The stochastic behavior of images formed in EUV lithography has already been highlighted by a number of authors [1-3]. How serious it appears depends on the pixel size with which the photons are bunched. Generally, though, for features of around 20 nm or less, even 1 nm can have at least a +/- 15% gradient across it, which is still a
– KLA put up an excellent quarter and Guide
– Rising above the increasing tide of orders
– Confirms $75B capex in 2021 with upside
– Foundry & Logic continue to be the sweet spot for KLA
Business is very very good and getting better
-Revenues came in at $1.8B with EPS of $3.85, all above the range
-Guidance… Read More
– Business is about as good as it gets- $75B WFE in 2021?
– China remains strong at 32% despite SMIC lack of license
– NAND remains 48% of revs versus 31% foundry
– DRAM steady @ 14% – Service was record $1.3B
Strong results in a strong market
Lam reported revenues of $3.85B and EPS of $7.49 for the March… Read More
Taiwan and Korea represented 43% and 44% respectively with China at 15% and Japan and the US in the far distance.
ASML a tidal wave of orders
On the call management talked about logic potentially being up 30% in 2021 and memory being up potentially 50%. While we thing foundry/logic will clearly be on fir we think memory will lag a bit.… Read More
At the SPIE Advanced Lithography Conference in February 2021, Regina Freed of Applied Materials gave a paper: “Module-Level Material Engineering for Continued DRAM Scaling”. Applied Materials provided me with the presentation and was kind enough to set up an interview for me with Regina Freed.
I also spoke to Regina Freed last… Read More
In January I presented at the ISS conference a comparison of Intel’s, Samsung’s and TSMC’s leading edge offerings. You can read a write-up of my presentation here.
With the problems going on at Intel, that article generated a lot of interest in the investment community, and I have been holding a lot of calls with analysts who are trying… Read More
At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.
DUV
Despite all the attention EUV is getting, most layers are still… Read More
-KLAC- Solid QTR & Guide but flat 2021 outlook
-Display down & more memory mix
-KLAC has very solid Dec Qtr & guide but 2021 looks flattish
-Mix shift to memory doesn’t help- Display weakness
-Despite flat still looking at double digit growth
-EUV driven business may see some slowing from digestion
As always, … Read More
– ASML has good quarter driven by DUV & Logic (@72%)
– SMIC & other major customer slow EUV plans
– Logic (read that as TSMC) remains key demand led driver
– We are happy memory remains muted given cyclical potential
A very solid quarter with a continued road to growth
The quarter came in at Euro4,254B… Read More
For advanced lithography used to shrink semiconductor device features according to Moore’s Law, resolution limits are an obvious consideration. It is often perceived that the resolution limit is simply derived from a well-defined equation, but nothing can be further from the truth.
