom AI acceleration continues to gather steam. In the cloud, Alibaba has launched its own custom accelerator, following Amazon and Google. Facebook is in the game too and Microsoft has a significant stake in Graphcore. Intel/Mobileye have a strong lock on edge AI in cars and wireless infrastructure builders are adding AI capabilities to small cells and base stations for 5G. All of these applications depend on a lot of flexibility and future-proofing for long-term relevance in rapidly evolving environments.

But there are many applications, probably accounting for the great majority of units, for which power, cost or transparent use models are much more important metrics. An agricultural monitor in a field in the middle of nowhere, a microwave voice controller, traffic sensors distributed across a large city. For these a general-purpose solution, even a general-purpose AI solution, may be overkill. An application-specific AI function would be much more compelling.

Pre-AI times, you would immediately think of a hardware accelerator – some function that would do whatever it had to do but much faster than running a software equivalent on the CPU. That’s pretty much what an AI accelerator does. It may still be software driven but not in the same way as a general-purpose CPU. Software is developed in Python on a big platform such as TensorFlow or Torch then compiled through multiple steps onto the target accelerator.

Therein lies the magic. That accelerator can be as wild as you want it to be as long as it stays within the general bounds of a neural net architecture. It may support multiple convolution engines, each in turn supported by SRAM for the accelerator as a whole, along with local memories to optimize access for a preferred ordering of operations.

It may support specialized functions for common operations such as pooling. For speed and power, it will commonly support different word widths at different stages of inference and specialized optimizations in handling sparse arrays. These are both hot areas of innovation in neural net architectures, some architects even experimenting with single-bit weights – if a weight can only be 1 or 0, you don’t need multiplication in convolution and sparseness increases!

The challenge in all of this is that you have so many knobs you can turn that it becomes difficult to know where to start or if you have really explored the full space of possibilities when you want to commit to a final architecture. Compounding the problem, you need to test and characterize over a large range of large test-cases – big images, speech samples and so on.

Running the majority of your testing in C rather than RTL is just common sense since it will run orders of magnitude faster and it’s easier to tune than the RTL. Also, neural net algorithms map well through high-level synthesis (HLS), so your C model can be more than a model – it can be the implementation from which you generate the RTL. You can explore the power, performance and area implications of choices you are considering – multiple convolution processors, local memories, word widths, broadcast updates. All with a fast turn-around time, allowing you to more fully explore the range of possible optimizations.

Mentor has just released a white paper with a nice intro on some of the architectural tradeoffs in building such accelerators. You can register to get the paper HERE.


KLA Blows Away Competition in the Semiconductor Metrology/Inspection Market

KLA Blows Away Competition in the Semiconductor Metrology/Inspection Market
by Robert Castellano on 02-18-2020 at 10:00 am

KLA Blows Away CompetitionC1

KLA saw its share of the semiconductor metrology/inspection market increase from 52% in 2018 to 56% in 2019.

As a background, KLA manufactures and sells equipment used to monitor many of the 400 to 600 processing steps in the manufacturing of semiconductors, starting with a bare wafer, such as silicon, to a completed device. The company makes metrology systems used to measure parameters such as thin film thickness or linewidths, and inspection systems used to detect defects and monitor abnormalities in production.

Except for a small percentage of sales of non-metrology/inspection equipment that came with the acquisition of Orbotech, KLA generates nearly 80% of revenue from metrology/inspection.

According to The Information Network’s report entitled “Metrology, Inspection, and Process Control in VLSI Manufacturing” KLA was the only company among competitors to demonstrate positive growth in 2019. This report analyzes 17 different segments of the overall sector, and there are individual leaders in each of the segments. KLA, of course, with a dominant market share, leads many of the segments.

As shown in the chart below, KLA grew 2% in revenues in 2019. It’s closest competitor, Applied Materials had revenue growth of -10.1% in 2019.

ASML, the dominant lithography market leader, is the leader in the electron beam inspection segment, yet its share of the overall decreased year-on-year 23.3% in 2019.

Nanometrics and Rudolph Technology announced that their merger was finalized in 4Q 2019, (new company named Onto Innovation), but I kept them separated in this chart. Rudolph Technology’s revenue dropped 18.3% YoY and Nanometric’s revenue dropped 16.7% YoY in the metrology/inspection sector.

In the overall metrology/inspection market, KLA increased its share from 52% in 2018 to 56% in 2019. Hitachi High Technologies’ share of the market in 2019 decreased from 10.4% in 2018 to 9.1%. Next was Applied Materials market share decreased from 10.1% to 9.1%.


IBIS-AMI Back-Channel System Optimization in Practice

IBIS-AMI Back-Channel System Optimization in Practice
by Mike Gianfagna on 02-18-2020 at 6:00 am

Picture1 1

I recently spent some time at DesignCon 2020 in Santa Clara. For those who haven’t attended this show in a while, you need to go. It’s no longer a small event focused on chip design. It has grown into a true system-level conference, with a broad ecosystem represented on the show floor and in the technical sessions. Ecosystem is an important concept regarding DesignCon.  Many of the technical papers present a collaboration between two or more companies to achieve a particular system design goal.

The first presentation I attended at the show fit this model quite well, with Cadence Design Systems and Marvell Semiconductor presenting a joint modeling and optimization project. The session started at 8:00 AM and the room was almost full – a good indicator of interest in the topic.

Let’s start by unpacking the title of the presentation. IBIS (I/O Buffer Information Specification) is a standard to describe IC input/output analog characteristics. The Algorithmic Modeling Interface (AMI) added the ability to describe the signal processing (algorithmic) portions of channel in a standard way, along with the analog portion. The goals of this work target the development of models that are interoperable, portable, flexible, high-performance, accurate and secure. The addition of a back-channel interface (BCI) specification allows simulation of channels that employ link training, which involves optimizing transmitter characteristics based on receiver observations, sent as messages over the channel.

The presentation included remarks from Steven Parker (senior staff engineer at Marvell) and Jared James (principal product engineer at Cadence).  Their remarks focused on modeling a 56G PAM4 SerDes that was designed by the GLOBALFOUNDRIES team prior to their acquisition by Marvell. Methods to achieve interoperability between different tools using the IBIS-AMI standard were discussed, along with an overview of using the BCI to implement simulations of back-channel optimization. The figure below shows the process flow to implement back-channel training.

From a big picture point of view, the figure below illustrates the predicted improvements in channel performance based on the use of link training.

Results (with and without BCI)

Cadence developed a SerDes model for its Sigrity SystemSI technology using IEEE constructs.  The Marvell model was built using internal tools. Marvell then modified its model to conform to the constructs used by Cadence and a system simulation was then built using the Cadence tools for transmit and the Marvell tools for receive. An excellent example of the cross-platform compatibility offered by IBIS-AMI. Some of the lessons learned from this work include:

  • The need for a command acknowledge function to determine the specific command that caused limits of calibration for the receiver to be reached
  • Consistent command sequence numbering to ensure commands remain in order
  • Setting the timing of commands correctly – too little time and the transmitter may not be able to react, too much and there will be dead time, extending simulation runs

And some comments on potential interoperability improvements:

  • Protocol compatibility improvement: develop de-facto standards to support popular training schemes
  • Open source an API for available models that describes the interface to the model and its files
  • A more general specification from IBIS to handle a broader range of applications

The work presented has been used successfully on several projects. Inter-vendor interoperability can be achieved with proper planning and coordination. This work has broad application going forward, including support for the emerging chiplet market.

 


The First SiFive Tech Symposiums of 2020 are Fast Approaching – We’ll be in San José, Costa Rica, and Mexico City This Month

The First SiFive Tech Symposiums of 2020 are Fast Approaching – We’ll be in San José, Costa Rica, and Mexico City This Month
by Swamy Irrinki on 02-17-2020 at 10:00 am

Central America and Mexico Tour SiFive SemiWiki

We’re confirming seats for our first two SiFive Tech Symposiums in 2020. The first will take place in San José, Costa Rica on February 25, and the second will be in Mexico City, Mexico, on February 28. Just like our 2019 symposiums, these events are designed to engage the global hardware community in the RISC-V ecosystem, and to further promote the revolution that’s taking place within the semiconductor industry.

We’re proud to have Western Digital is our co-host in Costa Rica, and the Computing Research Center at CIC-IPN is our co-host in Mexico. Both events will feature presentations on RISC-V development tools, platforms, core IP and SoC IP, as well as talks about the exciting opportunities stemming from RISC-V, and the leading-edge research taking place in academia. Both events will also include a hands-on workshop where attendees will have the opportunity to configure their own RISC-V core and bring up on an FPGA.

Attendance is free, but registration is required.

San José, Costa Rica

Co-located with LASCAS 2020

Mexico City, Mexico

Instituto Politécnico Nacional/National Polytechnic Institute of México

The learn more about other SiFive Tech Symposiums taking place throughout the world in 2020, please visit the website, and check back often for updates. We look forward to seeing you soon!

About RISC-V Foundation
RISC-V (pronounced “risk-five”) is a free and open ISA enabling a new era of processor innovation through open standard collaboration. Founded in 2015, the RISC-V Foundation comprises more than 500 members building the first open, collaborative community of software and hardware innovators powering a new era of processor innovation. Born in academia and research, RISC-V ISA delivers a new level of free, extensible software and hardware freedom on architecture, paving the way for the next 50 years of computing design and innovation.

The RISC-V Foundation, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RISC-V ISA. Members of the RISC-V Foundation have access to and participate in the development of the RISC-V ISA specifications and related HW / SW ecosystem.

About SiFive
SiFive is the leading provider of market-ready processor core IP, development tools and silicon solutions based on the free and open RISC-V instruction set architecture. Led by a team of seasoned silicon executives and the RISC-V inventors, SiFive helps SoC designers reduce time-to-market and realize cost savings with customized, open-architecture processor cores, and democratizes access to optimized silicon by enabling system designers in all market verticals to build customized RISC-V based semiconductors. With 14 offices worldwide, SiFive has backing from Sutter Hill Ventures, Spark Capital, Osage University Partners, Chengwei, Huami, SK Hynix, Intel Capital, and Western Digital. For more information, www.sifive.com.

 


Mentor at DVCON 2020!

Mentor at DVCON 2020!
by Daniel Nenni on 02-17-2020 at 6:00 am

DVCon 2020 SemiWiki

Are you ready for the premier conference for functional design and verification of electronic systems?

Sponsored by Accellera Systems Initiative, DVCon is an independent, not-for-profit organization dedicated to creating design and verification standards required by systems, semiconductor, intellectual property (IP) and electronic design automation (EDA) companies.

This year at DVCon, you’ll find Mentor experts featured prominently throughout the conference program discussing the latest in Portable Stimulus, UVM, Formal, CDC, Low- Power Verification, High-Level Synthesis, and much more.

A full list of Mentor activities, can be found here.

SPONSORED LUNCHEON
Optimizing Time to Bug, Don’t Panic!!!
Thursday, March 5 | 11:45am – 12:45am | Sierra

Come join Tom Fitzpatrick, Strategic Verification Architect at Mentor, a Siemens Business, as he explores the myriad factors that contribute to verification complexity and how the changing landscape of electronics will expose new challenges in the continuing quest to find and eliminate bugs as early and effectively as possible.

FEATURED TUTORIAL
Application Optimized HW/SW Design & Verification of a Machine Learning SoC
Thursday, March 5 | 8:30am – 11:30am | Donner

This tutorial walks through the process of migrating an algorithm from generic software to a hardware implementation customized to the specific requirements of your system; making intelligent trade-offs between hardware and software along the way. It will explain the tools and techniques needed to go from “Software to Systems” and cover a broad range of solutions including simulation, emulation, prototyping, and High-Level Synthesis to design and verify SoCs and the software that runs on them.

FEATURED PANEL
Predicting the Verification Flow of the Future
Wednesday, March 4 | 1:30pm – 2:30pm | Oak/Fir

Moderator Jean-Marie Brunet from Mentor, a Siemens Business, will take a panel of verification experts on an exploration of what the verification environment of the future will look like. They will attempt to predict the longevity of simulation and formal verification and determine how far emulation will be able to extend through the entire verification flow. The role of standards will be addressed, as will when analog will have a place in digital functional verification.

SHORT WORKSHOPS
How HLS and SystemC is Delivering on its Promise of Design and Verification Productivity
Monday, March 2 | 3:30pm – 5:00pm | Oak

Mind the GAP(s): Closing and Creating GAPS between Design and Verification
Thursday, March 5 | 1:00pm – 2:30pm | Siskiyou

PAPER SESSIONS
Designing PSS Environment Integration for Maximum Reuse
Tuesday, March 3 | 9:00am – 10:30am | Fir

UVM – Stop Hitting Your Brother Coding Guidelines
Tuesday, March 3 | 3:00pm – 5:00pm | Oak

Multi-Level Replay of VIP Models in Isolation from Original Design Verification Environment to Enhance Protocol Analysis and Debug
Tuesday, March 3 | 3:00pm – 5:00pm | Fir

UPF 1.0, UPF 2.0, UPF 2.1, UPF 3.0, and Now UPF 3.1: The Big Q “Which is the Right Standard for My Design?”
Tuesday, March 3 | 3:00pm – 5:00pm | Monterey/Carmel

Did Power Management Break My CDC Logic? An Integrated Approach to Power Domain and Clock Domain Crossing Verification
Tuesday, March 3 | 3:00pm – 5:00pm | Monterey/Carmel

Systematic Methodology to Solve Reset Challenges in Automotive SoCs
Wednesday, March 4 | 3:00pm – 4:30pm | Monterey/Carmel

Scalable Reset Domain Crossing Verification Using Hierarchical Data Model
Wednesday, March 4 | 3:00pm – 4:30pm | Monterey/Carmel

SystemVerilog Constraints: Appreciating What You Forgot in Class to Get Better Results
Wednesday, March 4 | 3:00pm – 4:30pm | Oak

POSTER SESSIONS
Tuesday, March 3 | 10:30am – 12:00am | Gateway Foyer

4.3 – Covergate: Coverage Exposed

4.8 – How UPF 3.1 Reduces the Complexities of Reusing Power Aware Macros

4.11 – Are You Safe Yet? Safety Mechanism Insertion and Validation

4.14 – Deadlock Verification for Dummies – The Easy Way Using SVA and Formal

EXHIBIT FLOOR
You’ll find Mentor experts in booth #404 presenting daily theater sessions and running the latest Enterprise Verification Platform demos across Emulation, Low Power, Formal, Portable Stimulus, High-Level Synthesis, Verification IP, Debug, and more!

Mentor has pioneered technology to close the design and verification gap to improve productivity and quality of results. Catapult High-Level Synthesis for C-level verification and PowerPro for power analysis; Questa for simulation, low-power, VIP, CDC, Formal and support for UVM and Portable Stimulus; Veloce for hardware emulation and system of systems verification, unified with the Visualizer debug environment.


The Tech week that was February 10-14 2020

The Tech week that was February 10-14 2020
by Mark Dyson on 02-16-2020 at 10:00 am

Semiconductor Weekly Summary 1

The new coronavirus outbreak or COVID-19 outbreak, as it is now officially called, continues to dominate the news again this week as currently there is no end forecast to the outbreak, and infection numbers continue to rise. This will have an impact on semiconductor supplies in the coming months and into Q2 as the necessary restrictions to try to contain the disease cause Chinese companies struggle to be allowed to reopen after the extended Chinese new year holiday and to also get workers allowed back from other parts of China, especially for the smaller companies. This will have a knock on impact not just on semiconductor supplies from China in the coming months but also on supplies of materials and consumables to non Chinese semiconductor manufacturing companies. Let’s hope the COVID-19 outbreak comes under control soon and all my colleagues and acquaintances and families stay safe and healthy throughout this difficult period.

Chinese leading wafer foundry SMIC said on Friday that it will double its capital spending in 2020 and expects revenue to grow 10% despite the COVID-19 outbreak, but SMIC did also warn that the worst may yet be to come from the COVID-19 outbreak as implications ripple through the supply chain.

The impact of the COVID-19 outbreak is also being felt worldwide as the organizers of Mobile World Congress 2020 have cancelled this years event. Although the event is being held in Barcelona, most companies have travel restrictions in place and too many companies pulled out of the event.

US lighting companies are expecting delayed product supply due to the COVID-19, with US companies Cooper Lighting Solution and Satco both posting notices to their customers on possible interruption of supplies.

A survey by LEDinside magazine on the impact of COVID-19 on the Chinese LED industry showed that only 28% of companies think they will still make a profit despite the COVID-19 outbreak, whilst 38% think they will make a loss. If companies are allowed to resume production on Feb 17th 44% of companies expect the work resume rate to 50~70%, whilst 27% of companies expect the work resume rate to be below 50%.

In other news…

Whilst last year was a challenging year for most semiconductor companies, TSMC managed to buck the trend especially in the 2nd half. In recognition of last year’s record revenue, TSMC ‘s board has approved to pay TSMC’s 45,000 employees an average annual bonuses of US$33,000. The bonus will be paid in July. The total bonus amount to be paid out is 1.7% lower than 2018 as it reflects the 1.7% lower profit margin last year. TSMC’s board also approved a US6.7billion budget for advanced process and capacity expansion this year.

Taiwanese foundries and backend subcons published their monthly revenue figures last week. TSMC continued the trend from 2nd half last year.  TSMC posted monthly revenue of US$3.45billion (NT$103.7billion) up 0.4% on sequentially and up almost 33% yoy. This is the 6 straight month that TSMC has posted revenue of over NT$100billion.

Number 2 Taiwanese foundry UMC also had a good month recording revenue of US$4.67million for January up 19.5% yoy, and up 5% sequentially. UMC has also announced it will invest US$500million to expand capacity in its Chinese Xiamen 12inch Fab to boost capacity to 250k/month by mid 2021.

Specialist foundry Vanguard (VIS) was down though with the revenue dropping 8.9% sequentially to US$79million, and down 7.2% yoy. This was due to lower shipments over the Chinese New Year period.

Assembly and Test subcon ASE Technology holdings which includes both ASE and SPIL subcon groups reported monthly revenue for it’s ATM business of US$730million, which was down 5% sequentially but up 20.7% yoy.

Applied Materials, the market leader semiconductor equipment manufacturer gave an optimistic outlook for the semiconductor industry indicating companies are planning to spend more on capex in 2020. Applied Materials reported quarterly revenue for fiscal Q1, which ended Jan 26th, of US$4.16billion, up 11% yoy, the first increase in 5 quarters. They are forecasting US$4.34billion for fiscal Q2, which is up 22.6% yoy. They forecast minimal overall financial impact of COVID-19 virus for fiscal 2020, but do expect some changes in timings of revenues due to travel and logistics restrictions. Applied also said they were making good progress on regulatory approval for their acquisition of Kokusai Electric.

Austrian Sensor manufacturer AMS is pushing ahead with it’s plans to acquire Osram, and are pushing ahead to get what is known in Germany as a domination agreement to give AMS more control of Osram and to facilitate integrations efforts. AMS is asking Osram shareholders to approve the domination agreement which will require 75% approval at an EGM, the date of which is yet to be set.

ICInsights has published it’s latest report on worldwide Fab capacity, reporting that the top 5 semiconductor companies now supply 53% of global wafer capacity. The top 5 foundries are placed in the top 12, provide 24% of the worldwide capacity. Samsung with it’s large memory business holds the largest share with 15% of worldwide capacity, with TSMC 2nd with 12.8% and Micron 3rd with 9.4%. SK Hynix and Kioxia (formerly Toshiba Memory) making up the top 5 spots. It is interesting to note that 10years ago the top 5 companies only held 36% of the worldwide capacity showing how the industry is consolidating.

Qualcomm’s appeal against FTC’s antitrust victory against it was being heard in court last week in San Francisco. The judge stated that “Anticompetitive behaviour is prohibited under the Sherman Act. Hyper-competitive behaviour is not. This case asks us to draw the line between the two”

This week Samsung launched it’s next generation flagship phone which will be called Galaxy S20 and will have a 5G option and up to 4 cameras. They are hoping that 5G will revive demand for smartphones. Samsung also launch it’s next generation foldable phone the Galaxy Z Flip.

Photonics is one of the biggest growth areas in the IC market with a CAGR of over 20%. In 2013 the photonics IC market was 190million, this grew to 539million by 2017 and is expected to be between 1.3billion and 1.8billion by 2022, so the photonics market outlook is very bright.

Finally some sobering news and food for thought…

It is forecast that by 2030 there will be 20million manufacturing job layoffs due to robots powered by AI, big data and VR as Industry4.0 changes the way we live. In such an environment continued education and learning becomes essential. For the time being engineers are needed to create all these technologies, and the areas where most engineers will be needed will be AI & automation, Big Data, Generative Design and Digital Twins, Green Technology, VR/AR, robotics and 3D printing.


Minimal Corona Impact on Chip Equipment Stocks

Minimal Corona Impact on Chip Equipment Stocks
by Robert Maire on 02-16-2020 at 6:00 am

Coronavirus Light SemiWiki

Very solid quarter driven by foundry/logic
AMAT reported a very solid quarter, beating the top end of guidance with foundry and logic being the primary drivers of spend. Revenues were $4.16B and EPS of $0.98 non-GAAP versus street of $4.11B and $0.93 EPS.

Guide not too wide… – $300M “Corona Cut”
More importantly, given the Corona scare, guidance is for revenues of $4.34b +-$200M and EPS of $1.04 +- $0.06 versus current street of $4.02 and EPS of $0.92.

Management said that revenue outlook would have been $300M better if not taking a haircut due to Corona impact on chips. Management also commented that fiscal 2020 would not be negatively impacted by Corona as it views it as a temporary issue.

2020 WFE outlook of up 10-15% over 2019 – emphasis on 15%
Applied Managment pegged 2018 WFE spend at $56B with a 10-12% drop in 2019 (meaning $49B-$51B) and looking at a 10-15% increase expected in 2020 with a bias towards the high end of 15% which probably translates to a number just shy of $60B.

In our view this has a higher litho component as compared to 2018 and 2019 but dep & etch will obviously be up nicely as well.

The company added that they expect the $6.5B of spending that was China to be up another $2-$3B in spite of the Corona crisis as China continues to accelerate.

Flat panel to be Flat
Its probably not a surprise but flat panel equipment looks to be flat in 2020 overall as we don’t have the 5G and memory recovery drivers that we have on the semi side.

We would expect flat panel to remain sluggish for a while without any new drivers of demand on the horizon.

NAND recovering , DRAM recovery is still a hope & prayer
As we have been saying for a while, NAND continues its slow recovery. AMAT management pointed out that inventories are down by half from their prior peak of 10-12 weeks with pricing also seeing a similar improvement.  DRAM is seeing no such recovery but everybody seems to be hopeful it will follow NANDs lead but there is zero evidence of things getting better in DRAM

A shallower cycle seems to be re-rating industry PE’s
Applied was quick to point out that the peak to trough drop of this most recent downcycle was only 17% versus over 40% peak to trough variations in prior cycles and nearly 100% variation in older cycles.

While Applied management (and some inexperienced analysts) were obviously wrong in prior suggestions, a year or two ago, that the industry was no longer cyclical, we think they are more accurate in walking that back to the new statement that the cycles are now not as bad as they used to be and thus the PE’s should be adjusted to reflect a less cyclical/more growth industry rather than the historical growth cyclical where growth premiums were canceled out by cyclical discounts to equal a market weight PE.

Overall industry PE’s have obviously grown over the last several quarters as investors realize the cyclicality isn’t as bad as the stocks were discounting.

We think this “re-rating” of PE’s appears to have “stuck” as valuations continue to hold up at record levels despite the Corona risk in the stocks.

Trade war risk swapped out for Corona risk
We find it also interesting to note that the trade war risk with China has been replaced seemingly overnight with the Corona risk which doesn’t seem to be having as bad an impact even though business is clearly slowing on the ground, as compared to the trade war risk which never actually impacted business.

We have heard many reports of machines not shipping or not being installed. Travel has ground to a halt in some areas.

Our view is that if Applied gets away with only a $300M haircut from Corona, in the quarter, they should count themselves as lucky.

Our view continues to be that the Corona risk, while temporary, will likely be worse than expected as the hysteria continues to grow.

The stocks
Obviously Applied stock will see nice upside from the nice quarter, great guide and minimal impact from Corona. 2020 outlook is bright and there appear to be no new potholes.  The Kokusai acquisition appears on track and will add more revenues even though its not at all strategic, which will add to the “growth” story.

We find it hard to chase some of these stocks at these record levels, which are “priced to perfection” in an imperfect market. The re-rating of PE’s has clearly helped and stuck which is a good thing as we need a lot of support at these levels.


The Future Of Embedded Monitoring – February 2020

The Future Of Embedded Monitoring – February 2020
by Stephen Crosher on 02-14-2020 at 10:00 am

Stephen Crosher SemiWiki

Shall I compare thee to a…Rolls Royce jet engine?

‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’  These were my words during a presentation to an industry audience in China back in September 2015. During that same presentation, somewhat to the consternation of the technology veterans in the room, I also drew comparisons between semiconductor design and an aspect of aviation technology being offered by Rolls Royce. Why on earth would I do that?

I could envision real-time, high accuracy, embedded monitoring becoming ubiquitous in all technology. Plus, understanding that valuable insights can be gained from gathering large amounts of data across entire product ranges could enable a revolution within the semiconductor industry.

To explain my comparison for a moment –  A core principle of Rolls Royce’s R2 Labs Intelligent Engine is ‘data to insight.’ The technology offered by the aviation giant involves gathering mechanical, electronic and system level data for each jet engine in operation, wherever that may be in the world. Through centralised, large data analysis, Rolls Royce have enabled the ability to predict reliability issues, schedule engine maintenance and also allow for trends across fleets of aircraft to be assessed. My point back in Sept 2015 was, in the near future we shall be applying the same approaches and analytics principles to semiconductor devices. This ‘near future’ has now become our reality.

Gathering information from the physical world and acting upon it has been fundamental to human evolution.

In the modern day, how does this correlation to jet engines relate to semiconductors? The answer is within some of the challenges we can identify today – there is undeniable value in: predicting the failure of a critical automotive chip; or finding the operational sweet spot for a processor in terms of clock speed or power, steering an entire product range of data center chips to consume less power while achieving operational performance, such that carbon footprints are reduced by a power station or two.

I’m not the first to make comments of benefits of having an enlightened position through deeper observation. In 1665, Robert Hooke’s book ‘Micrographia’, (the first scientific best-selling book!) provides us with a good example the discovery of ‘Minute Bodies,’ or cells, through the use of magnifying glasses.

‘If you can’t measure it, you can’t improve it’ 

The famous management consultant Peter Drucker points out that, “If you can’t measure it, you can’t improve it.” A personal favourite is the inspired observation from Beyoncé, “You try and fix something, but you can’t fix what you can’t see.” I am sure that big data and a desire to seek patterns within dynamic semiconductor device behaviours was at the forefront of her mind as she wrote those lyrics!

Embedded monitoring within semiconductor devices will evolve, bringing with it a greater opportunity to consume less power, increase speed performance, enhance reliability and reduce design re-spin costs.  As technology evolves, as with my earlier jet engine analogy, expectations upon the semiconductor industry will increase from our vertical-market masters.

Today, solutions are available that will monitor the rapidly changing conditions within a chip, alongside assessments of how it has been fabricated, looking at variation from one chip to the next. This is all for the benefit of developing stable, reliable and optimized products. So my message to chip designers is that your chip is always saying something …. the question is are you listening?

https://moortec.com/blog/


Design Technology CoOptimization at SPIE 2020

Design Technology CoOptimization at SPIE 2020
by Daniel Nenni on 02-14-2020 at 6:00 am

DTCO Fig1 SPIE2020 Semiwiki

SLiC Library tool dramatically accelerates DTCO for 3nm and beyond

In advanced technology nodes below 10nm, Design and Process Technology development have become increasingly intertwined. In older nodes the traditional technology roll-out was done mostly in a sequential manner with clear geometry scaling targets set by process technology and then handed down to designers, determining the resulting scaling of area, power and performance.

This is no longer the case: Nowadays and going forward there are too many choices to be made between different materials, different patterning options, different device structures and different library architectures. The impact of each combination of variables and choices on design capabilities and performance is impossible to intuitively estimate or quantify.

In addition, the DTCO analysis needs to go beyond the device or library level. For example, a seemingly tighter library can prove to be very hard to place and route, causing routing congestion that would make it effectively much worse than a more relaxed library architecture. Effective DTCO today requires a feedback loop and negotiations between technology and design, and the assessment loop encompasses the entire flow: from technology capabilities and limitations, to logic cells, to placement and routing and analysis at the block level, and back.

As seen in the above diagram, the centerpiece of this flow is the standard cell library. Developing a DTCO flow requires having a representative compact logic library that has frequently used logic building blocks (usually less than 200 cells would do). To accomplish an effective and streamlined flow one needs to be able to quickly create variants of this library and use them to implement a few logic designs or blocks that are characteristic to the specific target markets and product applications. Each implementation is analyzed for performance, power, area and cost (PPAC) and is evaluated against other technology and library architecture variants.

DTCO flow bottleneck and the SLiC solution
The DTCO flow must be quick and streamlined to evaluate multiple technology and architecture choices in a reasonable time. Most of the steps (e.g. synthesis, P&R) are automated but creating the library has been the bottleneck of this flow until recently. This critical gap has now been filled by SLiC (Standard-cell Library Compiler), a new tool that solves this problem by automating library creation and cutting the library physical design time from months to less than a day. SLiC has been recently introduced by Sage Design Automation and has proven extremely efficient, creating libraries very quickly with optimal results that are as good and sometimes better than handcrafted.

Unlike past generations of library creation or migration tools, setting up each new technology for SLiC takes less than a day and the run time is measured in hours. SLiC was designed from the ground up for new and advanced technologies. Its inherent versatility accommodates novel devices and logic design concepts including LGAA, CFETs and even more exotic 3D structures and cell architectures.  SLiC has already been used and proven in both DTCO and production flows for 7nm, 5nm, 4nm technologies and 3nm pathfinding DTCO work.

Summary
Standard cell libraries are at the center of the process technology and design development for advanced nodes. SLiC enables very quick creation of optimal quality libraries that can be used both for production in advanced nodes and for pathfinding DTCO of future technologies.

Come and see SLiC at SPIE:   SLiC will be presented at the SAGE-DA booth #103 on the exhibit floor at the 2020 SPIE Advanced Lithography Conference in San Jose (Feb 25th-26th). You are also encouraged to attend the paper “DTCO acceleration to fight scaling stagnation” (Paper 11328-11), showing advanced DTCO work done using SLiC.

https://www.sage-da.com


Savings Tip the Balance to EVs

Savings Tip the Balance to EVs
by Roger C. Lanctot on 02-13-2020 at 10:00 am

Savings Tip the Balance to EVs

In a rare and perhaps unfortunate moment of candor, Cruise Automation CEO Dan Ammann wrote, in his blog post describing the emergence of Cruise (a subsidiary of General Motors) that conventional internal combustion engine vehicles “break down relatively easily. And if they make it 150,000 miles, well, lucky you.”

Ammann goes on to say: “The Cruise Origin (electric autonomous shuttle due for mass production in 2022)… will have a lifespan of over 1 million miles — six times more than the average car.”

There’s just one problem with this quote. Ammann is speaking on behalf of a division of General Motors, which itself makes millions of those lucky-if-you-make-150,000-mile cars. As consumers become increasingly aware of the virtues of EV ownership, life may become very difficult for the sellers of ICE’s – dealers and car makers alike. Just ask your friendly neighborhood fleet operator. Most of them have already seen the future and put their money on battery electric vehicles.

Ammann is onto something many other consumers and researchers already know. Fleet operators around the world fielding Tesla’s or even hybrids like the Toyota Prius are routinely seeing multiple-hundred-thousand-mile performance. The longevity of electric powertrains is reality, not theory.

Battery electric vehicles have fewer moving parts. They require less service and they last longer.

Now AAA has gotten on board with a study identifying the higher operating costs – for fuel and service – of ICE vehicles vs. EVs, publishing a study on the subject. The annual savings amount to 2-3 monthly payments – about $950. AAA’s consumer insights show growing interest in EV ownership.

AAA Study results

These findings validate analysis from Kelly Blue Book and Vincentric pointing to the lower cost of operation for EVs, particularly those that see the highest rates of usage. The more you drive them, the longer they last – or so it seems.

SOURCE: Vincentric

This phenomenon has not been lost on car sharing and ride hailing operators, and rental car companies which are rapidly shifting to electric powertrains. Makers of ICE vehicles may “perceive” consumer resistance due to range anxiety, the limited availability of charging stations, or sticker shock – but they are slowly discovering the groundswell of consumer interest which will soon be fed by a gusher of new electric vehicles – more than 180, to be exact, coming in the next few years, according to a report from car share operator Vulog.

Access Vulog report

With or without incentives, with or without unlimited range, with or without sufficient charging stations, EVs are transforming the automotive landscape – beginning with Tesla and through the growing demand from fleet operators – including car sharers. According to the Vulog report, 17 major cities around the world will ban ICE vehicles by 2025 or 2030. More than a dozen countries have set ICE production/sales cutoff dates of 2040 or sooner.

LMC Automotive published a blog post today noting the potential for the automotive industry to have hit what it calls “Peak Auto.” The company attributes the arrival at this turning point to uncertain demand in markets where some of the most rapid growth had previously occurred – such as India, China, Brazil, and other emerging markets – along with tepid sales in mature markets.

LMC Automotive “Peak Auto” blog

LMC has a point. But there is a more chilling reality setting in. The reality is that there are consumers looking at the ICE vehicles in their driveways, garages, and parking lots and thinking: “That is the last ICE vehicle I will ever buy.” And when those consumers start buying their million-mile electric vehicles, they may not return to a new car dealer lot for a very long time.