Medicals Marriage with Semis

Medicals Marriage with Semis
by Pawan Fangaria on 03-26-2015 at 7:00 pm

I remember a couple of decades ago, my father used to go to a nearby doctor’s clinic to get his blood pressure and sugar levels checked. I guess, in around 1990s small electronic kits became available to measure these usual daily health indicators and instantly display the numbers. I bought a few for my father then. Today, the scene… Read More


Apple’s ARMed History

Apple’s ARMed History
by Majeed Ahmad on 03-24-2015 at 7:00 pm

Apple has redefined three industries within a decade: media player with the iPod, mobile handset with the iPhone and portable computers with the iPad. If there is anything common in these three game-changing product development stories other than Apple, it’s the ARM footprint. Even now the technology media is abuzz with speculation… Read More


SoCs in New Context Look beyond PPA

SoCs in New Context Look beyond PPA
by Pawan Fangaria on 03-21-2015 at 7:00 am

If we look back in the last century, performance and area were two main criteria for semiconductor chip design. All design tools and flows were concentrated towards optimizing those two aspects. As a result, density of chips started increasing and power became a critical factor. Now, Power, Performance and Area (PPA) are looked… Read More


CDC Verification: A Must for IP and SoCs

CDC Verification: A Must for IP and SoCs
by Pawan Fangaria on 03-12-2015 at 1:00 pm

In the modern SoC era, verification is no longer a post-design activity. The verification strategy must be planned much earlier in the design cycle; otherwise the verification closure can become a never ending problem. Moreover, verification which appears to be complete may actually be incomplete because of undetected issues… Read More


Getting a Grip on the Internet of Things

Getting a Grip on the Internet of Things
by Paul McLellan on 03-12-2015 at 7:00 am

QuickLogic’s CTO Tim Saxe gave a keynote Getting a Grip on the Internet of Things at the IoT Summit last week.

He started by relating how things have changed over the last 3 years when he talks to customers.

  • Three years ago it was sensor hubs in smartphones and the power budget was 3mW (so one day between re-charging, something
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Cadence’s New Implementation System Promises Better TAT and PPA

Cadence’s New Implementation System Promises Better TAT and PPA
by Tom Simon on 03-12-2015 at 1:00 am

On Tuesday Cadence made a big announcement about their new physical implementation offering, Innovus, during the keynote address at the CDNLive event in Silicon Valley. Cadence CEO Lip-Bu Tan alluded to it during his kick off talk, and next up Anirudh Devgan, Senior Vice President, Digital & Signoff Group, filled in more … Read More


SoCs More Vulnerable to ESD at Lower Nodes

SoCs More Vulnerable to ESD at Lower Nodes
by Pawan Fangaria on 03-11-2015 at 1:00 pm

Electro Static Discharge (ESD) has been a major cause of failures in electronic devices. As the electronic devices have moved towards high density SoCs accommodating ever increasing number of gates at lower process nodes, their vulnerability to ESD effects has only increased. Among the reasons for ESD failures in SoCs, device… Read More


On-Chip Power Integrity Analysis Moves to the Package

On-Chip Power Integrity Analysis Moves to the Package
by Tom Simon on 03-11-2015 at 1:00 am

Power regimes for contemporary SOC’s now include a large number of voltage domains. Rail voltages are matched closely to the performance and power requirements of various portions of the design. Indeed, some of the supply voltages are so low that the noise margins in these domains is exceedingly low. Higher voltage domains are… Read More


FinFET Designs Need Early Reliability Analysis

FinFET Designs Need Early Reliability Analysis
by Pawan Fangaria on 02-19-2015 at 9:30 pm

In a world with mobile and IoT devices driven by ultra-low power, high performance and small footprint transistors, FinFET based designs are ideal. FinFETs provide high current drive, low leakage and high device density. However, a FinFET transistor is more exposed to thermal issues, electro migration (EM), and electrostatic… Read More


Mentor shows post-PC industrial device approach

Mentor shows post-PC industrial device approach
by Don Dingee on 02-18-2015 at 9:00 pm

The term “human machine interface” originated from the factory floor. In the context of HMI, machine refers not to the computer, but to a machine tool or other instrument the computer was attached to. For decades, if an HMI was needed, it was implemented on a PC or single-board computer running Microsoft Windows. Real-time processing… Read More