SemiWiki and Mentor Graphics Seminar Series!

SemiWiki and Mentor Graphics Seminar Series!
by Daniel Nenni on 01-28-2012 at 10:49 am

For the greater good of the semiconductor ecosystem, SemiWiki and Mentor Graphics present SemiWiki Seminars, a free seminar and software demonstration series addressing the latest innovations in IC design. SemiWiki Seminars discuss interesting new challenges and potential solutions aimed at increased circuit density … Read More


The Semiconductor Landscape In A Few Years?

The Semiconductor Landscape In A Few Years?
by Daniel Nenni on 01-25-2012 at 9:48 am

Looking at the huge gap between the revenue of semiconductor design and manufacturing (~$300B) and that of EDA tools, services and silicon IP combined (~6B) inspired me to look more deeply into the overall arena of semiconductors in today’s context and possibly decipher some trends which should emerge in near future. Although… Read More


Advanced Memory Cell Characterization with Calibre xACT 3D

Advanced Memory Cell Characterization with Calibre xACT 3D
by SStalnaker on 01-12-2012 at 7:18 pm

Advanced process technologies for manufacturing computer chips enable more functionality, higher performance, and low power through smaller sizes. Memory bits on a chip are predicted to double every two years to keep up with the demand for increased performance.

To meet these new requirements for performance and power, memory… Read More


VLSI 2012 in Hyderabad

VLSI 2012 in Hyderabad
by Paul McLellan on 01-06-2012 at 3:59 pm

Atrenta will be on a panel session at VLSI 2012 next week in Hyderabad in the center of India. Since I had a development group there over a decade ago this is actually one of the few cities in India that I have visited. Beautiful but very hot at the time I was there.

Atrenta will be represented by Sathyam Pattanam the director of engineering… Read More


What Will 2012 Bring The Semiconductor Ecosystem?

What Will 2012 Bring The Semiconductor Ecosystem?
by Daniel Nenni on 12-18-2011 at 4:30 pm

During my annual holiday meal with one of my favorite EDA icons some rather bold predictions were made. On his side it was more of what he would LIKE to see happen, on my side it was more of what will HAVE to happen for the semiconductor ecosystem to thrive in the coming years.

Mike Gianfagna (Viva Italia!) spent 15+ years with RCA/GE Semiconductor… Read More


iLVS: Improving LVS Usability at Advanced Nodes

iLVS: Improving LVS Usability at Advanced Nodes
by glforte on 12-13-2011 at 4:54 pm

LVS Challenges at Advanced Nodes

Accurate, comprehensive device recognition, connectivity extraction, netlist generation and, ultimately, circuit comparison becomes more complex with each new process generation. As the number of layers and layer derivations increases the complexity of devices, especially Layout Dependent… Read More


Synopsys Eats Magma: What Really Happened with Winners and Losers!

Synopsys Eats Magma: What Really Happened with Winners and Losers!
by Daniel Nenni on 12-10-2011 at 6:00 pm

Conspiracy theories abound! The inside story of the Synopsys (SNPS) acquisition of Magma (LAVA) brings us back to the 1990’s tech boom with shady investment bankers and pump/dump schemes. After scanning my memory banks and digging around Silicon Valley for skeletons with a backhoe here is what I found out:

The Commission… Read More


Atrenta’s users. Survey says….

Atrenta’s users. Survey says….
by Paul McLellan on 12-09-2011 at 7:32 pm

Atrenta did an online survey of their users. Of course Atrenta’s users are not necessarily completely representative of the whole marketplace so it is unclear how the results would generalize for the bigger picture, your mileage may vary. About half the people were design engineers, a quarter CAD engineers and the rest … Read More


Challenges in 3D-IC and 2½D Design

Challenges in 3D-IC and 2½D Design
by Paul McLellan on 12-09-2011 at 5:18 pm

3D IC design and what has come to be known as 2½D IC design, with active die on a silicon interposer, require new approaches to verification since the through silicon vias (TSVs) and the fact that several different semiconductor processes may be involved create a new set of design challenges

The power delivery network is a challenge… Read More