SEMI’s World Fab Forecast report, published in November, predicts that fab equipment spending will decline about -9 percent (US$32.5 billion) in 2013 (including new, used and in-house manufactured equipment). Setting aside the used 300mm equipment Globalfoundries acquired from Promos at the beginning of 2013 (NT$20-30 … Read More
Tag: semi
SEMI Smart Technology Conference
I should start by saying that SEMI Smart Technology is not technology that is only half as smart as our phones, it is a conference on smart technology organized by SEMI. Officially it is called the International Technology Partners Conference with a sort of subtitle of From Smart Cars to Smart Cities: Shaping the Future of Microelectronics… Read More
3D: the Backup Plan
With the uncertainties around timing of 450mm wafers, EUV (whether it works at all and when) and new transistor architectures it is unclear whether Moore’s law as we know it is going to continue, and in particular whether the cost per transistor is going to remain economically attractive especially for consumer markets … Read More
Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
I attended the semi-annual SEMI Silicon Valley Lunch meeting last week. The semiconductor equipment people are the ones that really know what is going on. People can talk about capex numbers on conference calls but it is the equipment vendors who either do or do not get orders for particular types of equipment. In turn, the analysts… Read More
Save the Dates
There are several events in Silicon Valley coming up of general interest to people working in EDA and the semiconductor industry.
SEMI 16th Annual Valley Lunch Forum. August 22nd, 11.30am to 1.30pm, Santa Clara Marriott
- What are the Opportunities for Advanced Semiconductor Devices?
- Where will the year end for 2013?
- Will we have
SEMICON Taiwan 3D
SEMICON Taiwan is September 3rd to 6th in TWTC Nangang Exhibition Hall. Just as with Semicon West in July in San Francisco, there is lots going on. But one special focus is 3D IC. There is a 3DIC and substrate pavilion on the exhibit floor and an Advanced Packaging Symposium. Design tools, manufacturing, packaging and testing solutions… Read More
Equipment Down 16% in 2012, Flat to Down in 2013
Shipments of semiconductor manufacturing equipment have been trending downward since June 2012, based on combined data from SEMI for North American and European manufacturers and from SEAJ for Japanese manufacturers. The market bounced back strongly in late 2009 and in 2010 after the 2008 downturn to return to the $3 billion… Read More
Semiconductor equipment returns to growth
Semiconductor manufacturing equipment has returned to growth after a falloff in the second half of 2011. Combined data from SEMI (U.S. andEuropean companies) and SEAJ (Japanese companies) show billings peaked at a three-month-average of $3.2 billion in May 2011. Bookings and billings began todrop in June 2011, with billings… Read More
3D-IC Physical Design
When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More
IC capacity utilization declined in 3Q 2011
SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More