ASML is Strong Because TSMC is Hot!

ASML is Strong Because TSMC is Hot!
by Robert Maire on 10-15-2020 at 10:00 am

TSMC ASML EUV 2020
  • ASML has strong quarter lead by great Taiwan and EUV
  • EUV “crossed over” DUV as revenue leader- signaling new era
  • Taiwan doubles, China grows, Korea weaker, US further behind

ASML hits great numbers
ASML reported revenues of Euro 4B, with income of Euro 2.54EPS, both beating estimates handily. Ten EUV systems were … Read More


Semiconductor Review 2019 into 2020!

Semiconductor Review 2019 into 2020!
by Daniel Nenni on 01-03-2020 at 6:00 am

CES 2020

Semiconductors continue to surge and lead technology sectors all over the world. TSMC has always been my economic bellwether and 2019 was another great year as the TSM share price almost doubled. But it looks like the best is yet to come with TSMC significantly increasing CAPEX to cover 7nm and 5nm demand.

TSMC CEO C.C. Wei increased… Read More


Needham Growth Conference Notes 2019

Needham Growth Conference Notes 2019
by Robert Maire on 01-17-2019 at 12:00 pm

We attended the Needham Growth Conference which is one of the first conferences of the year and in the quiet period before most companies reported so even though there was no “official” comment from most companies on the quarter, the surrounding commentary spoke volumes:

  • The down cycle (and everyone admits its a cycle
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TSMC Q3 2018 Earnings Call Discussion!

TSMC Q3 2018 Earnings Call Discussion!
by Daniel Nenni on 10-22-2018 at 7:00 am

The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More


Apple iPhone Super Cycle Update!

Apple iPhone Super Cycle Update!
by Daniel Nenni on 09-01-2017 at 7:00 am

In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More


TSMC Design Platforms Driving Next-Gen Applications

TSMC Design Platforms Driving Next-Gen Applications
by Daniel Nenni on 03-03-2017 at 7:00 am

Coming up is the 23rd annual TSMC Technology Symposium where you can get first-hand updates on advanced and specialty technologies, advanced backend capabilities, future development plans, and network with hundreds of TSMC’s customers and partners. This year the Silicon Valley event kicks off at the Santa Clara Convention… Read More


MediaTek is on the Move with TSMC!

MediaTek is on the Move with TSMC!
by Daniel Nenni on 08-23-2016 at 4:00 pm

MediaTek (MTK) recently made the news for announcing their first leading edge SoC (Helio X30), a 32% increase in quarter over quarter sales, and an expected 30% increase for the year. Both of which deserve a closer look as we move into the second half of 2016 which should be very strong for MTK TSMC, and the fabless semiconductor ecosystem.… Read More


What is Inside the iPhone 7?

What is Inside the iPhone 7?
by Daniel Nenni on 08-20-2016 at 7:00 am

TSMC is the bellwether for not only the foundry business, since they are the dominant player, but also the semiconductor industry as a whole. You could also argue that TSMC is a sneak peek into the world economy since they build capacity based on their customer’s forecasts and the world now revolves around semiconductors.

The other… Read More


TSMC Update at #53DAC!

TSMC Update at #53DAC!
by Daniel Nenni on 05-31-2016 at 4:00 pm

TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More