Tag: pcb design

Ansys 2023 R1: Ansys Maxwell What’s New

Ansys 2023 R1: Ansys Maxwell What’s New
by Admin on 02-06-2023 at 2:23 pm

Join us for the 2023 R1 presentation on what’s new for Ansys Maxwell. You’ll learn the latest performance improvements for induction machine simulation and enhancements to accelerate your complex multilayer PCB design simulations.

TIME:
MARCH 23, 2023
1 PM EDT / 5 PM GMT / 8:30 PM IST

Venue:
Virtual

About this Webinar

In the 2023

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Cracking post-route Compliance Checking for High-Speed Serial Links with HyperLynx

Cracking post-route Compliance Checking for High-Speed Serial Links with HyperLynx
by Peter Bennet on 12-15-2022 at 6:00 am
Categories: EDA, Siemens EDA

hyperlynx flow

SemiWiki readers from a digital IC background might find it surprising that post-PCB route analysis for high speed serial links isn’t a routine and fully automated part of the board design process. For us, the difference between pre- and post-route verification is running a slightly more accurate extraction and adding SI modelling,… Read More

Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
by Admin on 11-07-2022 at 3:03 pm

Sponsored by: Cadence

Presented by: Nitin Bhagwath, Director of Product Management

Event Duration: 60 minutes

Abstract:

Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal… Read More

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Are EDA companies failing System PCB customers?

Are EDA companies failing System PCB customers?
by Rahul Razdan on 10-31-2022 at 6:00 am
Categories: EDA

figure1 5

Electronic Design Automation (EDA) is a critical industry which enables the development of electronic systems.  Traditionally, EDA has been bifurcated into two distinctive market segments: Semiconductor and Systems (PCB).   If one were to look at the EDA industry in the early 1970’s, one would find significant capabilities… Read More

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The Increasing Gap between Semiconductor Companies and their Customers

The Increasing Gap between Semiconductor Companies and their Customers
by Rahul Razdan on 10-19-2022 at 6:00 am
Categories: EDA
1 Comment

figure1 4

Semiconductors sit at the heart of the electronics revolution, and the scaling enabled by Moore’s law has had a transformational impact on electronics as well as society.   Traditionally, the relationship between semiconductor companies and their customers has been a function of the volume driven by the customer.  In very … Read More

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A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am
Categories: Ansys, Inc., Chiplet, EDA

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More

CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs
by Admin on 06-01-2022 at 3:00 pm

 

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop

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The Gold Standard for Electromagnetic Analysis

The Gold Standard for Electromagnetic Analysis
by Daniel Nenni on 11-04-2020 at 6:00 am
Categories: Ansys, Inc., EDA

Example of a multi level board analyzed by HFSS

Ansys HFSS has been the world’s trusted gold standard for  electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More

Concepts of PCB Design, Manufacturing and Testing for Mechanical and Reliability Engineers

Concepts of PCB Design, Manufacturing and Testing for Mechanical and Reliability Engineers
by Admin on 05-24-2020 at 4:18 am

June 3, 2020

11:00 AM EDT / 3:00 PM GDT

Venue:
Online

In the electronics industry, the quality and reliability of a printed circuit board (PCB) is highly dependent upon the capabilities of the PCB fabrication suppliers. As such, the design engineer needs to understand the processes involved in designing and fabricating circuit

… Read More
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Bridging the Gap Between Design and Analysis

Bridging the Gap Between Design and Analysis
by Mike Gianfagna on 02-20-2020 at 6:00 am
Categories: Cadence, EDA, Events
2 Comments

PCB design challenges

At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More