Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
by Admin on 11-07-2022 at 3:03 pm

Sponsored by: Cadence

Presented by: Nitin Bhagwath, Director of Product Management

Event Duration: 60 minutes

Abstract:

Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal… Read More


Are EDA companies failing System PCB customers?

Are EDA companies failing System PCB customers?
by Rahul Razdan on 10-31-2022 at 6:00 am

figure1 5

Electronic Design Automation (EDA) is a critical industry which enables the development of electronic systems.  Traditionally, EDA has been bifurcated into two distinctive market segments: Semiconductor and Systems (PCB).   If one were to look at the EDA industry in the early 1970’s, one would find significant capabilities… Read More


The Increasing Gap between Semiconductor Companies and their Customers

The Increasing Gap between Semiconductor Companies and their Customers
by Rahul Razdan on 10-19-2022 at 6:00 am

figure1 4

Semiconductors sit at the heart of the electronics revolution, and the scaling enabled by Moore’s law has had a transformational impact on electronics as well as society.   Traditionally, the relationship between semiconductor companies and their customers has been a function of the volume driven by the customer.  In very … Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More


CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs

CadenceTECHTALK: Static and Dynamic IR Drop Analysis for Thermal Integrity of High-Performance PCB Designs
by Admin on 06-01-2022 at 3:00 pm

 

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop

Read More

The Gold Standard for Electromagnetic Analysis

The Gold Standard for Electromagnetic Analysis
by Daniel Nenni on 11-04-2020 at 6:00 am

Example of a multi level board analyzed by HFSS

Ansys HFSS has been the world’s trusted gold standard for  electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More


Concepts of PCB Design, Manufacturing and Testing for Mechanical and Reliability Engineers

Concepts of PCB Design, Manufacturing and Testing for Mechanical and Reliability Engineers
by Admin on 05-24-2020 at 4:18 am

June 3, 2020

11:00 AM EDT / 3:00 PM GDT

Venue:
Online

In the electronics industry, the quality and reliability of a printed circuit board (PCB) is highly dependent upon the capabilities of the PCB fabrication suppliers. As such, the design engineer needs to understand the processes involved in designing and fabricating circuit

Read More

Bridging the Gap Between Design and Analysis

Bridging the Gap Between Design and Analysis
by Mike Gianfagna on 02-20-2020 at 6:00 am

PCB design challenges

At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More


Accelerating the PCB Design-Analysis Optimization Loop

Accelerating the PCB Design-Analysis Optimization Loop
by Tom Dillinger on 08-01-2018 at 12:00 pm

With the increasing complexity and diversity of the mechanical constraints and electrical requirements in electronic product development, printed circuit board designers are faced with a number of difficult challenges:

  • generating accurate (S-parameter) simulation models for critical interface elements of the design
Read More

Scoreboard and Issues Management Tools for PCB Projects

Scoreboard and Issues Management Tools for PCB Projects
by Tom Dillinger on 01-16-2018 at 12:00 pm

The complexity of an SoC design necessitates that the project managers have accurate visibility into the overall design status, spanning the entire range of tasks – from functional simulation error triage, to physical layout verification errors, to electrical analysis results. Flow scripts used by SoC teams parse the log file… Read More