Save the Dates

Save the Dates
by Paul McLellan on 08-13-2013 at 3:22 pm

There are several events in Silicon Valley coming up of general interest to people working in EDA and the semiconductor industry.

SEMI 16th Annual Valley Lunch Forum. August 22nd, 11.30am to 1.30pm, Santa Clara Marriott

  • What are the Opportunities for Advanced Semiconductor Devices?
  • Where will the year end for 2013?
  • Will we have
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SEMICON Taiwan 3D

SEMICON Taiwan 3D
by Paul McLellan on 08-08-2013 at 3:10 pm

SEMICON Taiwan is September 3rd to 6th in TWTC Nangang Exhibition Hall. Just as with Semicon West in July in San Francisco, there is lots going on. But one special focus is 3D IC. There is a 3DIC and substrate pavilion on the exhibit floor and an Advanced Packaging Symposium. Design tools, manufacturing, packaging and testing solutions… Read More


Equipment Down 16% in 2012, Flat to Down in 2013

Equipment Down 16% in 2012, Flat to Down in 2013
by Bill Jewell on 12-22-2012 at 8:30 pm

Shipments of semiconductor manufacturing equipment have been trending downward since June 2012, based on combined data from SEMI for North American and European manufacturers and from SEAJ for Japanese manufacturers. The market bounced back strongly in late 2009 and in 2010 after the 2008 downturn to return to the $3 billionRead More


Semiconductor equipment returns to growth

Semiconductor equipment returns to growth
by Bill Jewell on 06-14-2012 at 7:37 pm

Semiconductor manufacturing equipment has returned to growth after a falloff in the second half of 2011. Combined data from SEMI (U.S. andEuropean companies) and SEAJ (Japanese companies) show billings peaked at a three-month-average of $3.2 billion in May 2011. Bookings and billings began todrop in June 2011, with billings… Read More


3D-IC Physical Design

3D-IC Physical Design
by Pawan Fangaria on 02-22-2012 at 10:00 am

When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More


IC capacity utilization declined in 3Q 2011

IC capacity utilization declined in 3Q 2011
by Bill Jewell on 12-14-2011 at 11:54 pm

SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More


Semiconductor equipment spending beginning to decline

Semiconductor equipment spending beginning to decline
by Bill Jewell on 09-25-2011 at 7:41 pm

Semiconductor manufacturing equipment shipments have leveled off after a strong rebound from the 2008-2009 downturn. August 2011 three-month-average shipments based on combined data from SEMI (North American and European companies) and SEAJ (Japanese companies) were $2.9 billion, down from a peak of $3.2 billion in May Read More


Dawn at the OASIS, Dusk for GDSII

Dawn at the OASIS, Dusk for GDSII
by Beth Martin on 03-28-2011 at 1:53 pm

For an industry committed to constant innovation, changes in any part of the design flow are only slowly adopted, and only when absolutely necessary. Almost 10 years ago, it became clear that shrinking process technologies would bring a massive growth of layout and mask data—rougly 50% per node. This avalanche of data seriously… Read More