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10 Impactful Technologies in 2023 and Beyond

10 Impactful Technologies in 2023 and Beyond
by Ahmed Banafa on 01-25-2023 at 10:00 am

10 Impactful Technologies in 2023 and Beyond

There are many exciting technologies that are expected to shape the future, the following are some of the technologies that will impact our lives in the coming 5 years at different levels and depth:

Generative AI, also known as generative artificial intelligence, is a type of #AI that is designed to generate new content or data based on a set of input parameters or a sample dataset. This is in contrast to traditional AI, which is designed to analyze and interpret existing data.

There are several different types of generative AI, including generative models, which use machine learning algorithms to learn the underlying patterns and structures in a dataset, and then generate new data based on those patterns; and generative adversarial networks (GANs), which are a type of machine learning model that consists of two neural networks that work together to generate new data.

Generative AI has a wide range of potential applications, including image and video generation, music composition, and natural language processing. It has the potential to revolutionize many industries, including media and entertainment, advertising, and healthcare.

A voice user interface (VUI) is a type of user interface that allows people to interact with devices, applications, or services using voice commands. VUIs are becoming increasingly popular due to their ease of use and the increasing capabilities of natural language processing (NLP) technology, which enables devices to understand and respond to human speech.

VUIs are used in a variety of applications, including smart speakers, virtual assistants, and home automation systems. They allow users to perform tasks or access information simply by speaking to the device, without the need for manual input or navigation.

#VUIs can be designed to understand a wide range of commands and queries, and can be used to control various functions and features, such as setting reminders, playing music, or turning on the lights. They can also be used to provide information and answer questions, such as providing weather updates or answering queries about a particular topic.

Edge computing is a distributed computing paradigm that brings computing and data storage closer to the devices or users that need it, rather than relying on a central server or cloud-based infrastructure.

In edge computing, data is processed and analyzed at the edge of the network, where it is generated or collected, rather than being sent back to a central location for processing. This can help to reduce latency, improve performance, and increase the scalability of systems that require real-time processing or decision-making.

Edge computing is used in a variety of applications, including the Internet of Things (IoT), where it allows devices to process and analyze data locally, rather than sending it over the network to a central server. It is also used in applications that require low latency, such as video streaming and virtual reality, as well as in industrial and military applications where a central server may not be available.

5G networks use a range of technologies and frequencies to provide coverage, including millimeter wave bands, which are high-frequency bands that can provide very fast data speeds, but have limited range. They also use lower-frequency bands, which can provide wider coverage but lower data speeds.

#5G networks are expected to offer data speeds that are much faster than previous generations of mobile networks, with some experts predicting speeds of up to 10 gigabits per second. They are also expected to offer lower latency, or the time it takes for a signal to be transmitted and received, which is important for applications that require real-time responses, such as video streaming and online gaming.

5G technology is still in the early stages of deployment, and it is expected to roll out gradually over the coming years. It is likely to be used in a variety of applications, including mobile devices, IoT devices, and a wide range of other applications that require fast, reliable connectivity.

A Digital Twin is a virtual representation of a physical object or system. It is created by using data and sensors to monitor the performance and characteristics of the physical object or system, and using this data to create a digital model that reflects the current state and behavior of the physical object or system.

Digital twins can be used in a variety of applications, including manufacturing, healthcare, and transportation. In manufacturing, for example, a digital twin can be used to simulate the performance of a production line or equipment, allowing manufacturers to optimize their operations and identify potential issues before they occur. In healthcare, digital twins can be used to model the body or specific organs, allowing doctors to better understand the patient’s condition and plan treatment.

Digital twins are created using a combination of sensors, data analytics, and machine learning techniques. They can be used to visualize and analyze the behavior of the physical object or system, and can be used to optimize performance, identify issues, and make decisions about how to improve the physical object or system.

Quantum Computers are different from classical computers, which use bits to store and process information. Quantum computers can perform certain types of calculations much faster than classical computers, and are able to solve certain problems that are beyond the capabilities of classical computers.

One of the key benefits of quantum computers is their ability to perform calculations that involve a large number of variables simultaneously. This makes them particularly well-suited for tasks such as optimization, machine learning, and data analysis. They are also able to perform certain types of encryption and decryption much more quickly than classical computers.

Quantum computing is still in the early stages of development, and there are many challenges to overcome before it becomes a practical technology. However, it has the potential to revolutionize a wide range of industries, and is likely to play an increasingly important role in the future.

A Chat Bot is a type of software that is designed to engage in conversation with human users through a chat interface. Chat bots are typically used to provide information, answer questions, or perform tasks for users. They can be accessed through a variety of platforms, including messaging apps, websites, and social media.

There are several different types of chat bots, including rule-based chat bots, which are designed to respond to specific commands or queries; and artificial intelligence (AI)-powered chat bots, which use natural language processing (NLP) to understand and respond to more complex or open-ended queries for example #ChatGPT.

Chat bots are commonly used in customer service, where they can handle routine inquiries and help customers resolve simple issues without the need for human intervention. They are also used in marketing, where they can help businesses to connect with customers and provide information about products and services.

XR is a term that is used to refer to a range of technologies that enable immersive experiences, including virtual reality (VR), augmented reality (AR), and mixed reality (MR).

Virtual reality (VR) is a technology that allows users to experience a simulated environment as if they were physically present in that environment. VR is typically experienced through the use of a headset, which allows users to see and hear the virtual environment, and sometimes also to interact with it using handheld controllers or other input devices.

Augmented reality (AR) is a technology that allows users to see virtual elements superimposed on their view of the real world. #AR is often experienced through the use of a smartphone or other device with a camera, which captures the user’s surroundings and displays virtual elements on top of the real-world view.

Mixed reality (MR) is a technology that combines elements of both VR and AR, allowing users to interact with virtual elements in the real world. #MR typically requires the use of specialized hardware, such as a headset with a built-in camera, which captures the user’s surroundings and allows virtual elements to be placed within the real-world environment.

Distributed ledger technology (DLT) is a type of database that is distributed across a network of computers, rather than being stored in a central location. It allows multiple parties to share and update a single, tamper-evident record of transactions or other data, without the need for a central authority to oversee the process.

One of the most well-known examples of #DLT is the blockchain, which is a decentralized, distributed ledger that is used to record and verify transactions in a secure and transparent manner. Other examples of DLT include distributed databases, peer-to-peer networks, and consensus-based systems.

DLT has a wide range of potential applications, including financial transactions, supply chain management, and identity verification. It is also being explored for use in the development of new products and services, such as smart contracts and decentralized applications (dApps).

The Internet of Things (IoT) is a network of connected devices that are able to communicate and exchange data with each other. These devices can range from simple sensors and actuators to more complex devices such as smart thermostats and appliances.

The #IoT is made possible by the widespread availability of broadband internet, as well as the development of low-cost sensors and other technologies that enable devices to be connected to the internet. These devices are often equipped with sensors that allow them to gather data about their environment or their own operation, and are able to communicate this data to other devices or systems.

The IoT has the potential to transform many aspects of our lives, including how we live and work. For example, smart home systems that use IoT technology can allow users to control and monitor their home appliances and systems remotely, and can provide alerts and notifications about potential issues. The IoT is also expected to play a significant role in the development of smart cities, which are urban environments that use technology to improve the quality of life for residents.

 Ahmed Banafa, Author the Books:

Secure and Smart Internet of Things (IoT) Using Blockchain and AI

Blockchain Technology and Applications

Quantum Computing

References

1. “Secure and Smart IoT Using Blockchain and AI “ Book by Prof. Ahmed Banafa

2. “Blockchain Technology and Applications “ Book by Prof. Ahmed Banafa

3. ChatGPT (Chat of Generative Pre-training Transformer)

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Effective Writing and ChatGPT. The SEMI Test

Effective Writing and ChatGPT. The SEMI Test
by Bernard Murphy on 01-25-2023 at 6:00 am

Writing and ChatGPT min

ChatGPT is a hot topic, leading a few of my colleagues to ask me as a writer what I think of the technology.  I write content for tech companies and most of my contacts freely confess that they or more often their experts struggle with writing. If a tool could do that job for them they would be happy and I would have to find a different hobby. Overlooking the usual hype around anything AI,  I have seen a few examples of ChatGPT rewrites which I found impressive. Since I can’t get onto the site to test it myself (overload?), I must base what follows on those few samples.

As a promoter of AI, I can’t credibly argue that my expertise should be beyond AI’s reach. Instead, I spent some time thinking about where it might help and where it probably would not be as helpful. This I condensed into four objectives I consider important in effective writing: style, expertise, message, and impact (SEMI, conveniently 😊). Think of these as layers which progressively build an impression for a reader, rather than sequential components.

SEMI

Style: Inexperienced writers commonly spend too much time here, suggesting a possible advantage for novices. Write a first pass in your own style, then run it through the tool. ChatGPT will output reasonable length sentences and paragraphs in a conversational style. Probably easier to read than your first-pass. I haven’t been able to check if it supports conference paper style (3rd person, passive voice, etc.). The technology seems like it could offer a real advantage to anyone agonizing over their awkward prose or endlessly circling around the right way to phrase a particular sentence. That said, I advise reading the output carefully and correcting as you see fit.

Expertise: AI isn’t magical. ChatGPT is trained over huge amounts of data but almost certainly not huge amounts in your specialized niche. It can provide well-written general prose embedding your technical keywords or phrases, but your readers are looking for expert substance or better yet novel expert substance, not prose decoration around tech/buzz keywords. Only you can provide that depth, through examples and analysis. ChatGPT can still help with style after you have written this substance.

Message: Your target readers are looking for articles with a point. What is the main idea you want to convey? Implicitly perhaps “buy my product”, but raw commercials have a small audience. The message should be a useful and informative review of a general opportunity, need or constraint in the market you serve. Something readers will find valuable whether or not they want to follow up. The message should shape the whole article, from opening to closing paragraph. I very much doubt that ChatGPT can do this for you unless that message is already written into the input text.

Impact: What should I remember the day after or a week after I have read your article? We don’t remember lists. Your article should build around one easily remembered message. We also don’t remember “more of the same” pitches. We remember novelty, a new idea or twist which stands out from an undifferentiated background of “me too” claims from others. Novelty can be in the message, in the expert examples you present, or in a (product independent) claim of the characteristics of a superior solution. You should also consider that your article leaves an impression about yourself and about your company, as a source to be trusted. Or otherwise.

One last note. Readers develop impressions in SEMI order. I don’t approach writing in this order. I first think about the message. For expertise, I specialize in a relatively narrow range of technologies, and I talk to client experts before I write to provide me with strong and current examples. Style is something I have developed over the years, though I will certainly experiment with ChatGPT when the site again becomes available. Finally, lasting impact starts with the message. I finish the first draft then move onto something else for at least a day. Coming back later gives me time to mull over and consider improvements to better meet each of the SEMI objectives.

I’d be interested to hear about your ChatGPT experiments 😊

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All-In-One Edge Surveillance Gains Traction

All-In-One Edge Surveillance Gains Traction
by Bernard Murphy on 01-24-2023 at 10:00 am

Surveillance cameras min

Like it or not, the surveillance market is growing, at a CAGR approaching 10%. Big brother concerns sometimes cloud the picture but overlook the much larger practical yet less hype-worthy applications for surveillance. Home and industrial security, enhanced traffic flow management, monitoring for fire and other fast-growing threats. In support of crime scene investigations and in bodycams. What is common to all these applications is that they must be deployable at volume, low power, sometimes portable, always connected. Supporting ever-increasing resolution while intelligently filtering data upload to only significant activity, for review by human monitors .

Profile of a state-of-art surveillance platform

Start with the basics. A surveillance camera can no longer afford to stream a full video channel. The communication overhead and cost would simply be too high. Video must be cleaned up through image signal processing (ISP). Then run through object detection to filter out all but significant frames for upload (a person, a possible fire, an emergency vehicle). Now multiply this basic framework to support several cameras. Some perhaps pointed in different directions, some providing a stereo view through 2 image sensors. Some may be fisheyes, supporting a 360o image. These might be complemented by other types of sensors such as motion and perhaps range detectors.

Processing each image view depends on strong ISP functionality, for noise reduction, dynamic range optimization, de-warping for fisheye views, and much more. Then image recognition through inferencing on one or more trained networks. However these independent views become much more powerful when combined through sensor fusion. The views from 2 stereo sensors together can provide a depth assessment. Motion or range input can further enhance those approximations. Detection across multiple sensors provides path information for a moving object. All this detection demands an advanced platform to simultaneously process object detection and fusion from multiple sensors inputs.

Novatek Microelectronics Corp recently released their NT98530 multi-sensor IP Camera SoC targeting surveillance, retail, smart city, and transportation applications. This SoC is a good example of a platform targeting just these goals. It supports 8 mega pixels at 60 frames/sec while simultaneously performing advanced object recognition on each frame. All in an SoC providing almost all the electronics required by that multi-sensor platform, at a unit cost which will support wide deployment at low power.

CEVA SensPro2 inside

CEVA is well known for their DSP-based solutions for computer vision, audio, wireless and AI and have been working together with Novatek for almost ten years now. SensPro2 builds on the earlier SensPro Gen-1, increasing performance across a range of neural net benchmarks by up to a factor of 2. Computer vision and SLAM benchmarks improve by as much as 5X. There are even better improvements in speech and radar processing. All continue to be supported by rich software libraries and tools for mapping standard networks onto the neural net platform. Novatek deployed their NT98530 on top of SensPro2. claiming it delivers superior real-time performance for computer vision, AI-based analytics and multi-sensing sensor fusion at the edge, for a powerful, flexible edge AI camera solution which customers can mold to their requirements.

CEVA sensor fusion IPs are already deployed in a wide range of OEM products, from smart TVs to fixed wireless access devices, robot vacuums and VR/AR headgear. You can learn more in this press release with Novatek and this product page.

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Podcast EP140: Hyperstone’s Unique Position as a Supplier to the Industrial Market

Podcast EP140: Hyperstone’s Unique Position as a Supplier to the Industrial Market
by Daniel Nenni on 01-24-2023 at 6:00 am

Dan is joined by Steffen Allert. Since 2007, Steffen has been the Vice President of Sales for Hyperstone, a producer of Flash Memory Controllers for Industrial Embedded Storage Solutions. Steffen brings more than 20 years of sales and management experience in the semiconductor and electronics market.

Dan explores the unique position Hyperstone has as a supplier to the industrial market. Steffan explains the special demands this market presents regarding quality, low power, security, supply and reliability. Steffan discusses some of the new developments for the coming year at Hyperstone, including architectural enhancements to support greater security.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


Webinar: Achieving Consistent RTL Power Accuracy

Webinar: Achieving Consistent RTL Power Accuracy
by Daniel Nenni on 01-23-2023 at 10:00 am

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A comprehensive report from the US Department of Energy (DOE), “Semiconductor Supply Chain Deep Dive Assessment” (February 2022) calls for a 1000X energy efficiency improvement that is required to maintain future compute requirement needs given a finite amount of world energy production. Energy efficiency is at the top of designers’ minds today. A holistic approach to energy efficiency must start at the earliest stages of the design flow, at the architectural and micro-architectural levels. It is at those levels of abstraction where designers can evaluate power-performance-area tradeoffs and create energy-efficient architectures. Later stages in the design process present limited opportunities for power reduction.

Energy efficiency and power optimization efforts must be guided by power analysis at all levels of abstraction. Early power analysis is intrinsically less accurate than signoff power analysis in the implementation phases, but the goal of early power analysis must be to provide consistent accuracy to the designers to enable them to make informed decisions.

Traditional Register Transfer Level (RTL) power analysis tools take into account a very limited amount of information related to the actual implementation of the design. Fast synthesis technologies used in such tools are typically not timing driven, have limited parasitic capacitance estimation capabilities, build simple fanout-driven clock tree structures, and use imprecise heuristic methods for glitch power calculation.

These considerations call for the new generation of RTL power analysis tools to provide consistent accuracy by leveraging technology-related information, timing constraints, and accurate glitch power modeling. Such tools deliver a tight correlation of RTL power analysis vs. final signoff analysis in a consistent manner. This consistent accuracy is made possible only with the deep understanding of the implementation and signoff power calculation algorithms.

If you are designing chips for high-performance computing (HPC) and data center applications, bandwidth is, of course, a key consideration. However, as data centers get bigger and the required compute power increases, keeping power consumption to a minimum becomes a priority. In addition to power, latency is another key concern for HPC and data center SoC designers as access to the available memory pool is becoming a bottleneck and must be allowed in nanoseconds.

Webinar: Achieving Consistent RTL Power Accuracy

Register Transfer Level (RTL) power analysis, performed early in the design cycle, is a key component of end-to-end methodology to maximize energy efficiency. Such analysis has become a critical requirement for many IC designs today and in the future. Although RTL power analysis technology has been available to designers for many years, traditional approaches have relied on heuristic methods – thus lacking consistent accuracy. This webinar, presented by Alexander Wakefield, Synopsys Scientist, will focus on Synopsys RTL power analysis technology and best practices that achieve consistent accuracy in the design flow.

First, the motivation for RTL power analysis will be briefly outlined in the context of the overall methodology. Next, the basics of power consumption and associated calculations will be reviewed. Following that, several key factors affecting RTL power accuracy will be examined: fast synthesis and mapping, clock tree modeling, and parasitics estimation. These factors will also be compared with heuristic methods, and finally, some of the best practices to achieve good correlation and consistent accuracy will be covered.

REGISTER HERE

Presenter Bio:
Alex Wakefield is a Synopsys Scientist, with degrees in Engineering and Computer Science from the University of Adelaide, Australia. He has worked for more than 20 years in many areas including Synthesis, Simulation, SystemVerilog, UVM, Constraints, Coverage closure, and Embedded-Software. He has presented papers at many conferences and holds multiple patents. The last few years Alex has primarily been focused Power-Estimation, Leading the Synopsys global rollout of Power-Estimation with Zebu. He is involved in all Synopsys Power-Estimation engagements worldwide.

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Podcast EP139: The Third Quarter ESDA Market Data Report with Dr. Walden Rhines

Podcast EP139: The Third Quarter ESDA Market Data Report with Dr. Walden Rhines
by Daniel Nenni on 01-23-2023 at 8:00 am

Dan discusses the recent Q3 2022 ESDA report with Wally Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. While not tracking the record-breaking growth that has been seen over the past few quarters, growth is generally quite strong across the world. Dan explores the numbers with Wally, including some surprising growth results in certain regions.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


Samtec Dominates DesignCon (Again)

Samtec Dominates DesignCon (Again)
by Mike Gianfagna on 01-23-2023 at 6:00 am

Samtec Dominates DesignCon Again

Many technical shows have anchor tenants. Those are the companies that can be counted on to have a substantial booth presence, be active in the technical program and just pump life into the event at every turn. Samtec is that company for many shows around the world. And soon it will be time for them to work their magic at DesignCon in Santa Clara. . This show has clearly benefited from Samtec’s presence and energy for quite a while. Read on to see how Samtec dominates DesignCon (again).

Before I get into the details, know that DesignCon will be held at the Santa Clara Convention Center from January 31 – February 2. The show is focused on chip, board, and systems design engineers. This is the intersection where Samtec lives, so you can begin to see why they are prominent at this show. You can head to Samtec’s show page here to receive a free Expo Pass and 20% discount for conference passes. Free stuff is a great way to start any show.

Let’s take a look at where Samtec will be at DesignCon.

Start Things Off at Tuesday’s Welcome Reception, Sponsored by Samtec

Begin at the welcome reception, courtesy of Samtec. The event is Tuesday, January 31 from 6-8 PM in the Hyatt’s Santa Clara Ballroom.  The theme focuses on a tribute to engineers’ contributions to space exploration. Lots of cool gear and stories.

Author Meet & Greet

Istvan Novak, Principal SI-PI Engineer at Samtec, has created a new edition of Power Distribution Network Design Methodologies, which includes selected DesignCon papers from the past. Stop by the Samtec booth (#939) on February 1 from 2:30-3:00 to meet Istvan. He will be joined by several other prominent authors who will talk about their latest books as well.  

Product Showcase

On Wednesday at 3PM Samtec technologists will showcase high-speed interconnects staged for 224 Gbps signaling. You can learn about their power connectors and considerations required for high-speed channels – signal integrity and power integrity.

Booth Demonstrations Wednesday and Thursday

Samtec will be presenting multiple demonstrations featuring products that will help you design systems at 112 Gbps, as well as set you up for 224 Gbps. The details aren’t available yet, but I’m told you can expect production demos at 112G and proof-of-concept demos at 224G. Samtec knows how to create eye-catching, impressive demos. Don’t miss this.

And Everywhere Else 

Samtec products will show up throughout the show floor. Be sure to stop by Rohde & Schwarz (Booth #1049) and Keysight (Booth #1039).

Technical Sessions Tuesday-Thursday

There is also a robust technical program at DesignCon. Samtec is all over that as well. Here is where you can see them:

Panel – PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels

January 31 (Tuesday), 4:45 – 6:00 PM, Ballroom FPanelist: Steve Krooswyk, Senior Signal Integrity Design Engineer at Samtec

Successful PCIe Interconnect Guidelines for 8, 16, and 32 GT/s
February 1 (Wednesday) 9:00 – 9:40 AM, R&S Workshop, Room TBD
Speaker: Steve Krooswyk, Senior Signal Integrity Design Engineer at Samtec

112 Gbps PAM4 Front Panel Connectivity – Real World Implementation and Correlation
February 1 (Wednesday) 11:10 – 11:50 AM, R&S Workshop, Room TBD
Speakers: Greg Vaught, VNA Product Planning Engineer, Rohde & Schwarz & Matthew Burns, Technical Marketing Manager, Samtec

A Novel Approach to 224 Gb/s Reference Receiver Design Using Raised Cosine Response for Noise Mitigation
February 1 (Wednesday) 2:00 – 2:45 PM, Ballroom G
Co-Author: Rich Melitz, Samtec

Panel – What Users Need from Power Integrity Simulators
February 1 (Wednesday) 4:00 PM – 5:15 PM, Ballroom F
Moderator: Istvan Novak, Samtec

3D Connection Artifacts in PDN Measurements
February 2 (Thursday) 9:00 AM – 9:45 AM, Ballroom G
Co-Author: Istvan Novak, Samtec

Cascaded vs End-to-End Multi-Pin Interconnect Simulation Models
February 2 (Thursday) 11:15 AM – 12:00 PM, Ballroom H
Speaker: Robert Branson, Samtec

Envisioning the Future of Power Integrity through the Eyes of Experience
February 2nd (Thursday) 2:00 PM, Cadence Sponsored Session
Speaker: Istvan Novak, Samtec

Conclusion

There you have it. This is most of the places you can see Samtec at DesignCon. It promises to be a great show. You need to be there to see how Samtec dominates DesignCon (again).

 


Podcast EP138: The Impact of Using a Physically Aware NoC with Charlie Janac

Podcast EP138: The Impact of Using a Physically Aware NoC with Charlie Janac
by Daniel Nenni on 01-20-2023 at 10:00 am

Dan is joined by Charlie Janac, president and CEO of Arteris IP. Charlie’s career spans 20 years in multiple industries, including design automation, semiconductor capital equipment, nanotechnology, industrial polymers, and venture capital.

Charlie discusses the benefits of using network-on-chip, or NoC IP on several types of design projects. He also discusses the substantial benefits of using physical awareness for the NoC and how to set up this valuable capability.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


CEO Interview: Stephen Fairbanks of Certus Semiconductor

CEO Interview: Stephen Fairbanks of Certus Semiconductor
by Daniel Nenni on 01-20-2023 at 6:00 am

Stephen Fairbanks headshot 1 1

Trained as a semiconductor Analog and RF Circuit Designer, Stephen Fairbanks has been designing and developing process-specific I/O and ESD libraries for 24 years. His foundational training began while attending Brigham Young University designing highspeed 32 GSPS data acquisition systems and RF interfaces for a time-of-flight mass spectrometer. Soon after, he joined Intel, where he became the lead developer of the ESD and I/O libraries for what was then Intel’s wireless, cellular, and mobile computing groups. He led the development of the I/O and ESD used on the initial generation and subsequent generations of wireless components for Intel Centrino chipsets and StrongARM cellular platforms. He was personally responsible for the ESD development and I/O support for three families of cellular communications processors and four families of handheld applications processors.

Leaving Intel in 2006, he became an ESD and I/O consultant, establishing SRF Technologies and Certus Semiconductor. Several of his most notable efforts were assisting companies to find ESD solutions for groundbreaking, first-generation technologies. These include but are not limited to ESD protection strategies on many of Qualcomm’s (Atheros) early generation RF front ends for cellular platforms; Inphi, Intel, Xilinx, and Freescale’s (NXP) first generation 10, 28, and 56 GBPS interfaces, and many of Synaptic’s early generation Touch-Screen Interfaces IC’s and Touch-Display IC’s.

Certus Semiconductor has the only commercially available production-proven high-voltage ESD solutions (-18V to 30V, including a 100V pk-to-pk RF Switch) in standard Low Voltage 3.3V, 2.5V, and 1.8V CMOS, for 40nm and below process nodes. These unique solutions have enabled several customers to interface NFC, high-voltage analog, and MEMS I/O’s directly, into low-voltage standard CMOS processes.

At Certus, Stephen has developed ESD process design rules, ESD libraries, and I/O libraries in logic, RF, mixed-signal, and high-voltage BCD processes at the 0.25um, 0.18um, 0.13um, and bulk-CMOS processes 90nm, 65nm, 45/40nm, 28nm, 22nm, 16nm, 12nm, 11nm, and 5/7nm processes. Stephen is familiar with several specialty processes, including HV BiCMOS, flash memory, SiGe, FD-SOI, SOS, and InP.

What is Certus Semiconductor’s backstory?

Certus Semiconductor began as a collaboration between myself, Freescale’s I/O and ESD team, and an ESD consultant, Markus Mergens of QPX. We started the business by putting together commercial I/O packages and marketing Freescale IP with SRF/QPX I/O and ESD custom solutions. When NXP acquired Freescale, the collaboration ended. I maintained the rights to the Certus Semiconductor brand and continued building the business under SRF Technologies. We have expanded our IP offerings to include I/O libraries as well as ESD solutions in many foundries, from 180nm to 11nm, with current R&D at smaller nodes.

What makes Certus’ I/O and ESD solutions unique?
Several features make our solution unique and appealing to our customers. Certus’ complete custom libraries target robustness, noise, distortion, low capacitance, increased ESD, and more. We offer smaller ESD footprints, removing the need for a special mask layer and saving money per wafer. Our low-capacitance ESD enables RF and high-speed digital I/O’s as well as extreme ESD up to 16kV and radiation hardening can also be achieved. We have 3.3V – 5V digital and analog solutions in native 1.8V processes and offer >20V switches using standard low-voltage CMOS technology, allowing for the direct integration of high-voltage analog, sensors, RF, and MEMS. I could continue listing the features that make Certus’ I/O and ESD solutions unique. However, the most important aspect is we tailor our I/O libraries to help our customers differentiate their products in their specific space and our solutions are the highest performance in the industry. Our primary goal is to give our customers a performance and cost advantage over their competitors.

What market segments benefit the most from Certus’ IP?
We have customers across the whole gambit of the industry. From video/audio chips, FPGA, MEMS, mobile phone chips, image processors, ASICs, automotive, sensors, and virtual reality, we offer the entire industry unique I/O and ESD solutions. Consumer electronics benefit from our exceptional ESD protection, smaller GPIO footprints, higher speeds, and lower power, all of which are cost conscious. We offer the Industrial electronics segment benefits from the ESD protection we can provide and the increased robustness, reliability, and feature sets. Regarding automotive, the benefits include increased robustness and higher ESD and voltage tolerances. The Aerospace sector benefits from our solutions’ increased robustness and reliability, high temperature, and radiation-hardened capabilities.

Why should companies choose Certus’ solutions?
If a company has no special requirements, it should use foundry IP. From my experience, that is often not the case, and companies are looking for specific features. If you are looking for features that foundry IP does not offer, such as increased performance, smaller area, or specific advantages over competitors (leakage, capacitance, noise, etc.), our solutions provide these features and more. Many times, we have yet to determine the exact product a customer is looking for, but through engagement, we figure out what our customers need and how we can best optimize their solutions. Additionally, through close interaction with our customers, we brainstorm new features they may not have considered an option, that helps expand their product’s capabilities.

What makes Certus stand out against its competitors?
We offer designs that our competitors do not have. Our I/O performance is addressed by our multi-protocol GPIO that supports various standards with extended specifications across multiple voltages, along with our specialized high-speed die-to-die interface solutions. Our solutions strip away unnecessary features and deliver better ESD performance in a smaller footprint. We optimize power by offering I/O’s that can operate at different voltages selectable by the system, we create dedicated I/O’s tailored for low-power operation. Robust ESD performance is challenging for many companies. ESD engineers founded Certus, and not only do we address standard ESD requirements such as HBM and CDM, we also provide on-chip solutions for standards such as system-level IEC 6100-24-2 and Cable Discharge Events.

Many of our competitors only offer ESD solutions and do not offer entire I/O libraries. Even those who do provide full I/O libraries do not work with their customers as we do. We work hand in hand with our customers and tailor our libraries to meet their needs. We aim to ensure our customers have the best I/O library to meet their needs. We take pride in engaging with our customers as though we were part of the internal I/O and ESD development teams. Finally, we have created a library of industry leading functions at leading nodes which allows us to quickly customize and meet customer’s requirements.

What do the next 12 months have in store for Certus?
We look to grow our business and partnerships over the next 12 months. We have added to our executive staff to expand our market focus and have increased our analog design capabilities. We are considering expanding into the analog design space as we have several customers with analog design needs. Additionally, we are strengthening our partnership with GlobalFoundries and several others. As we grow, we look to continue improving our existing IP and develop new solutions for smaller process nodes. In 12 months, we aim to be the go-to provider for custom I/O and ESD solutions.

How do customers engage with Certus?
We enjoy working closely with our customers and look forward to engaging with other forward-thinking companies. Contact info@certus-semi.com or visit us at www.certus-semi.com to get started!

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ATSC 3.0: Sleeper Hit of CES 2023

ATSC 3.0: Sleeper Hit of CES 2023
by Roger C. Lanctot on 01-19-2023 at 10:00 am

ATSC 3.0 Sleeper Hit of CES 2023

Ten years ago the Open Mobile Video Coalition was touting its plans to deliver free over-the-air television to mobile devices and automobiles. At the time, OMVC was seen as the realization of a dream of delivering video to cars – front seat and back.

The dream didn’t last long and the plans for ATSC M/H brought to the market by the OMVC died and with them the hopes for delivering a shot in the arm to the moribund automotive aftermarket. Those dreams are now being realized with the onset of ATSC 3.0 from the Advanced Television Systems Committee which exhibited at the Consumer Electronics Show – CES 2023 – last week.

The new standard, also known as NextGen TV, offers a host of enhanced experiences including support for HEVC for video channels up to 2160p 4K resolution at 120 frames per second, wide color gamut, high dynamic range, Dolby AC-4, and MPEG-H 3D audio, datacasting, enhanced public alerts, targeted advertising, and mobile television support. The technology also offers the prospect of enhanced positioning technology to support vehicle navigation and autonomous driving.

Perhaps even more important, though, is the key role the automotive industry is likely to play in the ongoing and widespread adoption of ATSC 3.0 in the U.S. and a handful of other geographies globally. Since the average television consumer is unlikely to ask for ATSC 3.0 in their next television set, it is most likely that auto makers will be in position to drive adoption and awareness of the new tech. (For home TV reception broadcasters will continue to support both the current ATSC 1.0 and the new 3.0 standards.)

With larger vehicles arriving in the U.S. market creating opportunities for both rear and front-seat entertainment, ATSC 3.0 presents a unique fore market and aftermarket opportunity. Car makers – most notably Hyundai, likely to be the first – will accelerate plans to introduce ATSC 3.0, while installers will be looking for aftermarket offerings – which are growing in number.

ATSC 3.0 arrives just as the likes of Kenwood/JVC, Alpine, Pioneer, Kicker, and other aftermarket players decamped from CES 2023 in favor of KnowledgeFest in February, according to the CEOutlook newsletter. The automotive aftermarket was hit hard once auto makers began building large-screen infotainment systems into their cars along with navigation and smartphone integration.

ATSC 3.0 may be a yawn for buyers of new digital televisions for their homes – but it represents a revelation for in-car solutions. The technology is particularly attractive for auto makers because it is suitable for datacasting of software updates – a solution rapidly sweeping the industry in the context of vehicles increasingly defined by large software portfolios.

ATSC 3.0 signals are already available to two thirds of the continental U.S. population focused around major metropolitan areas with nationwide coverage in sight by 2025. The technology offers a first-time experience for drivers and their passengers carrying, as they will, enhanced audio and video, local emergency communications, positioning assistance, and software updates. And, best of all, it is free. More importantly, it has already been tested in Michigan and elsewhere, proving the technology is robust and market ready.

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