A couple months ago we heard from another vendor in a webinar on HBM and breaking through the “memory wall”. Next week Open Silicon weighs in on the topic in a webinar with partners SK Hynix and Synopsys.… Read More
Tag: hbm
2.5D supply chain takes HBM over the wall
SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More
Optimizing memory scheduling at integration-level
In our previous post on SoC memory resource planning, we shared 4 goals for a solution: optimize utilization and QoS, balance traffic across consumers and channels, eliminate performance loss from ordering dependencies, and analyze and understand tradeoffs. Let’s look at details on how Sonics is achieving this.… Read More
Bridging Design Environments for Advanced Multi-Die Package Verification
This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More
How HBM Will Change SOC Design
High Bandwidth Memory (HBM) promises to do for electronic product design what high-rise buildings did for cities. Up until now, electronic circuits have suffered from the equivalent of suburban sprawl. HBM is a radical transformation of memory architecture that will have huge ripple effects on how SOC based electronics are … Read More
Which High B/W Memory to Select after DDR4?
Once upon a time, RAM technology was the driver of the semiconductor process. DRAM products were the first to be designed on a newest technology node and DRAM was used as a process driver. It was 30 years ago and the most aggressive process nodes were ranging between 1um and 1.5 um (1 500 nm!). Then in the 1990 the Synchronous Dynamic … Read More
Full-chip Multi-domain ESD Verification
ESD stands for electro-static discharge and deals with the fact that chips have to survive in an electrically hostile environment: people, testers, assembly equipment, shipping tubes. All of these can carry electric charge that has the “potential” (ho-ho) to damage the chip irreversibly. Historically this was… Read More
Know All About ESD and Save Your Chips & Systems
In this age of electronics, especially with so many different types of human held devices and more upcoming wearable devices, it’s utmost important to protect the massive circuitry inside those tiny parts in the devices from ESD related failures. The protection needs to happen at all stages – cells inside the chips, package… Read More
Cadence white paper helps you selecting what come after DDR4
The DRAM market is shaking… In 2014, analysts predict that LPDDR4 will surpass DDR4 for the first time. When releasing DDR4 standard, JEDEC has clearly stated that the industry should not expect any DDR5. Does this means that DRAM technology new development is ending with DDR4? According with Mike Howard, principal analyst at … Read More
Intel & Ansys Enable 14nm Chip Production
In the semiconductor industry, it feels great to hear about the process technology shrinking to lower nodes along with innovative transistor structures that offer major gains in PPA (Power, Performance and Area). However, it requires huge investment of capital, time and effort from foundries to conceptualize, prototype and… Read More