TSMC Design Platforms Driving Next-Gen Applications

TSMC Design Platforms Driving Next-Gen Applications
by Daniel Nenni on 03-03-2017 at 7:00 am

Coming up is the 23rd annual TSMC Technology Symposium where you can get first-hand updates on advanced and specialty technologies, advanced backend capabilities, future development plans, and network with hundreds of TSMC’s customers and partners. This year the Silicon Valley event kicks off at the Santa Clara Convention… Read More


CEO Interview: Marie Semeria of LETI

CEO Interview: Marie Semeria of LETI
by Eric Esteve on 10-13-2016 at 12:00 pm

Marie Semeria of LETI

Laboratoire d’électronique des technologies de l’information (LETI) is a French research center, affiliate to the CEA (Commisariat a l’Energie Atomique). Since LETI creation in 1967, this affiliation has two consequences, the money was flowing from the deep pocket of the atomic industry to sustain advanced … Read More


ARM gets wider and more flexible in vectors

ARM gets wider and more flexible in vectors
by Don Dingee on 08-22-2016 at 4:00 pm

ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More


RISC-V opens for business with SiFive Freedom

RISC-V opens for business with SiFive Freedom
by Don Dingee on 07-11-2016 at 4:00 pm

When we talk about open source, free usually comes in the context of “freedom”, not as in “free beer”, and open IP often serves as a base layer of value add for commercialization. The creators of the RISC-V instruction set, now working at startup SiFive, have released specifications for their aptly-named Freedom processor IP cores… Read More


2.5D supply chain takes HBM over the wall

2.5D supply chain takes HBM over the wall
by Don Dingee on 04-11-2016 at 4:00 pm

SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More


TSMC OIP: What to Do With 20,000 Wafers Per Day

TSMC OIP: What to Do With 20,000 Wafers Per Day
by Paul McLellan on 09-17-2015 at 4:42 pm

Today it is TSMC’s OIP Ecosystem Innovation forum. This is an annual event but is also a semi-annual update on TSMC’s processes, investment, volume ramps and more. TSMC have changed the rules for the conference this year: they have published all the presentations by their partners/customers. Tom Quan of TSMC told… Read More