Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More


Future.HPC is Coming!

Future.HPC is Coming!
by Daniel Nenni on 05-03-2022 at 6:00 am

HPC Image Altair SemiWiki

According to the experts, the semiconductor industry is poised for a decade of growth and is projected to become a trillion dollar industry by 2030. In 2021 the semiconductor industry finally hit $600B so $1T by 2030 seems like a big ask, but not really if you look at the indicators inside the semiconductor ecosystem. Foundries, … Read More


Maximizing ASIC Performance through Post-GDSII Backend Services

Maximizing ASIC Performance through Post-GDSII Backend Services
by Kalar Rajendiran on 03-04-2021 at 6:00 am

Panel 1 Alchip – HPC ASIC Manufacturing Done Your Way 1030x579 1

ASICs by definition are designed to meet the respective applications’ requirements. ASIC engineers deploy various design techniques to maximize performance, minimize power and reduce chip size. But is there more that can be done after the GDSII is taped out? A recent press release from Alchip Technology dated Feb 4, 2021 claims… Read More


High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory

High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
by Mitch Heins on 02-07-2018 at 10:00 am


High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More


IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow

IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow
by Mitch Heins on 01-29-2018 at 12:00 pm

Until recently, ICs at bleeding edge nodes like 7nm technology from foundries like TSMC were mostly targeted for high-performance-computing (HPC) and mobile applications or possibly high radix switches that needed the increased performance of advanced nodes. The momentum of Moore’s law and Moore-than-Moore saw foundries… Read More


Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+

Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+
by Mitch Heins on 09-20-2017 at 12:00 pm

Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More


Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications

Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications
by Mitch Heins on 08-22-2017 at 12:00 pm

Calling all ASIC designers working on High-Bandwidth Memory (HBM) access architectures in high-performance computing (HPC), networking, deep learning, virtual reality, gaming, cloud computing and data center applications. You won’t want to miss this upcoming webinar focused on system integration aspects of a HBM2 ASIC… Read More