Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements

Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements
by Kalar Rajendiran on 06-01-2021 at 6:00 am

Current GF Nodes Supporting Automotive

During the week of April 19th, Linley held its Spring Processor Conference 2021. The Linley Group has a reputation for putting on excellent conferences. And this year’s spring conference was no exception. There were a number of very informative talks from various companies updating the audience on the latest research and development… Read More


Machine Learning Applied to Increase Fab Yield

Machine Learning Applied to Increase Fab Yield
by Tom Dillinger on 05-25-2021 at 8:00 am

enhanced defect images

Machine learning applications have become pervasive and increasingly complex, from recommendation agents in online interactions to personal assistants for command response to (ultimately) autonomous vehicle control.  Yet, an often overlooked facet of machine learning technology is the deployment in industrial process… Read More


MRAM Magnetic Immunity – Empirical Study Summary

MRAM Magnetic Immunity – Empirical Study Summary
by Mads Hommelgaard on 03-28-2021 at 10:00 am

MRAM Magnetic Immunity

The main threat for the wide adoption of MRAM memories continues to be their lack of immunity to magnetic fields. MRAM magnetic immunity (MI) levels has seen significant research over the years and new data is continuously published from the main MRAM vendors.

This data, however, is rarely compared to magnetic field exposure scenarios… Read More


Foundry Fantasy- Deja Vu or IDM 2?

Foundry Fantasy- Deja Vu or IDM 2?
by Robert Maire on 03-26-2021 at 8:00 am

Foundry Profit 2020

– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0

Intel not only wants to catch TSMC but beat them at their own Read More


Intel Takes Another Shot at the Enticing Foundry Market

Intel Takes Another Shot at the Enticing Foundry Market
by Terry Daly on 03-26-2021 at 6:00 am

Intel IDM 2.0

Intel made a big splash on March 23, 2021 by doubling down on manufacturing with the creation of Intel Foundry Services (IFS). The big announcement was supported by potential customers such as Qualcomm, Cisco, Ericsson, Google, Amazon, Microsoft, and IBM. With an accompanying $20B investment, the EDA and equipment industries,… Read More


Chip Channel Check- Semi Shortage Spreading- Beyond autos-Will impact earnings

Chip Channel Check- Semi Shortage Spreading- Beyond autos-Will impact earnings
by Robert Maire on 03-07-2021 at 10:00 am

Robert Maire 2

– Semiconductor shortage is like toilet paper shortage in early Covid
– Panic buying, hoarding, double ordering will cause spike
– Could cause a year+ of dislocation in chip makers before ending
– Investors, Govt & Mgmt will get a wake up call from earnings hit

Auto industry is just a prominent tip Read More


A Perfect Storm for GLOBALFOUNDRIES

A Perfect Storm for GLOBALFOUNDRIES
by Daniel Nenni on 02-22-2021 at 6:00 am

Chuck Schumer Globalfoundries Chips

GF has played some groundbreaking roles in the semiconductor ecosystem. The spinout of the AMD fabs and the acquisition of the IBM semiconductor division just to name two. Another big one would be the GF Initial Public Offering which may come as early as 2022.

When the IPO was first mentioned during a chat with GF CEO Tom Caulfield … Read More


Technology Optimization for Magnetoresistive RAM (STT-MRAM)

Technology Optimization for Magnetoresistive RAM (STT-MRAM)
by Tom Dillinger on 01-06-2021 at 6:00 am

profile simulations

Spin-transfer torque magnetoresistive RAM (STT-MRAM) has emerged from several foundries as a very attractive IP option.  An introduction to MRAM technology from GLOBALFOUNDRIES was provided in this earlier SemiWiki article. [1]

Briefly, STT-MRAM is a non-volatile storage option with the following attractive characteristics… Read More


3DIC Design, Implementation, and (especially) Test

3DIC Design, Implementation, and (especially) Test
by Tom Dillinger on 12-20-2020 at 8:00 am

IO cell

The introduction of direct die-to-die bonding technology into high volume production has the potential to substantially affect the evolution of the microelectronics industry.  The concerns relative to the “end of Moore’s Law”, the diminishing returns of continued (monolithic) CMOS process scaling, and the disruptive effect… Read More


Analog Bits is Supplying Analog Foundation IP on the Industry’s Most Advanced FinFET Processes

Analog Bits is Supplying Analog Foundation IP on the Industry’s Most Advanced FinFET Processes
by Mike Gianfagna on 12-02-2020 at 10:00 am

Analog Bits is Supplying Analog Foundation IP on the Industrys Most Advanced FinFET Processes

The industry recently concluded a series of technology events for the all the major foundries.  Done as virtual events this year, each one provided a significant update on technology platforms, roadmaps and ecosystem partnerships. These events are quite valuable to chip design teams who need to be aware of the latest in process,… Read More