Hello Daniel,
I am very interested on the articles on the PVT simulation, I have worked in that area in the past when I worked in process technology development and spice modeling and I also started a company called Device modeling technology (DMT) which built a Spice model library of discrete components, such as Bipolar/MOS /POWER… Read More
Wow! We always hear semiconductor companies complain about the lack of innovation amongst the EDA leaders. Placing high on the Deloitte 500 list shows that innovation is alive and well in EDA and it IS possible to have a meaningful impact regardless of your overall size. It is worth noting that there are very few EDA companies that… Read More
ISTFA
Silicon Valley is a great location for trade shows and technical conferences, so if you have an interest in test and failure analysis then don’t miss out on the 37th annual International Symposium for Testing and Failure Analysis. This year ISTFA will be held from Sunday, November 13th thru Thursday, November 17th … Read More
This was my first ARM TechCon, they cordially invited me as media, but it certainly was not what I expected. Making matters worse, I had literally just flown in from a very long weekend sailing in Mexico which was much more interesting and certainly made me much less tolerant of sales and marketing nonsense. My Uncle Jim lives on a sailboat… Read More
I’ve blogged about the Calibre family of IC design tools before:
Smart Fill replaced Dummy Fill Approach in a DFM Flow
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
There are lots of places that Apache is going to popping up in the next few weeks.
Firstly, Andrew Yang will deliver the keynote on October 24th at the Electrical Performance of Electronic Packaging and Systems (EPEPS) in San Jose. He will be talking about “Chip-Package-System convergence: bridging multiple disciplings… Read More
EDA companies and foundries must closely collaborate in order to deliver IC tool flows that work without surprises at the 40nm and 28nm nodes.
Tomorrow in San Jose you can attend this 4th annual event hosted by TSMC along with Mentor Graphics and other EDA and IP companies.
Here are some of the topics that will interest IC designers… Read More
At the TSMC Open Innovation Platform Ecosystem Forum (try saying that three times in a row) next week (on Tuesday 18th), Atrenta will present a paper on the TSMC soft IP qualification flow. It will be presented by Anuj Kumar, senior manager of the customer consulting group.
More and more, chips are not put together what we think of … Read More
In case you have not heard, the 16th Si2-hosted conference highlighting industry progress in design flow interoperability comes to Silicon Valley (Santa Clara, CA) on October 20th. Si2Con will showcase recent progress of members in the critical areas of:
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If you ask design groups what the biggest challenges are to getting a chip out on time, then the top two are usually verification, and getting closure after physical design. Not just timing closure, but power and area. One of the big drivers of this is predicting and avoiding excessive routing congestion, which is something that … Read More
