Synopsys: now in 3D

Synopsys: now in 3D
by Paul McLellan on 03-26-2012 at 8:00 am

And no red and green glasses required.

I remember the first time I heard about a Through Silicon Via (TSV), punching a hole through the entire wafer to make an electrical connection at the back, like we do all the time in printed circuit boards with through plated holes. I thought someone was trying one on and trying to make me look a fool.… Read More


EDPS Monterey

EDPS Monterey
by Paul McLellan on 03-17-2012 at 8:00 am

Every year in Monterey is a relatively small conference that looks at the design process, EDPS, the electronic design process symposium. I gave a keynote there a couple of years ago, but you don’t have to listen to me this time. The keynotes are from:

  • 1st day: Misha Buric, CTO of Altera, talking about SoC FPGAs and other things
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More Growth in EDA

More Growth in EDA
by Daniel Payne on 03-12-2012 at 6:53 pm

I love to read good news about growth in EDA especially when our industry has seen single-digit growth for several years now. What I read on March 8th from ClioSoft stated a 53% increase in bookings for 2011, now that’s what I call growth.

ClioSoft provides Hardware Configuration Management (HCM) software to EDA users typically… Read More


Common Platform Technology Forum: Peering into the Future

Common Platform Technology Forum: Peering into the Future
by Paul McLellan on 03-10-2012 at 9:00 am

Next Wednesday is the Common Platform Technology Forum. “Common Platform” is a name that only a committee could have come up with, giving no clue as to what it actually is. As you probably know, there are various process clubs sharing the costs of technology development (TD) and one of them consists of IBM, Samsung and… Read More


Not me. Who owns IP quality?

Not me. Who owns IP quality?
by Paul McLellan on 03-05-2012 at 4:32 pm

Now that the dominant approach to building an SoC is to get IP from a number of sources and assemble it into a chip, the issue of IP quality is more and more critical. A chip won’t work if the IP doesn’t work, but it is quite difficult to verify this because the SoC design team is not intimately familiar with the IP blocks since… Read More


CEO Forecast Panel

CEO Forecast Panel
by Paul McLellan on 03-02-2012 at 2:40 pm

This year’s CEO forecast panel was held at Silicon Valley Bank. Bankers live better than verification engineers, as if you didn’t know, based on the quality of the wine they were serving compared to DVCon.

This year the panelists were Ed Cheng from Gradient, Lip-Bu, Aart and Wally (and if you don’t know who they… Read More


Farm Management

Farm Management
by Paul McLellan on 03-01-2012 at 5:34 pm

Every so often I come across a new company in EDA or one of its neighboring domains, new to me anyway, and new to SemiWiki. One such company is RunTime Design Automation (RTDA). They provide a suite of tools for managing server farms (or internal clouds which seems to be the trendy buzzword du jour). Running a few EDA scripts on a few servers… Read More


3D-IC Physical Design

3D-IC Physical Design
by Pawan Fangaria on 02-22-2012 at 10:00 am

When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More


Pinpoint: Getting Control of Design Data

Pinpoint: Getting Control of Design Data
by Paul McLellan on 02-20-2012 at 5:39 pm

Back in the Napoleonic era it was possible to manage a battle with very ad hoc methods. Sit on a horse on top of the highest hill and watch the battle unfold, send messengers out with instructions. By the First World War, never mind the second, that approach was hopelessly outdated and a much more structured way of managing a battle was… Read More