– ASML has good quarter driven by DUV & Logic (@72%)
– SMIC & other major customer slow EUV plans
– Logic (read that as TSMC) remains key demand led driver
– We are happy memory remains muted given cyclical potential
A very solid quarter with a continued road to growth
The quarter came in at Euro4,254B… Read More
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
Understanding Intel’s future means understanding Intel’s past
Yes, there are two paths you can go by, but in the long run. There’s still time to change the road you’re on.
Intel is at a crossroad. The road they have been on since inception, and the road that has differentiated them from the rest of the pack… Read More
It is quite amazing that silicon-based devices have been the foundation of our industry for over 60 years, as it was clear that the initial germanium-based devices would be difficult to integrate at a larger scale. (GaAs devices have also developed a unique microelectronics market segment.) More recently, it is also rather … Read More
US BIS confirms our prediction of “blacklisting” SMIC
SMIC embargoed from 10NM or better technology
Likely related to ASML pressure & WH scorched earth
We had received a lot of feedback on our Nov 30th note regarding blacklisting of SMIC suggesting that we were wrong and the only thing blacklisted… Read More
The vast majority of the attention given to the introduction of each new advanced process node focuses on lithographic updates. The common metrics quoted are the transistors per mm**2 or the (high-density) SRAM bit cell area. Alternatively, detailed decomposition analysis may be applied using transmission electron microscopy… Read More
The introduction of heterogeneous 3DIC packaging technology offers the opportunity for significant increases in circuit density and performance, with corresponding reductions in package footprint. Yet, the implementation of a complex 3DIC product requires a considerable investment in methodology development for all… Read More
What is the “right track” for US-China trade relations?
The semiconductor industry has been squarely in the crosshairs of US-China trade tensions for four years. As the US faces a presidential leadership transition, will a Biden administration change the dynamic? The chip industry is counting on it, and China hopes so too.
In … Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More
Bloomberg did an interview with my favorite semiconductor analyst Stacy Rasgon on “How the Number One U.S. Semiconductor Company Stumbled” that I found interesting. Coupled with the Q&A Bob Swan did at the Credit Suisse Annual Technology Conference I thought it would be good content for a viral blog.
