Samsung’s Hot Chips 2026 presentation, “HBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,” argues that the base die beneath a High Bandwidth Memory stack is about to become far more than a communications layer. Traditionally, an HBM base die mainly connects stacked DRAM dies to a GPU, TPU, or other processor and … Read More
On Tuesday at #DAC2026 I attended the exhibitor presentation, Synopsys: How Silicon Startups are Addressing the AI Memory Gap. Vikram Bhatia from Synopsys introduced the two presentations from Wenbo Yin, SVP of IC Design at TetraMem and R. Scott Hills, VP of Business Development at ANAFLASH. Datacenters consume large amounts… Read More
Artificial intelligence performance is increasingly constrained by memory rather than arithmetic throughput. Scaling laws show that model quality improves when parameter count, training data, and compute grow together, but this balance fails when processors cannot obtain operands quickly enough. Contemporary accelerators… Read More
Micron Technology has emerged as a critical supplier in the AI compute ecosystem, leveraging its leadership in advanced DRAM, High Bandwidth Memory (HBM), and NAND flash technologies to address rapidly growing demand from hyperscale data centers and AI accelerator platforms. The company’s strategic focus on leading-edge… Read More
Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More
For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration architectures.… Read More
Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More
Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More
