ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon

ANSYS Talks About Multi Physics for Thermal Analysis at DesignCon
by Tom Simon on 01-27-2015 at 9:00 am

ANSYS makes a big deal of being a multi-physics company. Still it has taken them a while to fully integrate Apache. Nevertheless it seems like there is a compelling argument for combining technologies to solve SOC design problems. Frankly most chip designers would be hard pressed to think of a reason for using computational fluidRead More


Analyzing Power Nets

Analyzing Power Nets
by Paul McLellan on 01-21-2015 at 7:00 am

One of the big challenges in a modern SoC is doing an accurate analysis of the power nets. Different layers of metal have very different resistance characteristics (since they vary so much in width and height). Even vias can cause problems due to high resistance. Typically power is distributed globally on high-level metal layers,… Read More


Full-Chip Electromigration Analysis

Full-Chip Electromigration Analysis
by Daniel Payne on 10-10-2014 at 7:00 am

I’ll never forget debugging my first DRAM chip at Intel, peering into a microscope and watching the aluminum interconnect actually bubble and dissolve as the voltage was increased, revealing the destructive effects of Electromigration (EM) failure. That was back in 1980 using 6 um, single level metal technology, so imagine… Read More


ANSYS Tools Shine at FinFET Nodes!

ANSYS Tools Shine at FinFET Nodes!
by Pawan Fangaria on 09-30-2014 at 4:00 pm

In the modern semiconductor ecosystem we are seeing rapid advancement in technology breaking past once perceived limits; 28nm, 20nm, 16-14nm, 10nm and we are foreseeing 7nm now. Double and multi-patterning are already being seen along with complex FinFET structures in transistors to gain the ultimate advantages in PPA from… Read More


Cadence Completes Power Signoff Solution with Voltus-Fi

Cadence Completes Power Signoff Solution with Voltus-Fi
by Paul McLellan on 08-15-2014 at 7:01 am

You probably remember Cadence introduced Voltus towards the end of last year at their signoff summit. This was aimed at digital designers. Prior to that they had announced Tempus, their static timing analysis tool. More recently they announced Quantus QRC extraction. All of these tools that end in -us have been re-architected… Read More


Intel & Ansys Enable 14nm Chip Production

Intel & Ansys Enable 14nm Chip Production
by Pawan Fangaria on 06-20-2014 at 10:00 am

In the semiconductor industry, it feels great to hear about the process technology shrinking to lower nodes along with innovative transistor structures that offer major gains in PPA (Power, Performance and Area). However, it requires huge investment of capital, time and effort from foundries to conceptualize, prototype and… Read More


FinFET Based Designs Made Easy & Reliable

FinFET Based Designs Made Easy & Reliable
by Pawan Fangaria on 06-15-2014 at 11:00 am

Although semiconductor manufacturing has taken off with FinFET based process technology which provides lucrative payoffs on performance improvement, power reduction and area saving in devices for high density and high performance SoC demand of modern era, apprehensions remain about its reliability due to reduced noise … Read More


RedHawk Excels – Customers Endorse

RedHawk Excels – Customers Endorse
by Pawan Fangaria on 05-28-2014 at 11:00 am

Since a few years, I have been following up Ansys Apachetools for semiconductor design, verification and sign-off. RedHawk is the most prominent platform of tools from Ansys, specifically for Power, Noise and Reliability Sign-off. It has witnessed many open endorsements from several of Ansyscustomers through open presentations,… Read More


Mission Critical Role of Unmanned Systems – How to fulfill?

Mission Critical Role of Unmanned Systems – How to fulfill?
by Pawan Fangaria on 01-05-2014 at 11:30 am

Do we ever imagine what kind of severe challenges mission critical unmanned systems in air, land and underwater face? They are limited in space and size; have to be light in weight, flexible in different types of operations and at the same time rugged enough to work in extreme climatic conditions. That’s not enough; amidst these … Read More


How to Assure Quality of Power and SI Verification?

How to Assure Quality of Power and SI Verification?
by Pawan Fangaria on 12-08-2013 at 10:05 am

As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More