Advanced electro-thermal simulation sees deeper inside chips

Advanced electro-thermal simulation sees deeper inside chips
by Don Dingee on 03-29-2023 at 6:00 am

Advanced electro-thermal simulation in Keysight PathWave ADS

Heat and semiconductor reliability exist in an inversely proportional relationship. Before the breaking point at the thermal junction temperature rating, every 10°C rise in steady-state temperature cuts predicted MOSFET life in half. Yet, heat densities rise as devices plunge into harsher environments like smartphones,… Read More


Why Design Data Management: A View from CERN

Why Design Data Management: A View from CERN
by Majeed Ahmad on 05-27-2015 at 10:00 pm

On July 4, 2012, the European Organization for Nuclear Research, or CERN, announced that the ATLAS and CMS experiments had each observed a new particle, which is consistent with the Higgs boson predicted by the Standard Model of particle physics. The Compact Muon Solenoid (CMS) is a general-purpose detector with a broad physics… Read More


Managing Design Flows in RF Modules

Managing Design Flows in RF Modules
by Majeed Ahmad on 04-24-2015 at 7:00 pm

The semiconductor industry is expected to grow at a reasonable pace in 2015 and beyond, with the biggest market being compute applications followed by wireless and consumer applications. The highest growth, however, is expected to be in application-specific products for devices such as smartphones, wearables, memories, … Read More