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With the increasing complexity and diversity of the mechanical constraints and electrical requirements in electronic product development, printed circuit board designers are faced with a number of difficult challenges:
- generating accurate (S-parameter) simulation models for critical interface elements of the design
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Machine Learning and Embedded FPGA IPby Tom Dillinger on 07-18-2018 at 12:00 pmCategories: eFPGA, Flex Logix, FPGA, IP
Machine learning-based applications have become prevalent across consumer, medical, and automotive markets. Still, the underlying architecture(s) and implementations are evolving rapidly, to best fit the throughput, latency, and power efficiency requirements of an ever increasing application space. Although ML is … Read More
Samsung Foundry recently held their annual technology forum in Santa Clara CA. The forum consisted of: presentations on advanced and mainstream process technology roadmaps; the IP readiness for those technology nodes; a review of several unique package offerings; and, an informal panel discussion with IP designers and EDA… Read More
The upcoming Design Automation Conference in San Francisco includes a very interesting session –“Has the Time for Embedded FPGA Come at Last?” Periodically, I’ve been having coffee with the team at Flex Logix, to get their perspective on this very question – specifically, to learn about the key features that customers are seeking… Read More
Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy — Mobile, High-Performance Computing (HPC), Automotive, and… Read More
Hard IP for an embedded FPGAby Tom Dillinger on 04-30-2018 at 12:00 pmCategories: eFPGA, Flex Logix, FPGA, IP
As Moore’s Law enables increased integration, the diversity of functionality in SoC designs has grown. Design teams are seeking to utilize outside technical expertise in key functional areas, and to accelerate their productivity by re-using existing designs that others have developed. The Intellectual Property (IP) industry… Read More
IP providers need to evaluate several complex engineering problems when addressing customer requirements – perhaps the most intricate challenge is the degree of IP configurabilityavailable to satisfy unique customer applications. … Read More
With each new silicon process node, the complexity of SoC design rules and physical verification requirements increases significantly. The foundry and an EDA vendor collaborate to provide a “reference flow” – a set of EDA tools and process design kit (PDK) data that have been qualified for the new node. SoC design methodology … Read More
IPC-2581: The Standard for PCB Data Exchangeby Tom Dillinger on 02-19-2018 at 12:00 pmCategories: Cadence, EDA
The motivations to establish an industry standard data format are varied:
[LIST=1]
- solidify a “de facto” standard, transitioning its evolution and support from a single company to an industry consortium;
- aggregate disparate sources of design and manufacturing data into a single representation, with documented semantics;
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The IC industry is commonly divided into different market segments – consumer, mobile, industrial, commercial, medical, automotive, and aerospace. A key differentiation among these segments is the characterization and reliability qualification strategy for the fabrication process and design circuitry. For each segment,… Read More