Visual Debugging at Altera on Billion-Transistor Chips

Visual Debugging at Altera on Billion-Transistor Chips
by Daniel Payne on 03-15-2013 at 10:38 am

My first job out of college was doing transistor-level circuit design, so I’m always curious about how companies are doing billion-transistor chip design and debug these days at the FPGA companies.

I spoke with Yaron Kretchmer,he works at Altera and manages the engineering infrastructure group where they have a compute… Read More


Double Patterning for IC Design, Extraction and Signoff

Double Patterning for IC Design, Extraction and Signoff
by Daniel Payne on 01-21-2013 at 3:27 pm

TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More


Yawn… New EDA Leader Results Are Coming

Yawn… New EDA Leader Results Are Coming
by Randy Smith on 01-18-2013 at 4:00 pm

We will soon start to see the quarterly financial reporting installments of the “Big 3” public EDA companies. I predict they will be as boring as usual. I am not sure if I would want it any differently though.

Back in the 90s there were times when it was truly interesting to wait to see what Cadence, Mentor, or later Synopsys, might announce.… Read More


Variation-Aware Design: A Hands-on Field Guide

Variation-Aware Design: A Hands-on Field Guide
by Daniel Payne on 12-01-2012 at 2:57 pm

IC designers using advanced nodes are acutely aware of how variation effects in the silicon itself are causing increased analysis and design efforts in order to yield chips at acceptable levels. Four authors from Solidoare so passionate about this topic that they combined their years of experience into a book that I had a chance… Read More


IP-SoC day in Santa Clara: prepare the future, what’s coming next after IP based design?

IP-SoC day in Santa Clara: prepare the future, what’s coming next after IP based design?
by Eric Esteve on 04-05-2012 at 10:16 am

D&R IP-SoC Days Santa Clara will be held on April 10, 2012 in Santa Clara, CA and if you plan to attend, just register here. IP market is a small world, and EDA a small market if you look at the generated revenue… but both are essential building blocks for the semiconductor industry. It was not clear back in 1995 that IP will become … Read More


Thanks to Linkedin members: 24 “Like” given to “Interface Protocols, USB3, HDMI, MIPI… the winner and losers in 2011”

Thanks to Linkedin members: 24 “Like” given to “Interface Protocols, USB3, HDMI, MIPI… the winner and losers in 2011”
by Eric Esteve on 01-14-2012 at 12:53 pm

Just because it seems that the likes given to: Interface Protocols, USB3, HDMI, MIPI… the winner and losers in 2011 were numerous, I decided to count it.

Twenty-four likes received, in 11 Linkedin groups (see below), that’s good! Very goos! Thanks to all of you… And most probably thanks to IPNESTfor the quality of the… Read More


Hardware Configuration Management approach awarded a Patent

Hardware Configuration Management approach awarded a Patent
by Daniel Payne on 09-13-2011 at 11:21 am

Hardware designers use complex EDA tool flows that have collections of underlying binary and text files. Keeping track of the versions of your IC design can be a real issue when your projects use teams of engineers. ClioSoft has been offering HCM (Hardware Configuration Management) tools that work in the most popular flows of: … Read More


Transistor Level IC Design?

Transistor Level IC Design?
by Daniel Payne on 08-26-2011 at 1:23 pm

If you are doing transistor-level IC design then you’ve probably come up against questions like:

  • What Changed in this schematic sheet?
  • How did my IC layout change since last week?

In the old days we would hold up the old and new versions of the schematics or IC layout and try to eye-ball what had changed. Now we have an automated… Read More


Smart Fill Replaces Dummy Fill Approach in a DFM Flow

Smart Fill Replaces Dummy Fill Approach in a DFM Flow
by Daniel Payne on 07-30-2011 at 7:11 pm

I met with Jeff Wilson, Product Marketing Manager at Mentor in the Calibre product group to learn more about Smart Fill versus Dummy Fill for DFM flows. Jeff works in the Wilsonville, Oregon office and we first meet at Silicon Compilers back in the 1990’s.

Dummy Fill

This diagram shows an IC layout layer on the left as originallyRead More


Richard Goering does Q&A with ClioSoft CEO

Richard Goering does Q&A with ClioSoft CEO
by Daniel Payne on 07-18-2011 at 11:05 am

Richard Goering is well-known from his editorial days at EE Times (going back some 25 years), now at Cadence he blogs at least once a week on EDA topics that touch Cadence tools.

Before DAC he talked with Srinath Anantharaman about how Cadence tools work together with ClioSoft tools to keep IC Design Data Management Simple.

Through… Read More