Selectively automating non-critical aspects of custom IC design allows engineers to focus on precision-crafting their designs. Cadence circuit design solutions enable fast and accurate entry of design concepts, which includes managing design intent in a way that flows naturally in the schematic. Using this advanced, parasitic-aware… Read More
An informal survey of RTDA customers reveals that larger companies tend to buy licenses based on peak usage while smaller companies do not have that luxury and have to settle for fewer licenses than they would ideally have and optimize the mix of licenses that they can afford given their budget. Larger companies get better prices… Read More
At Intel we used to hand-craft every single transistor size to eek out the ultimate in IC performance for DRAM and graphic chips. Today, there are many libraries that you can choose from for an SoC design in order to reach your power, speed and area trade-offs. I’m going to attend a Synopsys webinar on August 2nd to learn more … Read More
GlobalFoundries did a nice response to my “How has 20nm Changed the Semiconductor Ecosystem?” and redefined the word collaboration. Our industry is plagued with sound bites and acronyms so let us agree on a semiconductor ecosystem definition of collaboration.
Mojy Chianis senior vice president, design enablement at… Read More
Electronics markets bounced back strongly in 2010 from the 2008-2009 recession. The recovery stalled in 2011 as a series of natural and human-made disasters hit various parts of the world. Japan was hit by an earthquake and tsunami in March 2011. Thailand was affected by floods which disrupted HDD production and thus impacted … Read More
The press has been buzzing about 3D everything for the past few years, so when it comes to IC design it’s a fair question to ask how would you actually extract 3D IC structures for use by analysis tools like a circuit simulator. I read a white paper by Christen Decoin and Vassilis Kourkoulos of Mentor Graphics this week and became… Read More
EDAC announced that EDA industry revenue increased 6.3% for Q1 2012 to $1536.9M compared to a year ago. Sequentially it declined, as it normally does from Q4 to Q1, by 9.6%. Every category except services increased revenue and every region increased revenue except for Japan. The full report is available by subscription, of course.… Read More
Have you seen the latest design rule manuals? At 28nm and 20nm design sign-off is no longer just DRC and LVS. These basic components of physical verification are being augmented by an expansive set of yield analysis and critical feature identification capabilities, as well as layout enhancements, printability, and performance… Read More
Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More
Last month at DAC I learned how IBM, Cadence, ARM, GLOBALFOUNDRIES and Samsung approach the challenges of SoC design, EDA design and fabrication at the 20nm node. Today I followed up by reading a white paper on 20nm IC design challenges authored by Cadence, a welcome relief to the previous marketing mantra of EDA 360.
Here’s… Read More
