SPIE 2021 – ASML DUV and EUV Updates

SPIE 2021 – ASML DUV and EUV Updates
by Scotten Jones on 03-17-2021 at 10:00 am

SPIE DUV 2021 ASML NXT4 DryWet Presentation final noWPD2 Page 42

At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.

DUV

Despite all the attention EUV is getting, most layers are still… Read More


A Review of Clock Generation and Distribution for Off-Chip Interfacing

A Review of Clock Generation and Distribution for Off-Chip Interfacing
by Tom Dillinger on 03-09-2021 at 6:00 am

clocking

At the recent ISSCC conference, Mozhgan Mansuri from Intel gave an enlightening (extended) short course presentation on all thing related to clocking, for both wireline and wireless interface design. [1]  The presentation was extremely thorough, ranging from a review of basic clocking principles to unique circuit design … Read More


TSMC ISSCC 2021 Keynote Discussion

TSMC ISSCC 2021 Keynote Discussion
by Daniel Nenni on 03-01-2021 at 6:00 am

Mark Liu TSMC ISSCC 2021

Now that semiconductor conferences are virtual there are better speakers since they can prerecord and we have the extra time to do a better job of coverage. Even when conferences go live again I think they will also be virtual (hybrid) so our in depth coverage will continue.

ISSCC is one of the conferences we covered live since it’s… Read More


Expert Advice for the New Intel CEO

Expert Advice for the New Intel CEO
by Daniel Nenni on 02-15-2021 at 10:00 am

Pat Gelsinger Intel CEO

Intel is a semiconductor legend. Founded on July 18, 1968, the name Intel is short for Integrated Electronics. After leading Silicon Valley, the United Sates, and the world into the era of semiconductors through technical excellence, Intel has hit some challenging times. There has been quite a bit of CEO drama that we will look … Read More


Intel Node Names

Intel Node Names
by Scotten Jones on 02-15-2021 at 6:00 am

Slide2

There is a lot of interest right now in how Intel compares to the leading foundries and what the future may hold.

Several years ago, I published several extremely popular articles converting processes from various companies to “Equivalent Nodes” (EN). Nodes were at one time based on actual physical features of processes but had… Read More


Do You Care About What You’re Measuring? Part 2: Cloud Data Centers

Do You Care About What You’re Measuring? Part 2: Cloud Data Centers
by Steve Logan on 02-02-2021 at 10:00 am

Do You Care About What Youre Measuring Cloud Data Centers

When I think about servers and data centers, I think about multiple-core/high-power CPUs, Intel’s domination over the years and GPUs coming on strong in recent years. I think about very fast digital interfaces, such as PCI Express connections and the latest DDR memory interface. Precision analog isn’t something that first comes… Read More


New Intel CEO Commits to Remaining an IDM

New Intel CEO Commits to Remaining an IDM
by Robert Maire on 01-25-2021 at 6:00 am

Pat Gelsinger Intel CEO

-Intel good results had a little extra help to be great
-New CEO commits to remaining an IDM versus fabless
-Claims of strong progress on 7NM fuel optimism inside
-Outsourcing to TSMC will not go away but will increase

A good quarter but with some silicon enhancements from ICAP

Intel reported Revenues of $20B and EPS of $1.52, which… Read More


CEO Interview: Arun Iyengar of Untether AI

CEO Interview: Arun Iyengar of Untether AI
by Daniel Nenni on 01-15-2021 at 8:00 am

Arun Iyengar Chief Executive Officer

I had a chance to catch up with Arun Iyengar, CEO of Untether AI.  Untether AI recently unveiled its tsunAImi accelerator cards powered by the company’s runAI devices. Using at-memory computation, Untether AI breaks through the barriers of traditional von Neumann architectures, offering industry-leading compute density … Read More


ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era

ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era
by Scotten Jones on 01-15-2021 at 6:00 am

Slide3

I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.

The title of the talk is “Logic Leadership in the PPAC era”.

The talk is broken up into three main sections:

  1. Background information explaining PPAC and Standard Cells.
  2. A node-by-node comparisons of companies running leading edge logic
Read More

The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More