Advanced Packaging Analysis at DesignCon

Advanced Packaging Analysis at DesignCon
by Tom Dillinger on 06-07-2022 at 10:00 am

meshing

The slogan for the DesignCon conference has been “where the chip meets the board”.  Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.

The recent DesignCon… Read More


Shift left gets a modulated signal makeover

Shift left gets a modulated signal makeover
by Don Dingee on 03-31-2022 at 6:00 am

Modulated signals uncover combined effects in a shift left approach

Everyone saw Shift Left, the EDA blockbuster. Digital logic design, with perfect 1s and 0s simulated through perfect switches, shifted into a higher gear. But the dark arts – RF systems, power supplies, and high-speed digital – didn’t shift smoothly. What do these practitioners need in EDA to see more benefits from shift left? … Read More


Electromagnetic and Circuit RLCK Extraction and Simulation for Advanced Silicon, Interposers and Package Designs

Electromagnetic and Circuit RLCK Extraction and Simulation for Advanced Silicon, Interposers and Package Designs
by Tom Dillinger on 03-16-2021 at 6:00 am

spiral complex

For years, there have been rather distinct domains for the extraction of interconnect models from physical design data.

Chip designers commonly focused on RC parasitics for circuit/path delay calculations and dynamic I*R voltage drop analysis.  The annotation of extracted parasitics to a netlist model required the layout… Read More


System-level Electromagnetic Coupling Analysis is now possible, and necessary

System-level Electromagnetic Coupling Analysis is now possible, and necessary
by Tom Dillinger on 01-26-2021 at 10:00 am

FlexMesh min

With the increasing density of electronics in product enclosures, combined with a broad range of operating frequencies, designers must be cognizant of the issues associated with the radiation and coupling of electromagnetic energy.  The interference between different elements of the design may result in coupling noise-induced… Read More


HFSS – A History of Electromagnetic Simulation Innovation

HFSS – A History of Electromagnetic Simulation Innovation
by Daniel Nenni on 01-14-2021 at 10:00 am

ansys HFSS electric field distribution in coax to waveguide adapter

In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More


De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue

De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue
by Mike Gianfagna on 02-12-2020 at 6:00 am

Picture3 1

At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations.  Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More