Dimensions of Electronic Design Seminars

Dimensions of Electronic Design Seminars
by Paul McLellan on 10-02-2012 at 6:37 pm

ANSYS and Apache are putting on a new series of seminars about designing future electronic systems. These are only getting more complex, of course, cramming more and more functionality into smaller portable devices with good battery life (and not getting too hot), integrating multiple antennas into a single platform, and TSV-based… Read More


Cooley on Synopsys-EVE

Cooley on Synopsys-EVE
by Paul McLellan on 10-02-2012 at 7:56 am

John Cooley has an interesting “scoop” on the Synopsys-EVE acquisition. The acquisition itself is not a surprise, it is the one big hole in Synopsys’s product line and EVE is the perfect plug to fill it. It was also about the only thing Cadence has (apart from PCB) that Synopsys does not.

The interesting thing … Read More


Converge in Detroit

Converge in Detroit
by Paul McLellan on 09-30-2012 at 10:04 pm

When I worked for VaST we went to a show that I’d never heard of in EDA: SAE Convergence (SAE is the Society of Automotive Engineers). It is held once every two years and it focuses on transportation electronics, primarily automotive although there did seem to be some aerospace stuff there too. This is an even year, Convergence… Read More


How Much Cost Reduction Will 450mm Wafers Provide

How Much Cost Reduction Will 450mm Wafers Provide
by Paul McLellan on 09-28-2012 at 9:05 pm

I’ve been digging around the Interwebs a bit trying to find out what the received wisdom is about how big a cost reduction can be expected if and when we transition to 450mm (18″) wafers from today’s standard of 300mm (12″). And the answers are totally all over the place. They vary from about a 30% cost reduction… Read More


Variation at 28-nm with Solido and GLOBALFOUNDRIES

Variation at 28-nm with Solido and GLOBALFOUNDRIES
by Kris Breen on 09-27-2012 at 9:00 pm

At DAC 2012 GLOBALFOUNDRIES and Solido presented a user track poster titled “Understanding and Designing for Variation in GLOBALFOUNDRIES 28-nm Technology” (as was previously announced here). This post describes the work that we presented.

We set out to better understand the effects of variation on design at 28-nm. In particular,… Read More


A Brief History of Atrenta and RTL Design

A Brief History of Atrenta and RTL Design
by Daniel Nenni on 09-26-2012 at 7:41 pm

We’re plagued by acronyms in this business. Wikipedia defines RTL as follows: “In digital circuit design, register-transfer level (RTL) is a design abstraction which models a synchronous digital circuit in terms of the flow of digital signals (data) between hardware registers, and the logical operations performed on those… Read More


Jasper User Group

Jasper User Group
by Paul McLellan on 09-25-2012 at 1:19 pm

The Jasper User Group meeting has been announced. It will take place on November 12th and 13th. As last year, it will be at the Cypress Hotel at 10050 De Anza Boulevard in Cupertino. The user group meeting is free for qualified Jasper customers.

Topics to be covered are, of course, all things verification:

  • SoC subsystems verification
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CEVA DSP Technology Symposium Series 2012

CEVA DSP Technology Symposium Series 2012
by Daniel Nenni on 09-25-2012 at 4:45 am

You are cordially invited to register to attend the CEVA DSP Technology Symposium Series 2012, which will take place in Taiwan, October 16th, China, October 18th and Israel, November 1st.

CEVA’s industry-leading experts and engineers will present a full day of lectures and seminars where you will learn about the latest technological… Read More


Chip Aware System Design

Chip Aware System Design
by Paul McLellan on 09-24-2012 at 5:45 pm

On Wednesday this week Ansys/Ansoft/Apache are presenting a new webinar Chip Aware System Design. It is presented by Dr Steven Gary Pytel Jr of the Ansoft part of Ansys, and Matt Elmore of the Apache subsidiary. The topics that will be covered include:

  • Power Delivery Network (PDN) design requirements
  • ABCD Matrix theory
  • SYZ Matrix
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Cadence Mixed Signal Technology Summit

Cadence Mixed Signal Technology Summit
by Paul McLellan on 09-21-2012 at 6:46 pm

Yesterday I attended some of the Cadence mixed-signal technology summit. The day ended with a panel session on Are We Closing the Gap Yet in Mixed-signal Design? Richard Goering moderated. The panelists were all mixed signal experts:

  • Nayaz Khan of Maxim
  • Nishant Shah of Broadcom
  • Shiv Sikand of IC Manage
  • Bill Meier of Texas Instruments
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