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Conferences and Courses 18 – 22 August 2024 | Exhibition 20 – 22 August 2024
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-We attended the SPIE lithography Conference in San Jose
-No significant news or announcements on EUV
-Focus on 500WPM target and High & Hyper NA rollout
-AMAT overblown Sculpta-Not exactly what its cracked up to be
We have been attending SPIE for many years now and are happy to see a return to pre Covid levels… Read More
At this year’s SPIE Advanced Lithography conference, changes to EUV masks were particularly highlighted, as a better understanding of their behavior is becoming clear. It’s now confirmed that a seemingly symmetric EUV mask absorber pattern does not produce a symmetric image at the wafer, as a conventional DUV … Read More
-KLA has another great QTR in face of overwhelming demand
-Supply chain issues obliterated by backlog
-Longer term technology leadership concerns are increasing
-We see limited upside near term & remain cyclically cautious
KLA’s performance remains great as does… Read More
As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More
As I write about integrated photonics I continue to hear from long-time experts in the field who lament that integrated photonics has been around for decades and other than telecom/datacom, it seems to never be a mainstream technology. It’s hard to argue that this time around it will be different as those people have lived through… Read More
For me personally EUV has been something of a roller coaster ride over the last several years. I started out a strong believer in EUV but then at the SPIE Advanced Lithography Conference in 2014 TSMC gave a very negative assessment of EUV, and there was a SEMATECH paper on high NA EUV that struck me as extremely unlikely to succeed. I … Read More
I have previously written about SPIE day 1 and 2 so I want to wrap up my coverage with some impressions from days 3 and 4. My single biggest take away from the conference is that EUV has made tremendous progress in the last 12 months. Last year the mood of the conference was in my opinion pessimistic with respect to EUV, this year the mood… Read More
With today’s ArF based lithography using 193nm wavelength light, we are hard up against the limitations imposed by the Raleigh equation. Numerous clever things have been devised to maximize yield and reduce feature size. These include 2 beam lithography, multiple patterning, immersion litho processes to improve NA, thinner… Read More
