SEMICO Impact 2013 Next Wednesday

SEMICO Impact 2013 Next Wednesday
by Paul McLellan on 11-01-2013 at 5:54 pm

Semico’s IMPACT 2013 IP event is next Wednesday November 6th at the DoubleTree Hilton in San Jose.

Here’s what you get if you attend. Keynotes from:

  • Kurt Shuler of Arteris. Give him some hard questions about Qualcomm who have just acquired their technology and engineering team
  • Chris Rowen of Tensilica, recently acquired
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Using OTP Memories for High-performance Video

Using OTP Memories for High-performance Video
by Paul McLellan on 11-01-2013 at 4:15 pm

One of the most demanding applications where semiconductors are used is in the various applications of digital video from tablet computers, to home entertainment. iPad with a retina display is already at high-definition (HD) resolution (2048×1536) and all indications are that video is racing towards what is known as 4K… Read More


ARM and the Internet of Things

ARM and the Internet of Things
by Paul McLellan on 10-31-2013 at 6:00 pm

I was at ARM TechCon earlier this week, and attended Simon Segars (the CEO of ARM for the last 4 months) keynote speech that opened the second day. A theme of his speech was that just as innovation continues to happen in so-called mature industries like automobiles, the same will happen in mobile. One particular area of focus for ARM… Read More


Qualcomm and Arteris: the CEO Speaks

Qualcomm and Arteris: the CEO Speaks
by Paul McLellan on 10-31-2013 at 5:25 pm

Arteris finally announced this morning, as rumored, that Qualcomm is acquiring “certain technology assets” and hired personnel formerly employed by Arteris. The financial terms were not disclosed.

I talked to Charlie Janac, the CEO, today. The first thing I asked him is why such a convoluted deal, I’ve never… Read More


ARM in Samsung 14nm FinFET

ARM in Samsung 14nm FinFET
by Paul McLellan on 10-30-2013 at 4:28 pm

I am at ARM TechCon today. One interesting presentation was made jointly between Samsung, Cadence and ARM themselves about developing physical libraries (ARM), a tool flow (Cadence) and test chips (Samsung). It was titled Samsung ARM and Cadence collaborate on the silicon-proven world first 14-nm FinFET Cortex-A7 ARM CPU and… Read More


Getting the Most Out of the ARM CoreLink™ NIC-400

Getting the Most Out of the ARM CoreLink™ NIC-400
by Daniel Payne on 10-28-2013 at 12:27 pm

SoC designers are attracted to ARM as an IP provider because of their popular offerings and growing ecosystem of EDA partners like Carbon Design Systems. At the upcoming ARM Techcon on October 31 this week in Santa Clara you’ll have an opportunity to hear a joint presentation from ARM and Carbon Design Systems on: Getting Read More


Open Letter from Sonics to Arteris

Open Letter from Sonics to Arteris
by Paul McLellan on 10-27-2013 at 2:00 pm

I don’t remember seeing an open letter from one EDA or IP company to another until today. Sonics have published an open letter to Charlie Janac, the CEO of Arteris. What seems to have happened is that Arteris have sold their assets to Qualcomm and the development team (which is based in France) and several AEs are already Qualcomm… Read More


Webinar on IP Lifecycle Management

Webinar on IP Lifecycle Management
by Daniel Payne on 10-23-2013 at 5:44 pm

EDA and Semiconductor companies are offering new webinars almost every week of the year, so there’s always something worth learning about that only takes an hour of time. On November 5th there’s an interesting webinar planned on the topic of IP Lifecycle Management, hosted by Methodics. I blogged two weeks ago about,… Read More


New at DAC: IP, Automotive, Security

New at DAC: IP, Automotive, Security
by Paul McLellan on 10-18-2013 at 12:09 pm

The deadline for panel sessions, workshops, tutorials and co-located conferences for DAC 2014 is October 21st. That’s next Monday!

DAC 2014 will not only focus on EDA and embedded systems and software but
also include:

  • design methods for automotive systems and software
  • hardware and embedded systems security
  • IP (semiconductor
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CEVA-XC Wireless Baseband Core

CEVA-XC Wireless Baseband Core
by Paul McLellan on 10-17-2013 at 5:51 pm

Eyal Bergman of CEVA announced their latest core yesterday at the Linley Microprocessor Conference. It’s their 4th generation CEVA-XC solution, which is the core of their offering for wireless baseband. It builds on 3 previous generations of CEVA-XC’s that were mainly targeted toward handset applications. This… Read More