Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More


Palladium’s Little Brother Protium

Palladium’s Little Brother Protium
by Paul McLellan on 07-17-2014 at 8:00 am

Today, Cadence announced Protium, a new FPGA prototyping platform for software development. During development of an SoC, the most appropriate methodology changes. In the early days, developing RTL, the primary tool is simulation. Then, as the blocks get bigger or as the whole chip starts to come together, typically simulation… Read More


Xilinx has the Power Advantage over Altera

Xilinx has the Power Advantage over Altera
by Luke Miller on 06-25-2014 at 6:00 am

I thought I write about one of the most important subjects in FPGAs, that is power. Power of course is not just based on node size, and it is funny why so many people are concerned about node size. If not just as important is the architectural decisions that drive down power. Do you really care if your part is 16nm or 14nm? Or do you care more… Read More


Intel & Ansys Enable 14nm Chip Production

Intel & Ansys Enable 14nm Chip Production
by Pawan Fangaria on 06-20-2014 at 10:00 am

In the semiconductor industry, it feels great to hear about the process technology shrinking to lower nodes along with innovative transistor structures that offer major gains in PPA (Power, Performance and Area). However, it requires huge investment of capital, time and effort from foundries to conceptualize, prototype and… Read More


Sensor Hub and Wearable Gestures

Sensor Hub and Wearable Gestures
by Paul McLellan on 06-13-2014 at 10:00 am

One of the challenges with the internet of things (IoT) is that many devices are both always on and battery powered (and not with a large battery). The responsibilities need to be split so that the device senses when it needs to wake up without requiring the application processor to be waking up all the time to make the decision since… Read More


Embedded Vision Summit

Embedded Vision Summit
by Paul McLellan on 06-05-2014 at 2:32 pm

I was a the embedded vision conference last week. Jeff Beir, the founder of the embedded vision alliance gave an introduction to the field. The conference was much bigger than previous years and almost everyone is designing some sort of vision product. Half of your brain is used for vision so it goes without saying that vision requires… Read More


Two New ESL Tools for Power and Thermal at DAC

Two New ESL Tools for Power and Thermal at DAC
by Daniel Payne on 05-27-2014 at 6:47 pm

Gary Smith published a list of what to see at DAC, and I noticed that he listed DOCEA Power in a category of ESL Thermal. I’ll be meeting the DOCEA engineers on Wednesday at DAC to learn more about their two newest ESL products:

  • Thermal Profiler
  • Power Intelligence

In general DOCEA Power tools allow you to manage power and thermal… Read More


Low Power Design

Low Power Design
by Paul McLellan on 05-16-2014 at 9:08 pm

So you want to do a low power design. Join the club. Who doesn’t? Today all designs are low power, it is the biggest constraint on what we can do on a chip. Power down; power domains, variable clock rates, mixed Vt libraries. Every trick is needed. And that is not even enough. We get to put our phones on charge each evening and there… Read More


IC Power Noise Reliability for FinFET Designs

IC Power Noise Reliability for FinFET Designs
by Daniel Payne on 05-06-2014 at 9:07 am

Reliability for ICs is a big deal because the last thing that you want to do is ship a new part only to find out later in the field that there are failures not being caught by testing. I’ve already had two consumer products fail this year because of probable reliability issues: My MacBook Pro with 16GB of RAM started rebooting caused… Read More


IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC

IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC
by Daniel Payne on 04-30-2014 at 10:04 am

ANSYS acquired Apache Design Automation back in June 2011and three years later the name “Apache” is being subdued in favor of using just ANSYS. One thing that I noticed right away was a DACfocus on having actual ANSYS customers talk about their hands-on experience using the EDA tools. The following seven customers… Read More