The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More
I attended the annual user group meeting called User2User in Santa Clara this year, hosted by Siemens EDA, with 51 presentations by customers in 11 tracks, and keynotes during each lunch hour from semiconductor executives. Joseph Sawicki, Executive VP, IC Segment, at Siemens EDA presented on a Tuesday, along with Prashant Varshney,… Read More
With ever challenging time to market requirements, co-developing IP and firmware is imperative for all system development projects. But that doesn’t make the task any easier. Depending on the complexity of the system being developed, the task gets tougher. For example, different pieces of IP may be the output of various teams… Read More
Lauro Rizzatti recently interviewed Andy Meier, product manager in the Scalable Verification Solutions Division at Siemens EDA. Andy is a product manager in the Scalable Verification Solutions Division at Siemens EDA. Andy has held positions in the electronics and high-tech fields during his 20-year career including: Sr.… Read More
Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More
The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More
The 38th Design Automation Conference is next week and this one is for the record books. Having been virtual the last two years, next week we will meet live once again. I think we may have all taken for granted the value of live events but now we know how important they are on both a professional and human level, absolutely.
“The… Read More
The foundry model, multi-source IP blocks, advanced packaging technologies, cloud computing, hyper-connectivity and access to open-source software have all contributed to the incredible electronics products of recent times. Along with this, the complexity of developing and taking a chip to market has also increased. And… Read More
A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More
Throughout the process of physical design and verification there are many groups working on the design. Most often these groups are working independently or in parallel but separately, using their own specialized tools, such as P&R, DRC, custom layout, DFM, etc. At the end of the process there is an inevitable requirement… Read More
