Learning to Live with the Gaps Between Design and Verification

Learning to Live with the Gaps Between Design and Verification
by Tom Simon on 04-09-2020 at 6:00 am

Learning to live with the gaps between design and verification

Whenever I am asked to explain how chip design works by someone who is unfamiliar with the process, I struggle to explain the different steps in the flow. It also makes me aware of the discrete separations between each phase of activities. Of course, when you speak to a novice it is not even possible to get more than one layer down in the… Read More


Bringing Hierarchy to DFT

Bringing Hierarchy to DFT
by Tom Simon on 01-30-2020 at 6:00 am

Tessent Hierarchical Flow

Hierarchy is nearly universally used in the SoC design process to help manage complexity. Dealing with flat logical or physical designs proved unworkable decades ago. However, there were a few places in the flow where flat tools continued to be used. Mentor lead the pack in the years around 1999 in helping the industry move from … Read More


Photonics Come into Focus: 2020 Predictions

Photonics Come into Focus: 2020 Predictions
by Rich Goldman on 01-02-2020 at 10:00 am

Photonics 2020 Predictions

In the past, I’ve focused my annual predictions on electronics – ICs and EDA – but recently I’ve turned my focus to photonics, so my 2020 predictions are primarily in this area.

Historically, photonics has been the Gallium Arsenide of technologies; it was, is and always will be the technology of the future. Analysts have forever … Read More


Full Solution for eMRAM Coming in 2020

Full Solution for eMRAM Coming in 2020
by Tom Simon on 12-19-2019 at 6:00 am

Trimming for eMRAM in Tessent

It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More


Mentor unpacks LVS and LVL issues around advanced packaging

Mentor unpacks LVS and LVL issues around advanced packaging
by Tom Simon on 11-26-2019 at 6:00 am

Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More


ITC shines light on new Mentor Test announcements

ITC shines light on new Mentor Test announcements
by Tom Simon on 11-18-2019 at 10:00 am

The 50th International Test Conference was just held in Washington DC, where papers, sessions, workshops and announcements addressing the increasing complexity and expanding use of semiconductors showed that innovations in test are crucial to design and product success. Test methodologies and even the scope of test have … Read More


Seminar: 2.5D/3D IC Packaging Verification

Seminar: 2.5D/3D IC Packaging Verification
by Daniel Payne on 11-06-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies?  Here is your chance to meet our technical staff and ask your questions.  Come and see why fabless semiconductor companies are adopting this… Read More


Webinar: From HLS Component to a Working Design

Webinar: From HLS Component to a Working Design
by Daniel Payne on 10-15-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Complex algorithms do not exist in a vacuum. After HLS is used to create an RTL component, to be useful, it needs to be integrated into a larger system. This means connecting it to other components, a processor, and even software. Once integrated, the system needs to be verified. The verification of the complete environment… Read More


Mentor’s Questa verification tools now run on 64-bit ARM based servers

Mentor’s Questa verification tools now run on 64-bit ARM based servers
by Tom Simon on 10-10-2019 at 10:00 am

The server market has been undergoing changes in the last few years. The traditional go-to for server processors had been x86 based chips from Intel or AMD. However, if you go on Amazon AWS looking for EC2 instances, you will see the “A1” instance type, which is an ARM based instance. This is not what you might think at first. The A1 instance… Read More


Webinar: Implementing Machine Learning Hardware Using High-Level Synthesis

Webinar: Implementing Machine Learning Hardware Using High-Level Synthesis
by Daniel Payne on 10-08-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Neural networks are typically developed and trained in a high-performance 32-bit floating-point compute environment. But, in many cases a custom hardware solution is needed for the inference engine to meet power and real-time requirements. Each neural network and end-application may have different performance… Read More