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Everyone has been treating Intel as a turnaround story. What if it’s not a scheduled airline — but a charter, and Musk is the one filing the flight plan? Not just Tesla. Companies like Microsoft, Google, Meta, and Oracle are all designing their own silicon now, and their AI infrastructure depends on it. And yet they remain dependent… Read More
Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea
Why do professional executives running major corporations frame a major moment in their company’s history with a tweet? Jerry Sanders spent his career yelling “real men have fabs!” Now Intel has fabs–and apparently tweets about … Read More
Semiconductor Intelligence estimates total semiconductor industry capital spending (CapEx) was $166 billion in 2025, up 7% from 2024. We estimate 2026 CapEx will be $200 billion, up 20% from 2025. TSMC was the largest spender in 2024 with $40.9 billion in CapEx, 25% of the total. TSMC projects 2026 CapEx will be between $52 billion… Read More
In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible RISC-V ISA from an exciting specification… Read More
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
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Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
- TSMC’s
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Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
…
Read More
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
…
Read More
Join us to get the latest on:
- TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
- TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
…
Read More
Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and risk-averse—the… Read More
