Dr. Solaiman Rahim is a multidisciplinary technology executive with over 25 years of experience driving innovation in the chip automation space at the intersection of systems, semiconductors, high-performance computing, and AI. As Chief Product Officer at ChipAgents, he leads the scaling of the Agentic and Native AI platform… Read More
High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment. It became tempting to confuse a delayed adoption curve with a technology… Read More
Discussions around TSMC’s vertical DRAM patents raise an intriguing question: could the world’s leading foundry eventually challenge established memory manufacturers? The curiosity is understandable. Patent disclosures involving vertical transistors and integrated capacitors show that TSMC is exploring architectures… Read More
The semiconductor industry crossed $1 trillion in annual revenue this year, almost four years ahead of earlier projections. SEMI President and CEO Ajit Manocha opened the CEO Summit at SEMICON West with a chart that told the story. A year ago, the forecast for 2030 was $1 trillion. Now it is $2 trillion, with $3 trillion possible … Read More
Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it.
Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform ® (OIP) Ecosystem Forum ! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss … Read More
TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More
Growth in electronics production has been accelerating in 2026. Three-month-average change versus a year ago for electronics production in the U.S. was 8.1% in August 2026, continuing an accelerating growth trend since October 2025. Japan and the 27 countries of the European Union (EU 27) showed much stronger growth acceleration.… Read More
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More
TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More
