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Complex SoC project teams typically use a divide and conquer approach where specialized engineers work in separate domains, like front-end or back-end. The five major engineering tasks for IC design can be described as: RTL design, synthesis, floor planning, place and route, then finally design analysis.
What if you could detect… Read More
When I upgraded cars from a 1988 to 1998 Acura it seemed like my car had become much smarter with a security chip in the key, security codes in the radio and a connector for computer diagnosis, however in today’s modern auto there’s a lot more mixed-signal design content. Micronasand Synopsysgot together and hosted … Read More
SiC and Si Power Devicesby Daniel Payne on 09-27-2014 at 7:00 amCategories: EDA
ICs for consumer electronics are often battery powered, which are considered low voltage designs. On the other end of the IC spectrum are high voltage devices used in many industrial applications like: automotive, aerospace, data centers, transportation and power generation. … Read More
The periodic table shows that Silicon (Si) is in a column along with other elements like Carbon (C) and Germanium (Ge). With so much emphasis on Silicon, you’d think that the other semiconductor materials have been neglected a bit.
Silicon is a wonderful material and most of our consumer electronics and handheld devices … Read More
IC designers have been running analysis tools for power, noise and reliability for many years now, so what is new when you start using FinFET transistors instead of planar transistors? Calvin Chow from ANSYS (Apache Design) presented on this topic earlier in the summer through a 33 minutewebinar that has been archived. There is… Read More
Next week Mike Jensen of Mentor will present a webinar Improving Complex System Design Reliability and Robustness. The webinar will be presented live twice and presumably available for replay soon after, as is usually the case:
- September 4th 6.00-6.45am pacific (9pm in Asia, 3pm in most of Europe)
- September 4th 10.00-10.45am
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Planar CMOS processes have been offered for decades now, and all the way down through the 28nm node it has been riding the benefits of Moore’s Law. A few years back we started hearing from Intel about TriGate (aka FinFET) starting at the 22nm node as a way to use a more 3D processing approach for transistors instead of planar CMOS.… Read More
Verification has been going through a lot of changes in the last couple of years. Three technologies that used to be largely contained in their own silos have come together: simulation, emulation and virtual-platforms.
Until recently, the workhorse verification tool was simulation. Emulation had its place but limits on capacity… Read More
One of the challenges in bringing a design into production is getting a quote that includes all the various stages of the process. The quote cycle typically takes a couple of weeks. It is also pretty wasteful. A typical design might be quoted by 3 manufacturers and so 2 out of 3 quotes are wasted expense because the design is lost to a … Read More
The last graphics chip that I worked on at Intel was functionally simulated with only a tiny display size of 16×16 pixels, because that size allowed a complete regression test to be simulated overnight. Our team designed three major IP blocks: Display Processor, Graphics Processor and Bus Interface Unit. We wanted to also… Read More