Closing the Communication Chasms in the SoC Design and Manufacturing Supply Chain

Closing the Communication Chasms in the SoC Design and Manufacturing Supply Chain
by Kalar Rajendiran on 06-08-2022 at 6:00 am

Sondrel Soup to Nuts

In sports, we’re all familiar with how even a team with the best individual players for every role needs to be coordinated as a team to win a championship. In healthcare, a patient is better served with a well-trained primary physician to coordinate with the various medical specialists. The field of semiconductors involves a series… Read More


Predicting Mechanical Reliability for Electronics

Predicting Mechanical Reliability for Electronics
by Admin on 10-20-2021 at 11:08 am

Improve product reliability and performance while meeting the challenging demands that customers put on their electronic devices. Ansys Mechanical’s comprehensive multiphysics solvers provide solutions for everything from individual components to printed circuit boards to complete device and systems. Whether

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Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update

Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update
by Admin on 08-11-2021 at 8:07 am

Time:
August 24, 2021
1 PM EDT / 6 PM BST / 10:30 PM IST

Venue:
Online

About this Webinar

This webinar spotlights major updates to Ansys Electronics Reliability solutions in 2021 R2. Ansys Electronics Reliability solutions feature comprehensive workflows involving Ansys Sherlock, Ansys Mechanical, Ansys Icepak,

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Reliable Line Cutting for Spacer-based Patterning

Reliable Line Cutting for Spacer-based Patterning
by Fred Chen on 05-06-2020 at 6:00 am

Reliable Line Cutting for Spacer based Patterning

Spacer-defined patterning is an expected requirement for advanced semiconductor patterning nodes with feature sizes of 25 nm or less. As the required gaps between features go well below the lithography tool’s resolution limit, the use of cut exposures to separate features is used more often, especially in chips produced… Read More


Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


Safety Methods Meet Enterprise SSDs

Safety Methods Meet Enterprise SSDs
by Bernard Murphy on 07-16-2019 at 5:00 am

The use of safety-centric logic design techniques for automotive applications is now widely appreciated, but did you know that similar methods are gaining traction in the design of enterprise-level SSD controllers? In the never-ending optimization of datacenters, a lot attention is being paid to smart storage, offloading… Read More


Accelerating SOC Development for Automobile Applications

Accelerating SOC Development for Automobile Applications
by Tom Simon on 03-11-2019 at 12:00 pm

No area of electronics is moving faster than automotive semiconductors. Everyone has been talking about the increasing electronics content of automobiles for decades. With Advanced Driver Assistance System (ADAS) and autonomous driving becoming a reality the pace has picked up even more. These new designs combine just about… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Mentor’s Busy ITC and Major Test Product Updates

Mentor’s Busy ITC and Major Test Product Updates
by Tom Simon on 10-31-2018 at 1:00 pm

In conjunction with the 2018 International Test Conference, Mentor has several interesting test announcements. They also have a busy round of technical activities, including a number of technical papers, presentations, tutorials and a poster from a major customer about using Mentor. I’d like to touch on the two product related… Read More


Mesh Networks, Redux

Mesh Networks, Redux
by Bernard Murphy on 09-27-2018 at 7:00 am

It isn’t hard to understand the advantage of mesh networking (in wireless networks). Unlike star/tree configurations in which end-points connect to a nearby hub (such as phones connecting to a conventional wireless access point), in a mesh nodes can connect to nearest neighbors, which can connect to their nearest neighbors… Read More