AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?

AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?
by Robert Maire on 11-17-2024 at 8:00 am

Applied Materials

– AMAT has OK QTR but outlook below expectations as 2025 weakens
– Strength in AI cannot offset weakness in the rest of the market
– Increasing headwinds going into 2025 dampen overall outlook
– Weakness combined with regulatory uncertainty reduce valuations

Quarter and year are just OK but outlook is
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Analog IC Migration using AI

Analog IC Migration using AI
by Daniel Payne on 11-14-2024 at 10:00 am

Analog Migration with virtuoso studio

My first job out of college was migrating a DRAM chip from one process node to a newer node, and it was a 100% manual process that required many months of effort. That need to migrate semiconductor IP to newer nodes is still with us today, and much automation has been applied to digital circuits, however migrating analog IP has proven… Read More


TSMC EU OIP Ecosystem Forum (In-Person Event)

TSMC EU OIP Ecosystem Forum (In-Person Event)
by Admin on 11-12-2024 at 3:09 am

Learn About:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement
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KLAC – OK Qtr/Guide – Slow Growth – 2025 Leading Edge Offset by China – Mask Mash

KLAC – OK Qtr/Guide – Slow Growth – 2025 Leading Edge Offset by China – Mask Mash
by Robert Maire on 11-02-2024 at 8:00 am

KLAC 2024
  • KLA put up an OK Quarter & Guide with modest growth & outlook
  • 2025 remains slow growth as leading edge offset by China slowing
  • China sanctions remain a “great unknown”- impact unclear
  • Reticle biz getting squeezed from both high & low ends
OK quarter with slight beat as always- Guide is OK as well

KLA reported… Read More


Shaping Tomorrow’s Semiconductor Technology IEDM 2024

Shaping Tomorrow’s Semiconductor Technology IEDM 2024
by Scotten Jones on 10-23-2024 at 6:00 am

IEDM 2024 SFO

Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.

Some highlight of this year’s technical program are:

AI  – Lots of artificial… Read More


ASML surprise not a surprise (to us)- Bifurcation- Stocks reset- China headfake

ASML surprise not a surprise (to us)- Bifurcation- Stocks reset- China headfake
by Robert Maire on 10-16-2024 at 10:00 am

ASML 2024 Downturn
  • Investors finally realize the upcycle isn’t as strong as stocks indicated
  • Industry Bifurcation between AI & rest of industry continues
  • China spending risk/overhang finally kicks in
  • AI is super strong, majority of chips remain weak- Invest accordingly
ASML simply states chip industry reality that investors have
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Alchip Technologies Sets Another Record

Alchip Technologies Sets Another Record
by Daniel Nenni on 10-14-2024 at 10:00 am

Alchip Q2 2024

The ASIC business has always been a key enabler of the semiconductor industry but it is a difficult business. In my 40 years I have seen many ASIC companies come and go but I have never seen one like Alchip.

Alchip Technologies Ltd. was founded more than 20 years ago, about half way through my career.  I know one of the founders, a fiercely… Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


TSMC Open Innovation Platform® Ecosystem Forum 2024 – China

TSMC Open Innovation Platform® Ecosystem Forum 2024 – China
by Admin on 09-30-2024 at 5:49 am

The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers.… Read More