Verification IP Coverage

Verification IP Coverage
by Daniel Nenni on 10-12-2020 at 6:00 am

Truechip SemiWiki 2020

I am pleased to introduce Truechip to the SemiWiki community. Truechip is a leader in the IP Verification – Design and Verification solutions market, one of the fastest growing market segments we track. Truechip has been serving customers for more than 10​ years specialization in VIP integration, customization and SOC Verification.… Read More


Webinar Replay – Designing and Verifying HBM ESD Protection Networks

Webinar Replay – Designing and Verifying HBM ESD Protection Networks
by Tom Simon on 08-03-2020 at 10:00 am

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Every chip needs ESD protection, especially RF, analog and nm designs. Because each type of design has specific needs relating to IOs, pad rings, operating voltage, process, etc. it is important that the ESD protection network is carefully tailored to the design. Also because of interactions between the design and its ESD protection… Read More


Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


Free Webinar on Verifying On-Chip ESD Protection

Free Webinar on Verifying On-Chip ESD Protection
by Tom Simon on 06-03-2020 at 6:00 am

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Walking across a carpet can generate up to 35,000 volts of static charge, which is tens of thousands of times higher than the operating voltages of most integrated circuits. When charge build up from static electricity is exposed to the pins of an IC, the electrostatic discharge (ESD) protection network on the chip is intended to… Read More


Adding CDM Protection to a Real World LNA Test Case

Adding CDM Protection to a Real World LNA Test Case
by Tom Simon on 08-06-2019 at 6:00 am

In RF designs Low Noise Amplifiers (LNA) play a critical role in system operation. They simultaneously need to be extremely sensitive and noise free, yet also must be able to withstand strong signal input without distortion. LNA designers often struggle to meet device performance specifications. Their task is further complicated… Read More


Upcoming HBM and CDM ESD Verification Seminar in Taiwan

Upcoming HBM and CDM ESD Verification Seminar in Taiwan
by Tom Simon on 06-25-2019 at 10:00 am

The electrostatic discharge that occurs in lightening, as seen in the picture below, can cause serious damage to the objects on the ground. Over centuries mankind has devised ways, such as lighting rods and arresters, to deflect the energy so it is dissipated harmlessly. The same drama plays out on modern semiconductors due to … Read More


A Practical Approach to Modeling ESD Protection Devices for Circuit Simulation

A Practical Approach to Modeling ESD Protection Devices for Circuit Simulation
by Tom Simon on 06-03-2019 at 8:00 am

Lurking inside of every Mosfet is a parasitic bipolar junction transistor (BJT). Of course, in normal circuit operation the BJT does not play a role in the device operation. Accordingly, SPICE models for Mosfets do not behave well when the BJT is triggered. However, these models work just fine for most purposes. The one important… Read More


TSMC Q3 2018 Earnings Call Discussion!

TSMC Q3 2018 Earnings Call Discussion!
by Daniel Nenni on 10-22-2018 at 7:00 am

The TSMC OIP Forum was very upbeat this year and now we know why. It wasn’t long ago that some media outlets and a competitor said 7nm would not be a popular node because it is too expensive blah blah blah. People inside the fabless semiconductor ecosystem however know otherwise. As I have said before, 7nm will be another strong node … Read More


Does the G in GDDR6 stand for Goldilocks?

Does the G in GDDR6 stand for Goldilocks?
by Tom Simon on 10-16-2018 at 12:00 pm

In the wake of TSMC’s recent Open Innovation Platform event, I spoke to Frank Ferro, Senior Director of Product Management at Rambus. His presentation on advanced memory interfaces for high-performance systems helped to shed some light on the evolution of system memory for leading edge applications. System implementers now… Read More


Machine Learning Drives Transformation of Semiconductor Design

Machine Learning Drives Transformation of Semiconductor Design
by Tom Simon on 05-14-2018 at 12:00 pm

Machine learning is transforming how information processing works and what it can accomplish. The push to design hardware and networks to support machine learning applications is affecting every aspect of the semiconductor industry. In a video recently published by Synopsys, Navraj Nandra, Sr. Director of Marketing, takes… Read More