I don’t know if it was just me but I left TechCon 2017 feeling, well, uninspired. Not that they didn’t put on a good show with lots of announcements, but it felt workman-like. From anyone else it would have been a great show, but this is TechCon. I expect to leave with my mind blown in some manner and it wasn’t. I wondered if the SoftBank … Read More
Tag: networking
Chip, Package, System Analysis – A User View
While I missed ANSYS (and indeed everyone else) at DAC this year, I was able to attend the ANSYS Innovation Conference last week at the Santa Clara Convention Center. My primary purpose for being there was to listen to a talk by eSilicon which I’ll get to shortly, but before that I sat through a very interesting presentation on the growing… Read More
Platform ASICs Target Datacenters, AI
There is a well-known progression in the efficiency of different platforms for certain targeted applications such as AI, as measured by performance and performance/Watt. The progression is determined by how much of the application can be run with specialized hardware-assist rather than software, since hardware can be faster… Read More
High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More
Networking and Formal Verification
I attended Oski’s latest Decoding Formal event a couple of weeks ago and again enjoyed a largely customer-centric view of the problems to which they apply formal, and their experiences in making it work for them (with Oski help of course). From an admittedly limited sample of two of these events, I find them very representative of… Read More
Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+
Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More
Polishing Parallelism
The great thing about competition in free markets is that vendors are always pushing their products to find an edge. You the consumer don’t have to do much to take advantage of these advances (other than possibly paying for new options). You just sit back and watch the tool you use get faster and deliver better QoR. You may think that… Read More
Applying EDA Concepts Outside Chip Design
(I changed the title of this piece as an experiment) Paul McLellan recently wrote on the topic of new ventures crossing the chasm (getting from initial but bounded success to a proven scalable business). That got me to thinking about the EDA market in general. In some ways it has a similar problem, stuck at $5B or so and single-digit… Read More
NFV opens gate for ARM server stampede
A couple of years ago, our own Paul McLellan gave us a report on the 2013 Linley Microprocessor Conference with a provocative headline: “Server Shift to ARM Becomes a Stampede”, a title right off one of the Linley slides. 64-bit ARMv8 architecture was relatively new to the game, and ARM share in networking platforms was just a sliver… Read More
Networking at 52nd DAC in SFO
Yes, the 52nd DAC(Design Automation Conference) is a technical conference plus exhibition with wonderful keynote speakers and agenda, however there is a certain serendipity that occurs by just meeting people, face to face at the many networking opportunities. The best way to kick off your DAC experience is by attending the Sunday… Read More