Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic… Read More
Moortec is known for its innovative in-chip monitoring and sensing products. They’re based in the UK and have been delivering this kind of embedded technology since 2010. Dan Nenni covered an overview of the company recently. SemiWiki also hosted a webinar about optimizing power and increasing data throughput in AI from Moortec… Read More
At DesignCon 2020, ANSYS held a series of sponsored presentations. I was able to attend a couple of them. These were excellent events with the material delivered by talented and high-energy speakers. The DesignCon technical program has many dimensions beyond the conference tracks. One of the presentations dealt with 3D ICs.… Read More
PowerMOS devices play a major role in a variety of power converter and control circuits. Some examples of their applications include PMICs, or boost and buck converters. Often these are used in mobile and IoT devices to convert battery voltages to circuit operating voltages.
Due to their size and internal complexity PowerMOS … Read More
In electronic system design, we have grown comfortable with the idea that different regimes of analysis, such as the chip, the package and the system, or electrical, thermal and stress are more or less independent – what starts in one regime stays in that regime, give or take some margin information passed onto other regimes. And… Read More
By the time that your SoC comes back from the fab and you plugin it into a socket on a board for testing, it’s a little late in the cycle to start thinking about reliability concerns like: dynamic voltage drop, noise coupling, EM (Electro-Migration), self-heating, thermal analysis and ESD (Electro-Static Discharge). They… Read More
The server market is a diverse, yet standardized market. The ICs and components designed and manufactured in final assemblies must meet form factor requirements for rack mount and blades. The form factor enclosures and the component placement dictate the thermal-mechanical properties and hence the thermal cooling limits … Read More
Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.
On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More
