SK hynix’s Hot Chips 2026 presentation explains how High Bandwidth Memory (HBM) is evolving to meet the extraordinary memory requirements of artificial intelligence. Its central message is that future progress will depend not only on better DRAM circuits but also on advanced packaging, denser vertical integration, improved… Read More
TSMC’s overseas fabrication strategy is beginning to deliver its intended return: not immediate cost parity with Taiwan, but manufacturable geographic redundancy, closer integration with major customers and access to subsidized capacity in strategically important markets. Arizona and Kumamoto are already producing … Read More
On May 25, Huawei semiconductor chief He Tingbo unveiled LogicFolding, an architecture intended to advance chip performance without relying on ever-smaller transistors. Presented alongside Huawei’s “Tau Scaling Law,” the approach prioritizes signal speed over transistor dimensions. It is a genuine engineering response… Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More
Capital spending is often treated as if it becomes semiconductor capacity about twelve months later. That can be a useful rule for equipment installed in an existing fab. It is a poor description of a new fab built from the ground up.
I tested the distinction using five advanced-node projects in the United States where… Read More
